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1. 发明申请

US20110297209A1 SILICONE RESIN COMPOSITION FOR SOLAR CELL MODULE, AND SOLAR CELL MODULE 审中-公开
标题翻译：用于太阳能电池模块的硅树脂组合物和太阳能电池模块
公开(公告)号：US20110297209A1
公开(公告)日：2011-12-08
申请号：US13108497
申请日：2011-05-16
申请人： Naoki YAMAKAWA , Atsushi YAGINUMA
发明人： Naoki YAMAKAWA , Atsushi YAGINUMA
IPC分类号： H01L31/048 , C08L83/06 , C08L83/07
CPC分类号： C08L83/04 , C08G77/80 , C09D183/04 , C08L83/00 , C08L2666/44 , C08L2666/54
摘要： The invention provides a silicone resin composition for solar cell modules including (A) an organopolysiloxane in a liquid state with a viscosity at 25° C. of 10,000 mPa·s or more or in a solid state, which is represented by the following formula (1): R1n(C6H5)mSiO[(4-n-m)/2] (1); (B) an organohydrogenpolysiloxane containing, in each molecule, at least two hydrogen atoms bonded to a silicon atom, represented by Formula (2): R2aHbSiO[(4-a-b)/2] (2); (C) a hydrosilylation reaction catalyst; (D) a (meth)acryloxyalkyl group-containing silicon compound; and (E) an epoxy group-containing silicon compound. There can be an addition-curable silicone resin composition that self-adheres to ETFE films, and has hardness and strength sufficiently high to withstand external shocks, and that can be suitably used as a sealing material, adhesive, or the like for a flexible solar cell module.
摘要翻译：本发明提供了一种太阳能电池模块用有机硅树脂组合物，其包含（A）在25℃下的粘度为10,000mPa·s以上或固态的液态有机聚硅氧烷，其由下式（ 1）：R1n（C6H5）mSiO [（4-nm）/ 2]（1）; （B）在每个分子中含有由式（2）表示的至少两个键合到硅原子上的氢原子的有机氢聚硅氧烷：R2aHbSiO [（4-a-b）/ 2]（2）; （C）氢化硅烷化反应催化剂; （D）含（甲基）丙烯酰氧基烷基的硅化合物; 和（E）含环氧基的硅化合物。可以使用自粘合到ETFE膜上的可加成固化的有机硅树脂组合物，并且具有足够高的硬度和强度以承受外部冲击，并且可以适合用作柔性太阳能的密封材料，粘合剂等电池模块。

2. 发明申请

US20130092423A1 METHOD FOR FORMING CONDUCTIVE CIRCUIT 审中-公开
标题翻译：形成导通电路的方法
公开(公告)号：US20130092423A1
公开(公告)日：2013-04-18
申请号：US13608620
申请日：2012-09-10
申请人： Yoshitaka HAMADA , Naoki YAMAKAWA
发明人： Yoshitaka HAMADA , Naoki YAMAKAWA
IPC分类号： B05D5/12 , H05K1/09
CPC分类号： H05K1/095 , C09D11/037 , C09D11/52 , H01L2924/0002 , H05K3/1216 , H05K3/1283 , H05K2201/0218 , H05K2201/0221 , H05K2201/0224 , H05K2201/0245 , H01L2924/00
摘要： A conductive circuit is formed by printing a pattern using a conductive ink composition and heat curing the pattern. A thixotropic agent, typically carbon black is added to the solvent-free ink composition comprising an addition type silicone resin precursor, a curing catalyst, and conductive particles. The ink composition has such thixotropy that the printed pattern may retain its shape after curing.
摘要翻译：通过使用导电油墨组合物印刷图案并热固化图案来形成导电电路。将触变剂（通常为炭黑）加入到包含加成型有机硅树脂前体，固化催化剂和导电颗粒的无溶剂油墨组合物中。油墨组合物具有这样的触变性，即印刷图案可以在固化后保持其形状。

3. 发明申请

US20090258216A1 SILICONE ADHESIVE FOR SEMICONDUCTOR ELEMENT 审中-公开
标题翻译：硅胶用于半导体元件
公开(公告)号：US20090258216A1
公开(公告)日：2009-10-15
申请号：US12421876
申请日：2009-04-10
申请人： Naoki YAMAKAWA , Kei Miyoshi , Toshiyuki Ozai , Yoshinori Ogawa
发明人： Naoki YAMAKAWA , Kei Miyoshi , Toshiyuki Ozai , Yoshinori Ogawa
IPC分类号： B32B7/12 , C09J183/00 , C09J183/06
CPC分类号： H01L33/56 , C09J183/14
摘要： A silicone adhesive for a semiconductor element that is suitable as a die bonding material for fixing a light emitting diode chip to a substrate. The adhesive includes (a) an addition reaction-curable silicone resin composition having a viscosity at 25° C. of not more than 100 Pa·s, and yielding a cured product upon heating at 150° C. for 3 hours that has a type D hardness prescribed in JIS K6253 of at least 30, (b) a white pigment powder having an average particle size of less than 1 μm, and (c) a white or colorless and transparent powder having an average particle size of at least 1 μm but less than 10 μm. The adhesive exhibits high levels of concealment, effectively reflects light emitted from the LED chip, and also exhibits favorable chip positioning properties, superior adhesive strength, and excellent durability.
摘要翻译：一种用于半导体元件的硅粘合剂，其适合作为用于将发光二极管芯片固定到基板的芯片接合材料。粘合剂包括（a）在25℃下的粘度不大于100Pa.s的加成反应固化性有机硅树脂组合物，并且在150℃加热3小时时产生固化产物，其具有类型 JIS K6253规定的D硬度为30以上，（b）平均粒径小于1μm的白色颜料粉末，（c）平均粒径为1μm以上的白色或无色透明粉末但少于10个妈妈。粘合剂显示出高水平的隐蔽性，有效地反映了从LED芯片发出的光，并且还显示出有利的芯片定位性能，优异的粘合强度和优异的耐久性。

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