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1. 发明申请

US20110068149A1 Solder preform and a process for its manufacture 审中-公开
标题翻译：焊料预制件及其制造方法
公开(公告)号：US20110068149A1
公开(公告)日：2011-03-24
申请号：US12923319
申请日：2010-09-14
申请人： Naohiko Hirano , Akira Tanahashi , Yoshitsugu Sakamoto , Kaichi Tsuruta , Takashi Ishii , Satoshi Soga
发明人： Naohiko Hirano , Akira Tanahashi , Yoshitsugu Sakamoto , Kaichi Tsuruta , Takashi Ishii , Satoshi Soga
IPC分类号： B23K35/14
CPC分类号： C22C13/00 , B22F1/025 , B23K35/0244 , B23K35/262 , B23K35/3033 , B23K35/36
摘要： A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded, rolled, and punched to form a pellet or a washer, for example.
摘要翻译：从包含可热解助熔剂和高熔点金属颗粒的焊料混合物制备混合母合金，将混合母合金装入大量熔融焊料中并搅拌，并制备坯料。然后可以将坯料挤出，轧制和冲压以形成例如颗粒或垫圈。

2. 发明申请

US20080237301A1 Solder preform and a process for its manufacture 有权
标题翻译：焊料预制件及其制造方法
公开(公告)号：US20080237301A1
公开(公告)日：2008-10-02
申请号：US12073690
申请日：2008-03-07
申请人： Naohiko Hirano , Akira Tanahashi , Yoshitsugu Sakamoto , Kaichi Tsuruta , Takashi Ishii , Satoshi Soga
发明人： Naohiko Hirano , Akira Tanahashi , Yoshitsugu Sakamoto , Kaichi Tsuruta , Takashi Ishii , Satoshi Soga
IPC分类号： B23K35/14 , B22D29/00
CPC分类号： C22C13/00 , B21C37/02 , B21C37/04 , B22F1/0011 , B23K35/001 , B23K35/0222 , B23K35/0233 , B23K35/0244 , B23K35/262 , B23K35/3612 , B23K35/3613 , B23K35/3618 , B23K35/362 , C22C19/03 , H01L24/29
摘要： A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded, rolled, and punched to form a pellet or a washer, for example.
摘要翻译：从包含可热解助熔剂和高熔点金属颗粒的焊料混合物制备混合母合金，将混合母合金装入大量熔融焊料中并搅拌，并制备坯料。然后可以将坯料挤出，轧制和冲压以形成例如颗粒或垫圈。

3. 发明授权

US10081852B2 Solder preform and a process for its manufacture 有权
公开(公告)号：US10081852B2
公开(公告)日：2018-09-25
申请号：US12923319
申请日：2010-09-14
申请人： Naohiko Hirano , Akira Tanahashi , Yoshitsugu Sakamoto , Kaichi Tsuruta , Takashi Ishii , Satoshi Soga
发明人： Naohiko Hirano , Akira Tanahashi , Yoshitsugu Sakamoto , Kaichi Tsuruta , Takashi Ishii , Satoshi Soga
IPC分类号： B23K35/00 , C22C13/00 , B22F1/02 , B23K35/02 , B23K35/26 , B23K35/30 , B23K35/36
CPC分类号： C22C13/00 , B22F1/025 , B23K35/0244 , B23K35/262 , B23K35/3033 , B23K35/36
摘要： A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded, rolled, and punched to form a pellet or a washer, for example.

4. 发明授权

US07793820B2 Solder preform and a process for its manufacture 有权
标题翻译：焊料预制件及其制造方法
公开(公告)号：US07793820B2
公开(公告)日：2010-09-14
申请号：US12073690
申请日：2008-03-07
申请人： Naohiko Hirano , Akira Tanahashi , Yoshitsugu Sakamoto , Kaichi Tsuruta , Takashi Ishii , Satoshi Soga
发明人： Naohiko Hirano , Akira Tanahashi , Yoshitsugu Sakamoto , Kaichi Tsuruta , Takashi Ishii , Satoshi Soga
IPC分类号： B23K35/22 , B23K35/24 , B23K35/36
CPC分类号： C22C13/00 , B21C37/02 , B21C37/04 , B22F1/0011 , B23K35/001 , B23K35/0222 , B23K35/0233 , B23K35/0244 , B23K35/262 , B23K35/3612 , B23K35/3613 , B23K35/3618 , B23K35/362 , C22C19/03 , H01L24/29
摘要： A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded, rolled, and punched to form a pellet or a washer, for example.
摘要翻译：从包含可热解助熔剂和高熔点金属颗粒的焊料混合物制备混合母合金，将混合母合金装入大量熔融焊料中并搅拌，并制备坯料。然后可以将坯料挤出，轧制和冲压以形成例如颗粒或垫圈。

