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1. 发明授权

US06962406B2 Fluid ejection device and method of manufacture 有权
标题翻译：流体喷射装置及其制造方法
公开(公告)号：US06962406B2
公开(公告)日：2005-11-08
申请号：US10657876
申请日：2003-09-09
申请人： Naoto Kawamura , Marvin G. Wong
发明人： Naoto Kawamura , Marvin G. Wong
IPC分类号： B41J2/235 , B41J2/14 , B41J2/16 , B41J2/05
CPC分类号： B41J2/1628 , B41J2/14024 , B41J2/1603 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1637 , Y10T29/49401
摘要： A fluid ejection device capable of ejecting fluid onto media and a method of manufacture are provided. The device has a carrier having an upper surface that defines a recess. A fluid ejecting substrate is disposed in the recess and is configured for establishing electrical and fluidic coupling with the carrier. The fluid ejecting substrate has a generally planar orifice layer and a generally planar contact surface positioned below the orifice layer. The orifice layer extends above the upper surface of the carrier and defines a plurality of orifices therein. An encapsulant at least partially encapsulates the fluid ejecting substrate and the carrier.
摘要翻译：提供能够将流体喷射到介质上的流体喷射装置和制造方法。该装置具有一个具有限定凹部的上表面的载体。流体喷射基板设置在凹部中并且被配置为与载体建立电和流体耦合。流体喷射基板具有大致平坦的孔层和位于孔层下方的大致平面的接触表面。孔口层在载体的上表面上方延伸并在其中限定多个孔。密封剂至少部分地封装流体喷射基板和载体。

2. 发明授权

US06648437B2 Fluid ejection device and method of fluid ejection 有权
标题翻译：流体喷射装置和流体喷射方法
公开(公告)号：US06648437B2
公开(公告)日：2003-11-18
申请号：US09938694
申请日：2001-08-23
申请人： Naoto Kawamura , Marvin G. Wong
发明人： Naoto Kawamura , Marvin G. Wong
IPC分类号： B41J25308
CPC分类号： B41J2/1628 , B41J2/14024 , B41J2/1603 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1637 , Y10T29/49401
摘要： A fluid ejection device capable of ejecting fluid onto media. The device includes a carrier having an upper surface that defines a recess. The device further includes a fluid ejecting substrate disposed therein that is configured for establishing electrical and fluidic coupling with the carrier. The fluid ejecting substrate has a generally planar orifice layer defining a plurality of orifices therein and a generally planar contact surface positioned below the orifice layer. The device further includes an encapsulant that at least partially encapsulates the fluid ejecting substrate and the carrier to form a substantially co-planar surface with the orifice layer.
摘要翻译：能够将流体喷射到介质上的流体喷射装置。该装置包括具有限定凹部的上表面的载体。该装置还包括布置在其中的流体喷射基板，其构造成用于建立与载体的电和流体耦合。流体喷射基板具有在其中限定多个孔的大致平坦的孔层和位于孔层下方的大致平面的接触表面。该装置还包括密封剂，其至少部分地封装流体喷射基底和载体以与孔层形成基本共面的表面。

