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1. 发明授权

US08324529B2 Laser machining device with a converged laser beam and laser machining method 有权
标题翻译：激光加工装置采用融合激光束和激光加工方法
公开(公告)号：US08324529B2
公开(公告)日：2012-12-04
申请号：US12742491
申请日：2008-08-26
申请人： Naoya Matsumoto , Takashi Inoue , Norihiro Fukuchi , Haruyasu Ito , Yuu Takiguchi
发明人： Naoya Matsumoto , Takashi Inoue , Norihiro Fukuchi , Haruyasu Ito , Yuu Takiguchi
IPC分类号： B23K26/00 , B23K26/14 , B23K26/16 , B23K26/06 , B23K26/02
CPC分类号： B23K26/00 , B23K26/06 , B23K26/0624 , B23K26/064 , B23K26/0661 , B23K26/067 , B23K26/355 , G03H1/2294 , G03H2001/0094 , G03H2225/32
摘要： A laser machining device 1 includes a laser light source 10, a spatial light modulator 20, a controller 22, a converging optical system 30, and a shielding member 40. The phase-modulating spatial light modulator 20 inputs a laser beam outputted from the laser light source 10, displays a hologram modulating a phase of the laser beam at each of a plurality of pixels arranged two-dimensionally, and outputs the phase-modulated laser beam. The controller 22 causes the spatial light modulator 20 to display a plurality of holograms sequentially, lets the converging optical system 30 converge the laser beam outputted from the spatial light modulator 20 at converging positions having a fixed number of M, selectively places N converging positions out of the M converging positions into a machining region 91, and machines an object to be machined 90.
摘要翻译：激光加工装置1包括激光源10，空间光调制器20，控制器22，会聚光学系统30和屏蔽构件40.相位调制用空间光调制器20输入从激光器输出的激光束光源10显示调制在二维排列的多个像素中的每一个处的激光束的相位的全息图，并输出相位调制的激光束。控制器22使空间光调制器20依次显示多个全息图，使会聚光学系统30将从空间光调制器20输出的激光束会聚在具有固定数量的M的会聚位置，选择性地将N个收敛位置放出的M个会聚位置进入加工区域91，并且对要加工的物体进行加工90。

2. 发明申请

US20100270277A1 LASER MACHINING DEVICE AND LASER MACHINING METHOD 有权
标题翻译：激光加工设备和激光加工方法
公开(公告)号：US20100270277A1
公开(公告)日：2010-10-28
申请号：US12742491
申请日：2008-08-26
申请人： Naoya Matsumoto , Takashi Inoue , Norihiro Fukuchi , Haruyasu Ito , Yuu Takiguchi
发明人： Naoya Matsumoto , Takashi Inoue , Norihiro Fukuchi , Haruyasu Ito , Yuu Takiguchi
IPC分类号： B23K26/00
CPC分类号： B23K26/00 , B23K26/06 , B23K26/0624 , B23K26/064 , B23K26/0661 , B23K26/067 , B23K26/355 , G03H1/2294 , G03H2001/0094 , G03H2225/32
摘要： A laser machining device 1 comprises a laser light source 10, a spatial light modulator 20, a controller 22, a converging optical system 30, and a shielding member 40. The phase-modulating spatial light modulator 20 inputs a laser beam outputted from the laser light source 10, displays a hologram modulating a phase of the laser beam at each of a plurality of pixels arranged two-dimensionally, and outputs the phase-modulated laser beam. The controller 22 causes the spatial light modulator 20 to display a plurality of holograms sequentially, lets the converging optical system 30 converge the laser beam outputted from the spatial light modulator 20 at converging positions having a fixed number of M, selectively places N converging positions out of the M converging positions into a machining region 91, and machines an object to be machined 90.
摘要翻译：激光加工装置1包括激光源10，空间光调制器20，控制器22，会聚光学系统30和屏蔽构件40.相位调制空间光调制器20输入从激光器输出的激光束光源10显示调制在二维排列的多个像素中的每一个处的激光束的相位的全息图，并输出相位调制的激光束。控制器22使空间光调制器20依次显示多个全息图，使会聚光学系统30将从空间光调制器20输出的激光束会聚在具有固定数量的M的会聚位置，选择性地将N个收敛位置放出的M个会聚位置进入加工区域91，并且对要加工的物体进行加工90。

