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1. 发明授权

US10717236B2 Curing a heat-curable material in an embedded curing zone 有权
公开(公告)号：US10717236B2
公开(公告)日：2020-07-21
申请号：US14650084
申请日：2013-12-17
申请人： Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO , Henkel AG & Co. KGaA
发明人： Jeroen van den Brand , Ashok Sridhar , Anja Henckens , Gunther Dreezen
IPC分类号： B29C65/14 , H01L23/00 , B29C65/22 , B29C65/24 , B29C65/48 , H05B3/00 , B29K101/10 , B29L9/00
摘要： The present disclosure relates to a method for curing a heat-curable material (1) in an embedded curing zone (2) and an assembly resulting from such method. The method comprises providing a heat-conducting strip (3) partially arranged between a component (9) and a substrate (10) that form the embedded curing zone (2) therein between. The heat-conducting strip (3) extends from the embedded curing zone (2) to a radiation-accessible zone (7) that is distanced from the embedded curing zone (2) and at least partially free of the component (9) and the substrate (10). The method further comprises irradiating the heat-conducting strip (3) in the radiation-accessible zone (7) by means of electromagnetic radiation (6). Heat (4a) generated by absorption of the electromagnetic radiation (6) in the heat-conducting strip (3) is conducted from the radiation-accessible zone (7) along a length of the heat-conducting strip (3) to the embedded curing zone (2) to cure the heat-curable material (1) by conducted heat (4b) emanating from the heat-conducting strip (3) into the embedded curing zone (2).

2. 发明授权

US11078722B2 Variable length screen, system comprising the same and method for manufacturing 有权
公开(公告)号：US11078722B2
公开(公告)日：2021-08-03
申请号：US16063002
申请日：2016-12-16
申请人： Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
发明人： Johannes Andreas Maria Ammerlaan , Hieronymus Antonius Josephus Maria Andriessen , Gerardus Titus van Heck , Jeroen van den Brand , Harmannus Franciscus Maria Schoo
IPC分类号： E06B9/262 , E06B9/24 , E06B9/386 , E04F10/02
摘要： A screen (1) is provided comprising at least a first and a second elongate guidance element (27, 28) extending in a first direction (D1) and a structured foil (10) with a front surface and a back surface, having a variable length (L) in a first direction (D1) carried by the elongate guidance elements. The screen has slat shaped portions (11a1+11a2, 11b1+11b2) and connection portions (12ab, 2ab′) bridging the slat shaped portions. The slat shaped portions, which extend in a second direction (D2) transverse to the first direction are provided with photovoltaic elements (20) that are connectable to external terminals for supply of electric energy. The slate shaped portions are slidably coupled with the guidance elements, to allow them to slide in said first direction along said guidance elements. The connection portions are configured to flex in a direction transverse to the first and the second direction, so as to allow the at least a first and a second slat shaped portion to shift relative to each other in said first direction.

3. 发明申请

US20180363366A1 VARIABLE LENGTH SCREEN, SYSTEM COMPRISING THE SAME AND METHOD FOR MANUFACTURING 审中-公开
公开(公告)号：US20180363366A1
公开(公告)日：2018-12-20
申请号：US16063002
申请日：2016-12-16
申请人： Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO
发明人： Johannes Andreas Maria Ammerlaan , Hieronymus Antonius Josephus r Andriessen , Gerardus Titus van Heck , Jeroen van den Brand , Harmannus Franciscus Maria Schoo
IPC分类号： E06B9/262 , E06B9/386 , E04F10/02
摘要： A screen (1) is provided comprising at least a first and a second elongate guidance element (27, 28) extending in a first direction (D1) and a structured foil (10) with a front surface and a back surface, having a variable length (L) in a first direction (D1) carried by the elongate guidance elements. The screen has slat shaped portions (11a1+11a2, 11b1+11b2) and connection portions (12ab, 2ab′) bridging the slat shaped portions. The slat shaped portions, which extend in a second direction (D2) transverse to the first direction are provided with photovoltaic elements (20) that are connectable to external terminals for supply of electric energy. The slate shaped portions are slidably coupled with the guidance elements, to allow them to slide in said first direction along said guidance elements. The connection portions are configured to flex in a direction transverse to the first and the second direction, so as to allow the at least a first and a second slat shaped portion to shift relative to each other in said first direction.

