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    • 9. 发明授权
    • Method for reporting reception result of packets in mobile communication system
    • 报告移动通信系统中报文接收结果的方法
    • US07599363B2
    • 2009-10-06
    • US11202895
    • 2005-08-12
    • Kyung-Hun JangJong-Ae ParkDong-Jun LeeJin-Bong ChangYoung-Soo Kim
    • Kyung-Hun JangJong-Ae ParkDong-Jun LeeJin-Bong ChangYoung-Soo Kim
    • H04L12/56H04J3/00
    • H04L1/1614
    • Disclosed is a bitmap structure which enables the size of a bitmap field containing reception result information to be significantly reduced while fully performing its acknowledgment function. To this end, a message region for recording indicators, which enables reception success or failure for the maximum allowable SN level packets treatable by block ACK to be confirmed, is assigned. A message region for recording only the reception results for unsuccessfully received packets is also assigned. A receiving party confirms the unsuccessfully received packets through the indicators, and retransmits the unsuccessfully received packets. Also, a transmitting party provides the number of SN level packets and the maximum number of fragmentation packets to the receiving party. The receiving party determines an optimized bitmap configuration scheme, and transmits the reception results for the respective fragmentation packets to the transmitting party based on the determined bitmap configuration scheme.
    • 公开了一种位图结构,其能够在完全执行其确认功能的同时,使包含接收结果信息的位图字段的大小显着减少。 为此,分配用于记录指示符的消息区域,其使得能够通过块ACK可被处理的最大允许SN级分组的接收成功或失败被确认。 还分配仅用于记录未成功接收的分组的接收结果的消息区域。 接收方通过指示符确认未成功接收的分组,并重新发送未成功接收的分组。 此外,发送方向接收方提供SN级数据包的数量和最大数量的分段数据包。 接收方确定优化的位图配置方案,并且基于所确定的位图配置方案向发送方发送各个分段分组的接收结果。
    • 10. 发明授权
    • Conditioner device for conditioning polishing pad and chemical mechanical polishing apparatus including the same
    • 用于调理抛光垫的调节装置和包括其的化学机械抛光装置
    • US07578727B2
    • 2009-08-25
    • US11466425
    • 2006-08-22
    • Sung-Tae MoonDong-Jun LeeKyoung-Moon KangNam-Soo KimBong-Su Ahn
    • Sung-Tae MoonDong-Jun LeeKyoung-Moon KangNam-Soo KimBong-Su Ahn
    • B24B53/00
    • B24B53/017B24B53/14
    • The present invention relates to a conditioner device for polishing pad and a chemical mechanical polishing (CMP) apparatus having the same. The conditioner device of the present invention comprises a rotable support plate including a support plate surface comprising a center area located about the rotational axis of the support plate, a mid area surrounding the center area, and a peripheral area surrounding the mid area, a plurality of conditioning zones located within a portion of the mid area of the support plate surface. A plurality of hard particles which are densely arranged within the conditioning zones and are attached to the support plate surface. A plurality of passages defined by the conditioning zones within which a slurry flows, the passages occupying a portion of the mid area which is not occupied by the conditioning zones, the center area and the peripheral area.
    • 本发明涉及一种用于抛光垫的调节装置和具有该抛光垫的化学机械抛光(CMP)装置。 本发明的调节装置包括可旋转的支撑板,其包括支撑板表面,该支撑板表面包括围绕支撑板的旋转轴线的中心区域,围绕中心区域的中间区域和围绕中间区域的周边区域,多个 位于支撑板表面的中部区域的一部分内的调理区。 多个坚硬颗粒密集地布置在调理区内并附着在支撑板表面上。 由浆料流过的调节区限定的多个通道,通道占据中部区域的未被调节区域,中心区域和周边区域占据的部分。