3. 发明申请

US20100079832A1 LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD 有权
标题翻译：激光加工设备和激光加工方法
公开(公告)号：US20100079832A1
公开(公告)日：2010-04-01
申请号：US12566143
申请日：2009-09-24
申请人： Yuu TAKIGUCHI , Naoya Matsumoto , Norihiro Fukuchi , Takashi Inoue , Tamiki Takemori , Naohisa Mukozaka
发明人： Yuu TAKIGUCHI , Naoya Matsumoto , Norihiro Fukuchi , Takashi Inoue , Tamiki Takemori , Naohisa Mukozaka
IPC分类号： G03H1/08 , G02B5/32
CPC分类号： H01S3/0085 , B23K26/06 , B23K26/352 , G02B3/08 , G02B5/32 , G02B13/22 , G03H1/0005 , G03H1/08 , G03H1/0808 , G03H1/2294 , G03H2001/0094 , G03H2225/32
摘要： A laser processing apparatus 1 includes a laser light source 10, a phase modulation type spatial light modulator 20, a driving unit 21, a control unit 22, and an imaging optical system 30. The imaging optical system 30 may be a telecentric optical system. A storage unit 21A included in the driving unit stores a plurality of basic holograms corresponding to a plurality of basic processing patterns and a focusing hologram corresponding to a Fresnel lens pattern. The control unit 22 arranges in parallel two or more basic holograms selected from the plurality of basic holograms stored in the storage unit 21A, overlaps the focusing hologram with each of the basic holograms arranged in parallel to form the whole hologram, and presents the formed whole hologram to the spatial light modulator 20.
摘要翻译：激光处理装置1包括激光源10，相位调制型空间光调制器20，驱动单元21，控制单元22和成像光学系统30.成像光学系统30可以是远心光学系统。包括在驱动单元中的存储单元21A存储对应于多个基本处理模式的多个基本全息图和对应于菲涅耳透镜图案的聚焦全息图。控制单元22平行地布置从存储在存储单元21A中的多个基本全息图中选择的两个或更多个基本全息图，与聚焦全息图重叠，每个基本全息图平行布置以形成整个全息图，并呈现形成的整体全息图到空间光调制器20。

4. 发明授权

US08957349B2 Laser machining device and laser machining method 有权
标题翻译：激光加工装置和激光加工方法
公开(公告)号：US08957349B2
公开(公告)日：2015-02-17
申请号：US12496249
申请日：2009-07-01
申请人： Naoya Matsumoto , Norihiro Fukuchi , Naohisa Mukozaka , Takashi Inoue , Yuu Takiguchi
发明人： Naoya Matsumoto , Norihiro Fukuchi , Naohisa Mukozaka , Takashi Inoue , Yuu Takiguchi
IPC分类号： B23K26/00 , B41J2/44 , B23K26/06 , B41J2/465 , G02B26/06 , G02B27/42 , G03H1/00 , G03H1/08 , B41M5/24 , G03H1/02 , G03H1/22
CPC分类号： B41J2/442 , B23K26/066 , B41J2/465 , B41M5/24 , G02B26/06 , G02B27/42 , G02B27/4244 , G02B27/425 , G03H1/0005 , G03H1/0236 , G03H1/08 , G03H1/0808 , G03H1/2286 , G03H1/2294 , G03H2001/0094 , G03H2001/0816 , G03H2001/2218 , G03H2210/52 , G03H2225/32 , G03H2240/51 , G03H2240/53
摘要： A laser machining device is provided with a laser light source, a spatial light modulator, a driving unit, a control unit, and a condensing optical system. The control unit selects a basic hologram corresponding to each basic machining pattern included in a whole machining pattern in a workpiece from a plurality of basic holograms stored by the storage unit, and determines a display region of the basic hologram in the spatial light modulator so that the deviation of the value of “Iη/n” becomes small for the selected respective basic hologram when the intensity of a laser beam input to a display region of the basic hologram in the spatial light modulator is defined as I, the diffraction efficiency of the laser beam in the basic hologram is defined as η, and the number of condensing points in a basic machining pattern corresponding to the basic hologram is defined as n.
摘要翻译：激光加工装置设置有激光光源，空间光调制器，驱动单元，控制单元和聚光光学系统。控制单元从由存储单元存储的多个基本全息图中选择对应于工件中的整个加工图案中包括的每个基本加工图案的基本全息图，并且确定空间光调制器中的基本全息图的显示区域，使得当输入到空间光调制器中的基本全息图的显示区域的激光束的强度被定义为I时，对于所选择的各个基本全息图，“I＆eegr / / n”的值的偏差变小，基本全息图中的激光束被定义为＆eegr，并且与基本全息图对应的基本加工图案中的聚光点的数量被定义为n。