4. 发明申请

US20190027461A1 APPARATUS AND METHOD FOR SOLDERING A PLURALITY OF CHIPS USING A FLASH LAMP AND A MASK 审中-公开
公开(公告)号：US20190027461A1
公开(公告)日：2019-01-24
申请号：US15570036
申请日：2016-04-26
申请人： Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
发明人： Gari Arutinov , Edsger Constant Pieter Smits , Jeroen van den Brand
IPC分类号： H01L23/00 , H01L21/683 , H05K3/34
摘要： A substrate (3) and two or more different chips (1a, 1b) having different heating properties (e.g. caused by different dimensions (surface area and/or thickness), heat capacity (C1, C2), absorptivity, conductivity, number and/or size of solder bonds) are provided. A solder material (2) is disposed between the chips (1a, 1b) and the substrate (3). A flash lamp (5) generates a light pulse (6) for heating the chips (1a, 1b), wherein the solder material (2) is at least partially melted by contact with the heated chips (1a, 1b). A masking device (7) is disposed between the flash lamp (5) and the chips (1a, 1b) causing different light intensities (1a, 1b) in different areas (6a, 6b) of the light pulse (6) passing the masking device (7), thereby heating the chips (1a, 1b) with different light intensities (1a, 1b). This may compensate the different heating properties to reduce a spread in temperature between the chips (1a, 1b) as a result of the heating by the light pulse (6). The chips (1a, 1b) may be releasably carried by a chip carrier disposed between the flash lamp (5) and the substrate (3) before being positioned on the substrate (3), wherein the light (6a, 6b) of the light pulse (6) transmitted by the masking device (7) is projected onto the chips (1a, 1b) held by the chip carrier for heating the chips (1a, 1b), releasing them from the chip carrier and transferring them to the substrate (3), wherein the heated chips (1a, 1b) cause melting of the solder material (2) between the chips (1a, 1b) and the substrate (3) for attaching the chips (1a, 1b) to the substrate (3).

5. 发明申请

US20150367560A1 CURING A HEAT-CURABLE MATERIAL IN AN EMBEDDED CURING ZONE 审中-公开
标题翻译：在嵌入式固化区内固化热固性材料
公开(公告)号：US20150367560A1
公开(公告)日：2015-12-24
申请号：US14650084
申请日：2013-12-17
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO , HENKEL AG & CO. KGAA
发明人： Jeroen van den Brand , Ashok Sridhar , Anja Henckens , Gunther Dreezen
IPC分类号： B29C65/14 , H05B3/00 , B29C65/48 , B29C65/22 , B29C65/24
摘要： The present disclosure relates to a method for curing a heat-curable material (1) in an embedded curing zone (2) and an assembly resulting from such method. The method comprises providing a heat-conducting strip (3) partially arranged between a component (9) and a substrate (10) that form the embedded curing zone (2) therein between. The heat-conducting strip (3) extends from the embedded curing zone (2) to a radiation-accessible zone (7) that is distanced from the embedded curing zone (2) and at least partially free of the component (9) and the substrate (10). The method further comprises irradiating the heat-conducting strip (3) in the radiation-accessible zone (7) by means of electromagnetic radiation (6). Heat (4a) generated by absorption of the electromagnetic radiation (6) in the heat-conducting strip (3) is conducted from the radiation-accessible zone (7) along a length of the heat-conducting strip (3) to the embedded curing zone (2) to cure the heat-curable material (1) by conducted heat (4b) emanating from the heat-conducting strip (3) into the embedded curing zone (2).
摘要翻译：本公开涉及一种用于固化嵌入固化区（2）中的可热固化材料（1）的方法和由该方法得到的组合物。该方法包括提供部分地布置在组件（9）和衬底（10）之间的导热条（3），所述基底（10）在其间形成嵌入的固化区（2）。导热条（3）从嵌入的固化区（2）延伸到远离嵌入的固化区（2）并且至少部分地不含组分（9）的辐射可接近区（7）和基板（10）。该方法还包括通过电磁辐射（6）照射辐射可接近区域（7）中的导热条带（3）。通过吸收导热带（3）中的电磁辐射（6）产生的热（4a）从辐射可接近区（7）沿导热带（3）的长度传导到嵌入固化（2）通过从导热带（3）发射到嵌入的固化区（2）中的传热（4b）来固化可热固化材料（1）。