3. 发明授权

US06692111B2 Electrical interconnect for an inkjet die 失效
标题翻译：喷墨模具的电气互连
公开(公告)号：US06692111B2
公开(公告)日：2004-02-17
申请号：US10081802
申请日：2002-02-22
申请人： Timothy E. Beerling , Marvin G. Wong , Wan Sin Ng , Juliana Arifin , Jiansan Sun , Arief Budiman Suriadi , Naoto Kawamura
发明人： Timothy E. Beerling , Marvin G. Wong , Wan Sin Ng , Juliana Arifin , Jiansan Sun , Arief Budiman Suriadi , Naoto Kawamura
IPC分类号： B41S205
CPC分类号： B41J2/1628 , B41J2/14024 , B41J2/14072 , B41J2/14129 , B41J2/1603 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1643 , B41J2/1646
摘要： An electrical interconnect for an inkjet printhead comprising an ink-ejecting semiconductor die is described. The ink-ejecting die further comprises a substrate having an opposing upper surface, lower surface, and a thin film stack. The upper surface of the substrate is beveled on at least one edge such that a lower portion of the bevel is below an upper portion of the bevel. A conductive material trace is disposed on top of at least a portion of the upper surface and the thin film stack and on the bevel towards the lower portion of the bevel. An electrical conductor is coupled to the conductive material trace at a predetermined location below the upper portion of the bevel. In a preferred embodiment of the current invention, the conductive material trace is substantially below the surface of the printhead thereby creating a robust printhead having several advantages including but not limited to: (1) electrical interconnects that are solidified in an encapsulant and therefore protected from chemical etching of the ink and vibrational/physical forces generated by the printer, (2) minimized die to printing medium distance and (3) minimized ESD effects on the beveled die.
摘要翻译：描述了一种用于包括喷墨半导体管芯的喷墨打印头的电互连。喷墨模具还包括具有相对的上表面，下表面和薄膜叠层的基板。基板的上表面在至少一个边缘上倾斜，使得斜面的下部在斜面的上部下方。导电材料迹线设置在上表面和薄膜堆叠的至少一部分的顶部上，并且朝向斜面的下部的斜面上。电导体在斜面的上部下方的预定位置处联接到导电材料迹线。在本发明的优选实施例中，导电材料迹线基本上在打印头的表面下方，从而形成具有若干优点的坚固的打印头，包括但不限于：（1）在密封剂中固化的电互连，油墨的化学蚀刻以及打印机产生的振动/物理力，（2）使模具与打印介质距离最小化，（3）最小化对斜面模具的ESD影响。

4. 发明授权

US06454955B1 Electrical interconnect for an inkjet die 失效
公开(公告)号：US06454955B1
公开(公告)日：2002-09-24
申请号：US09541122
申请日：2000-03-31
申请人： Timothy E. Beerling , Marvin G. Wong , Wan Sin Ng , Juliana Arifin , Jiansan Sun , Arief Budiman Suriadi , Naoto Kawamura
发明人： Timothy E. Beerling , Marvin G. Wong , Wan Sin Ng , Juliana Arifin , Jiansan Sun , Arief Budiman Suriadi , Naoto Kawamura
IPC分类号： B41J204
CPC分类号： B41J2/1643 , B41J2/14024 , B41J2/14072 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1646 , B41J2202/20
摘要： An electrical interconnect for an inkjet printhead comprising an ink-ejecting semiconductor die is described. The ink-ejecting die further comprises a substrate having an opposing upper surface, lower surface, and a thin film stack. The upper surface of the substrate is beveled on at least one edge such that a lower portion of the bevel is below an upper portion of the bevel. A conductive material trace is disposed on top of at least a portion of the upper surface and the thin film stack and on the bevel towards the lower portion of the bevel. An electrical conductor is coupled to the conductive material trace at a predetermined location below the upper portion of the bevel. In a preferred embodiment of the current invention, the conductive material trace is substantially below the surface of the printhead thereby creating a robust printhead having several advantages including but not limited to: (1) electrical interconnects that are solidified in an encapsulant and therefore protected from chemical etching of the ink and vibrational/physical forces generated by the printer, (2) minimized die to printing medium distance and (3) minimized ESD effects on the beveled die.

