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    • 9. 发明授权
    • Printed wiring board and method for manufacturing printed wiring board
    • 印刷电路板及制造印刷线路板的方法
    • US08304657B2
    • 2012-11-06
    • US12954052
    • 2010-11-24
    • Hiroyuki SatoTomohiko MurataFusaji Nagaya
    • Hiroyuki SatoTomohiko MurataFusaji Nagaya
    • H05K1/03
    • H05K3/42H05K3/0032H05K3/426H05K3/4661H05K2201/0959H05K2201/09827H05K2201/09845H05K2203/1572Y10T29/49165
    • A printed wiring board includes a core substrate having a penetrating hole, a first circuit on a first surface of the substrate, a second circuit on a second surface of the substrate, and a through-hole conductor in the hole connecting the first and second circuits. The hole has first and second opening portions. The first opening portion becomes thinner toward the second surface. The second opening portion becomes thinner toward the first surface. The first opening portion has first and second portions. The second opening portion has first and second portions. The first and second portions of the first opening portion form inner walls bending inward at the boundary between the first and second portions. The first and second portions of the second opening portion form inner walls bending inward at the boundary between the first and second portions.
    • 印刷电路板包括具有贯通孔的芯基板,在基板的第一表面上的第一电路,在基板的第二表面上的第二电路,以及连接第一和第二电路的孔中的通孔导体 。 孔具有第一和第二开口部。 第一开口部朝向第二表面变薄。 第二开口部朝向第一表面变薄。 第一开口部分具有第一和第二部分。 第二开口部分具有第一和第二部分。 第一开口部的第一部分和第二部分形成在第一和第二部分之间的边界处向内弯曲的内壁。 第二开口部的第一部分和第二部分形成在第一和第二部分之间的边界处向内弯曲的内壁。