5. 发明申请

US20090236725A1 Solder Preform and Electronic Component 有权
标题翻译：焊料预制件和电子元件
公开(公告)号：US20090236725A1
公开(公告)日：2009-09-24
申请号：US12226764
申请日：2007-04-26
申请人： Naohiko Hirano , Yoshitsugu Sakamoto , Tomomi Okumura , Kaichi Tsuruta , Minoru Ueshima , Takashi Ishii
发明人： Naohiko Hirano , Yoshitsugu Sakamoto , Tomomi Okumura , Kaichi Tsuruta , Minoru Ueshima , Takashi Ishii
IPC分类号： H01L23/488 , B23K35/24
CPC分类号： H05K3/3478 , B23K35/262 , B23K35/40 , H01L23/492 , H01L23/49866 , H01L24/29 , H01L24/83 , H01L2224/291 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29211 , H01L2224/29355 , H01L2224/29499 , H01L2224/29582 , H01L2224/29611 , H01L2224/29694 , H01L2224/29695 , H01L2224/32225 , H01L2224/83101 , H01L2224/83455 , H01L2224/83801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/15747 , H05K2201/0215 , H05K2201/2036 , H05K2203/0415 , H01L2924/00 , H01L2924/01028 , H01L2924/01026 , H01L2924/01049 , H01L2924/01083 , H01L2924/3512 , H01L2924/00014 , H01L2224/13111 , H01L2224/13109 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： An electronic component having a semiconductor element bonded to a substrate with solder has a decreased bonding strength if there is not a suitable clearance between the semiconductor element and the substrate. Therefore, a solder preform having high melting point metal particles dispersed in solder has been used in the manufacture of electronic components. However, when an electronic component was manufactured using a conventional solder preform, there were cases in which the semiconductor element leaned or the bonding strength was not adequate.A solder preform according to the present invention has a variation in the size of high melting point metal particles which is at most 20 micrometers when the metal particle diameter is 50 micrometers, and an alloy layer of the high melting point metal particles and the main component of solder is formed around the high melting point metal particles. In addition, no voids at all are present in the solder. An electronic component according to the present invention has a semiconductor element bonded to a substrate with the above-described solder preform and has excellent resistance to heat cycles.
摘要翻译：如果半导体元件和基板之间没有合适的间隙，则具有用焊料与基板结合的半导体元件的电子部件的接合强度降低。因此，在电子部件的制造中已经使用了分散在焊料中的高熔点金属粒子的焊料预成型体。然而，当使用常规的焊料预制件制造电子部件时，存在半导体元件倾斜或接合强度不足的情况。根据本发明的焊料预成型体在金属粒径为50微米时具有至多20微米的高熔点金属颗粒的尺寸变化，并且高熔点金属颗粒和主要组分的合金层的焊料形成在高熔点金属颗粒周围。另外，在焊料中也不存在空隙。根据本发明的电子部件具有利用上述焊料预成型件与基板结合的半导体元件，并具有优异的耐热循环性。

6. 发明授权

US07800230B2 Solder preform and electronic component 有权
标题翻译：焊料预制件和电子部件
公开(公告)号：US07800230B2
公开(公告)日：2010-09-21
申请号：US12226764
申请日：2007-04-26
申请人： Naohiko Hirano , Yoshitsugu Sakamoto , Tomomi Okumura , Kaichi Tsuruta , Minoru Ueshima , Takashi Ishii
发明人： Naohiko Hirano , Yoshitsugu Sakamoto , Tomomi Okumura , Kaichi Tsuruta , Minoru Ueshima , Takashi Ishii
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H05K3/3478 , B23K35/262 , B23K35/40 , H01L23/492 , H01L23/49866 , H01L24/29 , H01L24/83 , H01L2224/291 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29211 , H01L2224/29355 , H01L2224/29499 , H01L2224/29582 , H01L2224/29611 , H01L2224/29694 , H01L2224/29695 , H01L2224/32225 , H01L2224/83101 , H01L2224/83455 , H01L2224/83801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/15747 , H05K2201/0215 , H05K2201/2036 , H05K2203/0415 , H01L2924/00 , H01L2924/01028 , H01L2924/01026 , H01L2924/01049 , H01L2924/01083 , H01L2924/3512 , H01L2924/00014 , H01L2224/13111 , H01L2224/13109 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A solder preform according to the present invention has a variation in the size of high melting point metal particles which is at most 20 micrometers when the metal particle diameter is 50 micrometers, and an alloy layer of the high melting point metal particles and the main component of solder is formed around the high melting point metal particles. In addition, no voids at all are present in the solder. An electronic component according to the present invention has a semiconductor element bonded to a substrate with the above-described solder preform and has excellent resistance to heat cycles.
摘要翻译：根据本发明的焊料预成型体在金属粒径为50微米时具有至多20微米的高熔点金属颗粒的尺寸变化，并且高熔点金属颗粒和主要组分的合金层的焊料形成在高熔点金属颗粒周围。另外，在焊料中也不存在空隙。根据本发明的电子部件具有利用上述焊料预成型件与基板结合的半导体元件，并具有优异的耐热循环性。