5. 发明授权

US06809931B2 Heat sink apparatus that provides electrical isolation for integrally shielded circuit 失效
公开(公告)号：US06809931B2
公开(公告)日：2004-10-26
申请号：US10615472
申请日：2003-07-07
申请人： Lewis R. Dove , Marvin G. Wong
发明人： Lewis R. Dove , Marvin G. Wong
IPC分类号： H05K720
CPC分类号： H01L23/552 , H01L23/13 , H01L23/3677 , H01L24/48 , H01L24/73 , H01L2224/05599 , H01L2224/32188 , H01L2224/32225 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/16152 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In one embodiment, a heat sink apparatus that provides electrical isolation for an integrally shielded, electronic circuit. The heat sink apparatus comprises a substrate having a first hole extending between a first and second sides of the substrate, a conductive layer attached to the second side, an electrically and thermally conductive heat sink having a protrusion, wherein the heat sink is attached to the first side of the substrate, and an electrically conductive plate having a second hole extending through the plate. The protrusion extends through the first hole and has a surface located at substantially the same level as that of the conductive layer. An electronic component is attachable to the protrusion surface. The plate is electrically coupled to the conductive layer and to the protrusion surface such that the area between the protrusion and the conductive layer is covered by electrically conducting area of the plate.

6. 发明授权

US06765162B2 Multi-seal fluid conductor electrical switch device and method of manufacture therefor 失效
标题翻译：多密封流体导体电气开关装置及其制造方法
公开(公告)号：US06765162B2
公开(公告)日：2004-07-20
申请号：US10687121
申请日：2003-10-15
申请人： Marvin G. Wong , You Kondoh
发明人： Marvin G. Wong , You Kondoh
IPC分类号： H01H5700
CPC分类号： B81C1/00873 , B81C1/00357 , B81C2201/019 , H01H1/0036 , H01H29/28 , H01H61/02 , H01H2029/008 , H01H2061/006
摘要： A switch device and a method of manufacture are provided that includes providing two substrates. The two substrates collectively include a fluid conductor switch device structure and a trench surrounding the fluid conductor switch device structure. An inner seal material is deposed on one of the substrates and an outer seal material is deposited in the trench. The substrates are joined to one another using the inner seal material and a peripheral hermetic seal is formed between the substrates using the outer seal material.
摘要翻译：提供一种开关装置和制造方法，其包括提供两个基板。两个基板共同地包括流体导体开关装置结构和围绕流体导体开关装置结构的沟槽。内部密封材料被放置在其中一个基底上，并且外部密封材料沉积在沟槽中。使用内密封材料将基板彼此接合，并且使用外部密封材料在基板之间形成周边密封。

7. 发明授权

US06535237B1 Manufacture of fluid ejection device 失效
标题翻译：流体喷射装置的制造
公开(公告)号：US06535237B1
公开(公告)日：2003-03-18
申请号：US09619056
申请日：2000-07-18
申请人： Marvin G. Wong
发明人： Marvin G. Wong
IPC分类号： B41J214
CPC分类号： B23K3/0623 , B23K3/0638 , B41J2/14024 , B41J2/1601 , B41J2/1603 , B41J2/162 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1634 , B41J2/1643 , B41J2/1645 , B41J2/1646 , B41J2202/21 , H05K3/3484
摘要： A method of manufacturing a fluid ejection device includes attaching a plurality of resistors to a portion of the substrate for heating fluid; attaching a plurality of solderable interconnect pads to another portion of the substrate; soldering at least one chip onto the interconnect pads; and electrically connecting the resistors with the chip by attaching a layer having circuit traces that run from the interconnect pads to the resistors, whereby the chip is operable to control the resistors.
摘要翻译：制造流体喷射装置的方法包括将多个电阻器附接到用于加热流体的基板的一部分; 将多个可焊接互连焊盘附接到所述衬底的另一部分; 将至少一个芯片焊接到互连焊盘上; 以及通过将具有从所述互连焊盘延伸的电路迹线附接到所述电阻器的层将所述电阻器与所述芯片电连接，由此所述芯片可操作以控制所述电阻器。