5. 发明授权

US08482829B2 Laser processing apparatus and laser processing method 有权
标题翻译：激光加工设备和激光加工方法
公开(公告)号：US08482829B2
公开(公告)日：2013-07-09
申请号：US12566143
申请日：2009-09-24
申请人： Yuu Takiguchi , Naoya Matsumoto , Norihiro Fukuchi , Takashi Inoue , Tamiki Takemori , Naohisa Mukozaka
发明人： Yuu Takiguchi , Naoya Matsumoto , Norihiro Fukuchi , Takashi Inoue , Tamiki Takemori , Naohisa Mukozaka
IPC分类号： G03H1/08
CPC分类号： H01S3/0085 , B23K26/06 , B23K26/352 , G02B3/08 , G02B5/32 , G02B13/22 , G03H1/0005 , G03H1/08 , G03H1/0808 , G03H1/2294 , G03H2001/0094 , G03H2225/32
摘要： A laser processing apparatus 1 includes a laser light source 10, a phase modulation type spatial light modulator 20, a driving unit 21, a control unit 22, and an imaging optical system 30. The imaging optical system 30 may be a telecentric optical system. A storage unit 21A included in the driving unit stores a plurality of basic holograms corresponding to a plurality of basic processing patterns and a focusing hologram corresponding to a Fresnel lens pattern. The control unit 22 arranges in parallel two or more basic holograms selected from the plurality of basic holograms stored in the storage unit 21A, overlaps the focusing hologram with each of the basic holograms arranged in parallel to form the whole hologram, and presents the formed whole hologram to the spatial light modulator 20.
摘要翻译：激光处理装置1包括激光源10，相位调制型空间光调制器20，驱动单元21，控制单元22和成像光学系统30.成像光学系统30可以是远心光学系统。包括在驱动单元中的存储单元21A存储对应于多个基本处理模式的多个基本全息图和对应于菲涅耳透镜图案的聚焦全息图。控制单元22平行地布置从存储在存储单元21A中的多个基本全息图中选择的两个或更多个基本全息图，与聚焦全息图重叠，每个基本全息图平行布置以形成整个全息图，并呈现形成的整体全息图到空间光调制器20。

6. 发明申请

US20100000978A1 LASER MACHINING DEVICE AND LASER MACHINING METHOD 有权
标题翻译：激光加工设备和激光加工方法
公开(公告)号：US20100000978A1
公开(公告)日：2010-01-07
申请号：US12496249
申请日：2009-07-01
申请人： Naoya MATSUMOTO , Norihiro Fukuchi , Naohisa Mukozaka , Takashi Inoue , Yuu Takiguchi
发明人： Naoya MATSUMOTO , Norihiro Fukuchi , Naohisa Mukozaka , Takashi Inoue , Yuu Takiguchi
IPC分类号： B23K26/38 , G03H1/08
CPC分类号： B41J2/442 , B23K26/066 , B41J2/465 , B41M5/24 , G02B26/06 , G02B27/42 , G02B27/4244 , G02B27/425 , G03H1/0005 , G03H1/0236 , G03H1/08 , G03H1/0808 , G03H1/2286 , G03H1/2294 , G03H2001/0094 , G03H2001/0816 , G03H2001/2218 , G03H2210/52 , G03H2225/32 , G03H2240/51 , G03H2240/53
摘要： A laser machining device is provided with a laser light source, a spatial light modulator, a driving unit, a control unit, and a condensing optical system. The control unit selects a basic hologram corresponding to each basic machining pattern included in a whole machining pattern in a workpiece from a plurality of basic holograms stored by the storage unit, and determines a display region of the basic hologram in the spatial light modulator so that the deviation of the value of “Iη/n” becomes small for the selected respective basic hologram when the intensity of a laser beam input to a display region of the basic hologram in the spatial light modulator is defined as I, the diffraction efficiency of the laser beam in the basic hologram is defined as η, and the number of condensing points in a basic machining pattern corresponding to the basic hologram is defined as n.
摘要翻译：激光加工装置设置有激光光源，空间光调制器，驱动单元，控制单元和聚光光学系统。控制单元从由存储单元存储的多个基本全息图中选择对应于工件中的整个加工图案中包括的每个基本加工图案的基本全息图，并且确定空间光调制器中的基本全息图的显示区域，使得当输入到空间光调制器中的基本全息图的显示区域的激光束的强度被定义为I时，对于所选择的各个基本全息图，“Ieta / n”的值的偏差变小，将基本全息图中的激光束定义为η，将与基本全息图对应的基本加工图案中的聚光点的数量定义为n。