6. 发明申请

US20150008474A1 OPTO-ELECTRIC DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译： OPTO-ELECTRIC DEVICE AND METHOD FOR MANUIFACTTING THE SAME
公开(公告)号：US20150008474A1
公开(公告)日：2015-01-08
申请号：US14378944
申请日：2013-02-15
申请人： Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
发明人： Jeroen van den Brand , Joanne Sarah Wilson , Antonius Maria Bernardus van Mol , Dorothee Christine Hermes , Edward Willem Albert Young
IPC分类号： H01L51/52 , H01L33/62 , H01L51/56
CPC分类号： H01L51/5256 , H01L33/62 , H01L51/5203 , H01L51/5212 , H01L51/5228 , H01L51/5234 , H01L51/5271 , H01L51/56
摘要： An opto-electric device includes an opto-electric layer structure having an anode and a cathode layer and an opto-electric layer arranged between the anode and cathode layers, and having a light-transmission side. A dual electrically conductive layer structure is arranged at a side of the opto-electric layer structure opposite the light-transmission side, the dual electrically conductive layer structure having a first and a second electrically conductive layer mutually insulated by a first electrically insulating layer. A second electrically insulating layer is arranged between the light emitting layer structure and the dual electrically conductive layer structure, wherein the first electrically conductive layer is electrically connected by at least a first transverse electrical conductor with the anode layer and the second electrically conductive layer is electrically connected by at least a second transverse electrical conductor with the cathode layer.
摘要翻译：光电器件包括具有阳极和阴极层的光电层结构以及布置在阳极和阴极层之间的光电层，并且具有光透射侧。双重导电层结构布置在与光透射侧相对的光电层结构的一侧，双重导电层结构具有由第一电绝缘层相互绝缘的第一和第二导电层。第二电绝缘层被布置在发光层结构和双重导电层结构之间，其中第一导电层通过至少第一横向电导体与阳极层电连接，第二导电层电连接通过至少第二横向电导体与阴极层连接。

7. 发明授权

US11476228B2 Method and system for bonding a chip to a substrate 有权
公开(公告)号：US11476228B2
公开(公告)日：2022-10-18
申请号：US16320180
申请日：2017-07-25
申请人： Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
发明人： Gari Arutinov , Edsger Constant Pieter Smits , Jeroen van den Brand
IPC分类号： B23K1/00 , H01L23/00 , H05K3/34 , B23K1/005 , B23K1/20 , H01L21/67 , H01L23/498 , H01L33/62 , B23K101/42
摘要： A method and system for heat bonding a chip to a substrate by means of heat bonding material disposed there between. At least the substrate is preheated from an initial temperature to an elevated temperature below a damage temperature of the substrate. A light pulse applied to the chip momentarily increases the chip temperature to a pulsed peak temperature below a peak damage temperature of the chip. The momentarily increased pulsed peak temperature of the chip causes a flow of conducted heat from the chip to the bonding material, causing the bonding material to form a bond.