8. 发明授权

US5084713A Method and apparatus for cooling thermal ink jet print heads 失效
标题翻译：用于冷却热喷墨打印头的方法和装置
公开(公告)号：US5084713A
公开(公告)日：1992-01-28
申请号：US593443
申请日：1990-10-05
申请人： Marvin G. Wong
发明人： Marvin G. Wong
IPC分类号： B41J2/01 , B41J2/14 , B41J2/175 , B41J29/377
CPC分类号： B41J29/377 , B41J2/1408 , B41J2/14145 , B41J2002/14387
摘要： A thermal ink jet cartridge which avoids problems associated with internal heat generation. The cartridge uses a resistor assembly to eject ink from the cartridge. To control heat generated by the resistors, a cooling system is provided. The cooling system consists of an ink channel positioned adjacent the resistor substrate. The channel is supplied with ink from a chamber within the cartridge. Ink flowing through the channel contacts the substrate, causing a cooling effect. The ink is then returned to the chamber in the cartridge. If desired, a pumping system for enhancing ink flow through the channel may be provided. The system may consist of a thin-film resistor positioned adjacent at least one of the openings provided between the channel and the chamber. When the resistor is energized and heated, it causes ink to flow through the openings and back into the chamber.
摘要翻译：一种能够避免与内部发热有关的问题的热喷墨墨盒。墨盒使用电阻器组件从墨盒中喷出墨水。为了控制由电阻产生的热量，提供了一种冷却系统。冷却系统由邻近电阻器基板的油墨通道组成。该通道从墨盒内的腔室供应墨水。流过通道的墨水接触基板，产生冷却效果。墨水然后返回到墨盒中的腔室。如果需要，可以提供用于增强通过通道的墨水流动的泵送系统。该系统可以由设置在通道和腔室之间的至少一个开口相邻的薄膜电阻器组成。当电阻器通电并加热时，它使墨水流过开口并返回到腔室中。

9. 发明授权

US08702208B2 Achieving accurate page yields 有权
标题翻译：实现准确的页面收益率
公开(公告)号：US08702208B2
公开(公告)日：2014-04-22
申请号：US13196722
申请日：2011-08-02
申请人： Marvin G. Wong
发明人： Marvin G. Wong
IPC分类号： B41J2/04
CPC分类号： B41J2/14314 , B41J2/1433 , B41J2/17566
摘要： A system for achieving accurate page yields includes a first droplet generator comprising a nozzle aperture with a first cross sectional area and a first passageway to an ink reservoir. A second droplet generator includes a nozzle aperture with a second cross sectional area that is larger than the first cross sectional area and a second passageway to the ink reservoir with minimum cross sectional area that is smaller than the second cross sectional area. A method for achieving accurate page yields is also provided.
摘要翻译：用于实现精确的页面收缩的系统包括第一液滴发生器，其包括具有第一横截面积的喷嘴孔和到油墨储存器的第一通道。第二液滴发生器包括具有大于第一横截面积的第二横截面面积的喷嘴孔，以及具有小于第二横截面积的最小横截面面积的储墨器的第二通道。还提供了一种实现精确页面收益率的方法。

10. 发明申请

US20130033546A1 ACHIEVING ACCURATE PAGE YIELDS 有权
标题翻译：实现精确的页面
公开(公告)号：US20130033546A1
公开(公告)日：2013-02-07
申请号：US13196722
申请日：2011-08-02
申请人： Marvin G. Wong
发明人： Marvin G. Wong
IPC分类号： B41J2/04
CPC分类号： B41J2/14314 , B41J2/1433 , B41J2/17566
摘要： A system for achieving accurate page yields includes a first droplet generator comprising a nozzle aperture with a first cross sectional area and a first passageway to an ink reservoir. A second droplet generator includes a nozzle aperture with a second cross sectional area that is larger than the first cross sectional area and a second passageway to the ink reservoir with minimum cross sectional area that is smaller than the second cross sectional area. A method for achieving accurate page yields is also provided.
摘要翻译：用于实现精确的页面收缩的系统包括第一液滴发生器，其包括具有第一横截面积的喷嘴孔和到油墨储存器的第一通道。第二液滴发生器包括具有大于第一横截面积的第二横截面面积的喷嘴孔，以及具有小于第二横截面积的最小横截面面积的储墨器的第二通道。还提供了一种实现精确页面收益率的方法。

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