7. 发明授权

US08295321B2 Laser light source 有权
标题翻译：激光光源
公开(公告)号：US08295321B2
公开(公告)日：2012-10-23
申请号：US12991268
申请日：2009-05-21
申请人： Taro Ando , Haruyasu Ito , Yoshiyuki Ohtake , Takashi Inoue , Naoya Matsumoto , Norihiro Fukuchi
发明人： Taro Ando , Haruyasu Ito , Yoshiyuki Ohtake , Takashi Inoue , Naoya Matsumoto , Norihiro Fukuchi
IPC分类号： H01S3/13 , H01S3/082 , H01S3/08
CPC分类号： H01S3/0804 , H01S3/0805 , H01S3/08059 , H01S3/08068 , H01S3/10053 , H01S3/105
摘要： A laser light source 1 is provided with a first reflection mirror 11, a laser medium 12, an aperture 13, an output mirror 14, a half mirror 15, a light beam diameter adjuster 16, and a second reflection mirror 17, and outputs laser oscillation light 31 reflected by the half mirror 15 to the outside. The main resonator is composed by the first reflection mirror 11 and the output mirror 14 disposed so as to be opposed to each other with the laser medium 12 placed therebetween. The external resonator is composed by the output mirror 14 and the second reflection mirror 17 disposed so as to be opposed to each other. The second reflection mirror 17 is configured such that it gives amplitude or phase variations to respective positions in the section of a light beam when the light is reflected, the second reflection mirror presents an amplitude or phase variation distribution, and determines the transverse mode of the laser oscillation light 31 based on the amplitude or phase variation distribution. Thus, a laser light source capable of easily controlling the transverse mode of the laser oscillation light can be realized.
摘要翻译：激光光源1设置有第一反射镜11，激光介质12，孔13，输出镜14，半透半反镜15，光束直径调节器16和第二反射镜17，并且输出激光由半反射镜15反射到外部的振荡光31。主谐振器由第一反射镜11和输出反射镜14构成，其中激光介质12位于它们之间，以彼此相对。外部谐振器由输出反射镜14和设置为彼此相对设置的第二反射镜17组成。第二反射镜17被构造成使得当光被反射时，其对光束的部分中的相应位置给出幅度或相位变化，第二反射镜呈现振幅或相位变化分布，并且确定第二反射镜17的横向模式基于振幅或相位变化分布的激光振荡光31。因此，可以实现能够容易地控制激光振荡光的横向模式的激光源。

8. 发明申请

US20110058579A1 LASER LIGHT SOURCE 审中-公开
标题翻译：激光源
公开(公告)号：US20110058579A1
公开(公告)日：2011-03-10
申请号：US12991271
申请日：2009-05-21
申请人： Yoshiyuki Ohtake , Haruyasu Ito , Taro Ando , Takashi Inoue , Naoya Matsumoto , Norihiro Fukuchi
发明人： Yoshiyuki Ohtake , Haruyasu Ito , Taro Ando , Takashi Inoue , Naoya Matsumoto , Norihiro Fukuchi
IPC分类号： H01S3/139
CPC分类号： H01S3/08045 , H01S3/0805 , H01S3/08059 , H01S3/08068 , H01S3/105 , H01S2301/203
摘要： A laser light source 1 is provided with an output mirror 11, a laser medium 12, a light beam diameter adjuster 13, an aperture 14, a reflection mirror 15, a drive unit 21, and a control unit 22, and outputs laser oscillation light 31 from the output mirror 11 to the outside. The laser resonator is configured so that the reflection mirror 15 and the output mirror 11 are disposed so as to be opposed to each other with the laser medium 12 placed therebetween. The reflection mirror 15 is configured such that it gives amplitude or phase variations to respective positions in the section of a light beam when the light is reflected, and the reflection mirror presents a amplitude or phase variation distribution in accordance with control from the outside, and determines the transverse mode of the laser oscillation light 31 based on the amplitude or phase variation distribution. Thus, a laser light source capable of easily controlling the transverse mode of the laser oscillation light can be realized.
摘要翻译：激光光源1设置有输出镜11，激光介质12，光束直径调节器13，孔14，反射镜15，驱动单元21和控制单元22，并且输出激光振荡光 31从输出镜11到外部。激光谐振器被配置为使得反射镜15和输出反射镜11被布置成使激光介质12放置在它们之间彼此相对。反射镜15被构造成使得当光被反射时，其在光束的部分中的相应位置产生振幅或相位变化，并且反射镜根据来自外部的控制呈现幅度或相位变化分布，以及基于振幅或相位变化分布确定激光振荡光31的横向模式。因此，可以实现能够容易地控制激光振荡光的横向模式的激光源。