8. 发明申请

US20190229085A1 METHOD AND SYSTEM FOR BONDING A CHIP TO A SUBSTRATE 审中-公开
公开(公告)号：US20190229085A1
公开(公告)日：2019-07-25
申请号：US16320180
申请日：2017-07-25
申请人： Nederlandse Organisatie voor Toegepast- natuurwetenschappelijk onderzoek TNO
发明人： Gari Arutinov , Edsger Constant Pieter Smits , Jeroen van den Brand
IPC分类号： H01L23/00 , H01L23/498 , H05K3/34 , H01L21/67 , H01L33/62 , B23K1/005 , B23K1/20
摘要： A method and system for heat bonding a chip to a substrate by means of heat bonding material disposed there between. At least the substrate is preheated from an initial temperature to an elevated temperature below a damage temperature of the substrate. A light pulse applied to the chip momentarily increases the chip temperature to a pulsed peak temperature below a peak damage temperature of the chip. The momentarily increased pulsed peak temperature of the chip causes a flow of conducted heat from the chip to the bonding material, causing the bonding material to form a bond.

9. 发明授权

US10304797B2 Apparatus and method for soldering a plurality of chips using a flash lamp and a mask 有权
公开(公告)号：US10304797B2
公开(公告)日：2019-05-28
申请号：US15570036
申请日：2016-04-26
申请人： Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
发明人： Gari Arutinov , Edsger Constant Pieter Smits , Jeroen van den Brand
IPC分类号： H01L23/00 , H05K3/34 , H01L21/683
摘要： An apparatus and method for soldering chips to a substrate. A substrate and two or more different chips having different heating properties are provided. A solder material is disposed between the chips and the substrate. A flash lamp generates a light pulse for heating the chips, wherein the solder material is at least partially melted by contact with the heated chips. A masking device is disposed between the flash lamp and the chips causing different light intensities in different areas of the light pulse passing the masking device thereby heating the chips with different light intensities. This may compensate the different heating properties to reduce a spread in temperature between the chips as a result of the heating by the light pulse.

10. 发明授权

US09450205B2 Opto-electric device and method for manufacturing the same 有权
标题翻译：光电装置及其制造方法
公开(公告)号：US09450205B2
公开(公告)日：2016-09-20
申请号：US14378944
申请日：2013-02-15
申请人： Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
发明人： Jeroen van den Brand , Joanne Sarah Wilson , Antonius Maria Bernardus van Mol , Dorothee Christine Hermes , Edward Willem Albert Young
IPC分类号： H01L51/52 , H01L51/50 , H01L33/62 , H01L51/56
CPC分类号： H01L51/5256 , H01L33/62 , H01L51/5203 , H01L51/5212 , H01L51/5228 , H01L51/5234 , H01L51/5271 , H01L51/56
摘要： An opto-electric device includes an opto-electric layer structure having an anode and a cathode layer and an opto-electric layer arranged between the anode and cathode layers, and having a light-transmission side. A dual electrically conductive layer structure is arranged at a side of the opto-electric layer structure opposite the light-transmission side, the dual electrically conductive layer structure having a first and a second electrically conductive layer mutually insulated by a first electrically insulating layer. A second electrically insulating layer is arranged between the light emitting layer structure and the dual electrically conductive layer structure, wherein the first electrically conductive layer is electrically connected by at least a first transverse electrical conductor with the anode layer and the second electrically conductive layer is electrically connected by at least a second transverse electrical conductor with the cathode layer.
摘要翻译：光电器件包括具有阳极和阴极层的光电层结构以及布置在阳极和阴极层之间的光电层，并且具有光透射侧。双重导电层结构布置在与光透射侧相对的光电层结构的一侧，双重导电层结构具有由第一电绝缘层相互绝缘的第一和第二导电层。第二电绝缘层被布置在发光层结构和双重导电层结构之间，其中第一导电层通过至少第一横向电导体与阳极层电连接，第二导电层电连接通过至少第二横向电导体与阴极层连接。

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