7. 发明授权

US08961709B1 Solder paste 有权
标题翻译：焊膏
公开(公告)号：US08961709B1
公开(公告)日：2015-02-24
申请号：US10588647
申请日：2004-03-09
申请人： Kunihito Takaura , Kaichi Tsuruta , Hiroshi Kawanakago , Hiroshi Takahashi
发明人： Kunihito Takaura , Kaichi Tsuruta , Hiroshi Kawanakago , Hiroshi Takahashi
IPC分类号： B23K35/34
CPC分类号： H05K3/3484 , B23K35/0244 , B23K35/025 , B23K35/262 , C22C13/00 , H05K3/3463 , H05K2201/0272
摘要： A solder paste using a Sn—Ag base, Sn—Cu base, or similar alloy powder has a high melting point, so it causes thermal damage to electronic devices. Sn—Ag—In base lead-free solder alloys having a low melting temperature have been studied, but they are difficult to use because they cause much occurrence of chips standing up during reflow.The present invention forms a solder paste by separating a Sn—Ag—In base lead-free solder into first and second solder alloy powders for which the difference in their peak temperatures measured by differential thermal analysis is at least 10° C. and blends the mixed powders with a flux.
摘要翻译：使用Sn-Ag基底，Sn-Cu基底或类似合金粉末的焊膏具有高熔点，因此对电子器件造成热损伤。已经研究了具有低熔融温度的Sn-Ag-In基底无铅焊料合金，但是由于它们在回流期间引起大量的芯片堆积而难以使用。本发明通过将Sn-Ag-In基底无铅焊料分离成通过差示热分析测量的其峰值温度差异至少为10℃的第一和第二焊料合金粉末形成焊膏，并将混合粉末与助焊剂。

8. 发明申请

US20080213613A1 Solder Precoating Method and Workpiece For Electronic Equipment 有权
标题翻译：焊接预涂法和电子设备工件
公开(公告)号：US20080213613A1
公开(公告)日：2008-09-04
申请号：US11793054
申请日：2004-12-20
申请人： Takeo Kuramoto , Kaichi Tsuruta
发明人： Takeo Kuramoto , Kaichi Tsuruta
IPC分类号： B23K3/06 , H05K3/34
CPC分类号： B23K3/0623 , B23K2101/40 , H05K3/3478 , H05K3/3484 , H05K2203/0338 , H05K2203/0425 , Y10T428/12229
摘要： Problem Precoating methods for previously adhering solder to areas to be soldered of a workpiece for an electronic part such as a printed circuit board, a chip part, or a wafer include the plating method, the hot leveling method, the solder paste method, the solder ball method, and the like. In these conventional precoating methods, solder did not uniformly adhere to areas to be soldered, solder did not completely adhere, and much equipment and time were required. The present invention provides a method which can perform precoating with uniform application and without the occurrence of defects using simple equipment and a workpiece to which solder is uniformly adhered. Means for Solving the Problem In the present invention, an excess amount of solder powder is dispersed atop an adhesive applied to a substrate, and then excess solder powder which is not adhered to the adhesive is removed. The surface on with solder powder is dispersed is then stacked on a workpiece to which flux is applied with the application of pressure, heating is then performed, and solder is adhered only to areas to be soldered.
摘要翻译：问题预先将焊料粘附到用于印刷电路板，芯片部分或晶片等电子部件的工件的要焊接的区域的预涂方法包括电镀方法，热流平法，焊膏法，焊料球法等。在这些常规的预涂方法中，焊料不均匀地粘附到待焊接的区域上，焊料没有完全粘附，并且需要很多设备和时间。本发明提供了一种可以使用简单的设备和焊料均匀粘附的工件，均匀地施加并且不发生缺陷的方法。解决问题的手段在本发明中，将过量的焊料粉末分散在施加到基板上的粘合剂的顶部，然后去除不粘附到粘合剂上的多余的焊料粉末。将焊料粉末的表面分散，然后在施加压力的情况下堆叠在施加助焊剂的工件上，然后进行加热，并且焊料仅粘附到待焊接的区域。