9. 发明授权

US08867113B2 Laser processing device and laser processing method 有权
标题翻译：激光加工装置及激光加工方法
公开(公告)号：US08867113B2
公开(公告)日：2014-10-21
申请号：US13060614
申请日：2009-08-24
申请人： Naoya Matsumoto , Takashi Inoue , Norihiro Fukuchi , Haruyasu Ito
发明人： Naoya Matsumoto , Takashi Inoue , Norihiro Fukuchi , Haruyasu Ito
IPC分类号： G02B5/32 , B23K3/00 , B23K26/06
CPC分类号： G02B5/32 , B23K26/032 , B23K26/064 , B23K26/0643 , B23K26/066 , G03H1/2294 , G03H2001/0094 , G03H2210/452 , G03H2225/32 , G03H2240/51
摘要： A laser processing device includes a laser light source, a spatial light modulator, a control section, and a condensing optical system. The spatial light modulator, presents a hologram for modulating the phase of the laser light in each of a plurality of two-dimensionally arrayed pixels, and outputs the phase-modulated laser light. The control section causes a part of the phase-modulated laser light (incident light) to be condensed at a condensing position in a processing region as a laser light (contribution light) having a constant energy not less than a predetermined threshold X. The control section causes a laser light (unnecessary light) other than the contribution light condensed to the condensing position existing in the processing region to be dispersed and condensed at a condensing position existing in a non-processing region as a plurality of laser lights (non-contribution lights) having an energy less than the predetermined threshold.
摘要翻译：激光加工装置包括激光光源，空间光调制器，控制部和聚光系统。空间光调制器提供用于调制多个二维排列的像素中的每一个中的激光的相位的全息图，并输出相位调制的激光。控制部使相位调制激光（入射光）的一部分在作为具有恒定能量的预定阈值X以上的激光（贡献光）的处理区域中的聚光位置聚光。控制部在不存在于非处理区域的聚光位置处，使存在于处理区域中的聚光位置聚光的贡献光之外的激光（不必要的光）作为多个激光（非贡献光）具有小于预定阈值的能量。

10. 发明申请

US20110181929A1 LASER PROCESSING DEVICE AND LASER PROCESSING METHOD 有权
标题翻译：激光加工设备和激光加工方法
公开(公告)号：US20110181929A1
公开(公告)日：2011-07-28
申请号：US13060614
申请日：2009-08-24
申请人： Naoya Matsumoto , Takashi Inoue , Norihiro Fukuchi , Haruyasu Ito
发明人： Naoya Matsumoto , Takashi Inoue , Norihiro Fukuchi , Haruyasu Ito
IPC分类号： G02B5/32
CPC分类号： G02B5/32 , B23K26/032 , B23K26/064 , B23K26/0643 , B23K26/066 , G03H1/2294 , G03H2001/0094 , G03H2210/452 , G03H2225/32 , G03H2240/51
摘要： A laser processing device 1 includes a laser light source 10, a spatial light modulator 20, a control section 22, and a condensing optical system 30. The spatial light modulator 20 is input with a laser light output from the laser light source 10, presents a hologram for modulating the phase of the laser light in each of a plurality of two-dimensionally arrayed pixels, and outputs the phase-modulated laser light. The control section 22 causes a part of the phase-modulated laser light (incident light) to be condensed at a condensing position existing in a processing region as a laser light (contribution light) having a constant energy not less than a predetermined threshold X. On the other hand, the control section 22 causes a laser light (unnecessary light) other than the contribution light condensed to the condensing position existing in the processing region to be dispersed and condensed at a condensing position existing in a non-processing region as a plurality of laser lights (non-contribution lights) having an energy less than the predetermined threshold X.
摘要翻译：激光加工装置1包括激光光源10，空间光调制器20，控制部22和聚光光学系统30.空间光调制器20以从激光光源10输出的激光输入，呈现用于调制多个二维排列的像素中的每一个中的激光的相位的全息图，并输出相位调制的激光。控制部分22使得相位调制激光（入射光）的一部分在存在于处理区域中的聚光位置处被冷凝为具有不小于预定阈值X的恒定能量的激光（贡献光）。另一方面，控制部22使存在于处理区域中的聚光位置的会聚光以外的激光（不必要的光）在存在于非处理区域的聚光位置分散并浓缩为具有能量小于预定阈值X的多个激光（非贡献光）。

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