9. 发明申请

US20130133924A1 ELECTRODE FOR ENERGY STORAGE DEVICE, MANUFACTURING METHOD THEREOF AND CONNECTING METHOD THEREOF 有权
标题翻译：用于能源储存装置的电极及其制造方法及其连接方法
公开(公告)号：US20130133924A1
公开(公告)日：2013-05-30
申请号：US13806104
申请日：2011-06-14
申请人： Katsuji Nakamura , Kaichi Tsuruta , Yuji Ozaki , Shigeaki Watarai , Hidenori Takagi , Yutaka Ohori
发明人： Katsuji Nakamura , Kaichi Tsuruta , Yuji Ozaki , Shigeaki Watarai , Hidenori Takagi , Yutaka Ohori
IPC分类号： H01B1/02 , H01B13/32
CPC分类号： H01G11/50 , C23C18/1651 , C23C18/1653 , C23C18/1827 , C23C18/31 , C23C18/32 , C23C18/36 , C23C18/48 , C23C18/52 , C23C18/54 , C25D3/12 , C25D3/22 , C25D3/30 , C25D3/565 , C25D3/60 , C25D5/12 , C25D5/44 , H01B1/023 , H01B13/32 , H01G11/06 , H01G11/24 , H01G11/30 , H01G11/66 , H01M2/202 , H01M2/26 , H01M2/30 , H01M2004/028 , Y02E60/13 , Y10T29/49147
摘要： To increase a ground contact area in comparison with the conventional jointing by the spot-welding or the conventional fastening by a bolt so that the resistance value at the contacting point is reduced and the voltage of the energy storage device can be effectively supplied without any drop of the voltage.Zn layer 21 or Zn alloy layer, Ni layer 22, and Sn layer 23 or Sn alloy layer are formed on a connecting terminal part 10a of a positive electrode composed of Al by plating. Accordingly, this can solder Cu negative electrode, which is composed of metal that is different species from Al, through Sn layer 23 or Sn alloy layer so that jointing strength of the Al positive electrode and the Cu negative electrode can be enhanced. Further, since the ground contact area is increased in comparison with the conventional jointing by the spot-welding or the conventional fastening by a bolt so that the resistance value at the contacting point is reduced, the voltage drop of the energy storage device by contact resistance can be reduced.
摘要翻译：为了增加接地面积，与通过点焊的常规接合或通过螺栓的常规紧固相比，接触点的电阻值降低，并且能够有效地提供能量存储装置的电压而没有任何下落的电压。 Zn层21或Zn合金层，Ni层22和Sn层23或Sn合金层通过电镀在由Al构成的正极的连接端子部10a上形成。因此，这可以通过Sn层23或Sn合金层来焊接由不同于Al的金属构成的Cu负极，从而可以提高Al正极和Cu负极的接合强度。此外，由于与通过点焊的常规接合或通过螺栓的常规紧固相比，接地面积增加，使得接触点处的电阻值降低，所以能量存储装置的接触电压的下降可以减少

10. 发明授权

US07112888B2 Solder ball assembly for bump formation and method for its manufacture 有权
标题翻译：用于凸块形成的焊球组件及其制造方法
公开(公告)号：US07112888B2
公开(公告)日：2006-09-26
申请号：US10731436
申请日：2003-12-10
申请人： Takeo Kuramoto , Kaichi Tsuruta
发明人： Takeo Kuramoto , Kaichi Tsuruta
IPC分类号： H01L23/48
CPC分类号： H05K3/3478 , H01L21/4853 , H01L24/11 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/45144 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H05K2203/0113 , H05K2203/0338 , H05K2203/041 , H01L2924/00 , H01L2224/0401
摘要： A solder ball assembly for use in the formation of solder bumps on electrodes of a substrate for electronic components includes a heat-resisting sheet having a plurality of holes formed therein. Each hole has a solder ball disposed therein. The sheet includes an adherent layer exposed to the interior of each hole on the wall and/or bottom of the hole such that the adherent layer contacts and holds the solder balls in the holes. Solder bumps are formed by positioning the assembly on a substrate such that the solder balls held in the holes come into contact with the electrodes of the substrate. The assembly and the substrate are heated together to melt the solder balls in the holes. After solidification of the solder, the heat-resisting sheet of the assembly is removed from the substrate, leaving a solder bump on each electrode.
摘要翻译：用于在用于电子部件的基板的电极上形成焊料凸块的焊球组件包括其中形成有多个孔的耐热片。每个孔具有设置在其中的焊球。片材包括暴露于孔的壁上和/或底部的每个孔的内部的粘附层，使得粘附层接触并将焊球保持在孔中。通过将组件定位在基板上使得保持在孔中的焊球与基板的电极接触而形成焊料凸块。将组件和基板一起加热以熔化孔中的焊球。在焊料固化之后，将组件的耐热片从衬底上移除，在每个电极上留下焊料凸点。

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