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JP2014051715A Apparatus and method for forming film and film forming program 有权
标题翻译：用于形成薄膜和薄膜形成程序的装置和方法
公开(公告)号：JP2014051715A
公开(公告)日：2014-03-20
申请号：JP2012197874
申请日：2012-09-07
申请人： Nagoya Univ , 国立大学法人名古屋大学 , Brother Ind Ltd , ブラザー工業株式会社
发明人： SHINODA KENTARO , KANEDA HIDEKI , TAKI KAZUYA , KAMISAKA HIROYUKI , TAKAOKA YASUYUKI , OKAMOTO TAKASHI
IPC分类号： C23C16/511
CPC分类号： B05D1/007 , B05C5/001 , C23C16/26 , C23C16/511 , C23C16/52 , H01J37/32192 , H01J37/32706 , H01J2237/3321
摘要： PROBLEM TO BE SOLVED: To provide a method for forming a film capable of decreasing the dispersion of hardness distribution of a formed film.SOLUTION: The apparatus for forming a film comprises a gas supply section which supplies a raw material gas and an inert gas into a processing chamber, a microwave supply section which supplies microwave pulses which generates plasma along the processing surface of a material to be processed and a voltage application section which applies negative bias voltage pulses to the material to be processed supported in the processing chamber in order to expand a sheath layer on the processing surface of the material to be processed. The computer of the apparatus for forming a film, according to a film forming program, controls the application timing of the minus bias voltage pulses and the supply timing of the microwave pulses so that the ratio of the application time of the minus bias voltage pulses in the time of the supply time of one microwave pulse with respect to the supply time of one microwave pulse is 0.9 or more.
摘要翻译：要解决的问题：提供一种能够降低成形膜的硬度分布分散的膜的形成方法。解决方案：用于形成膜的装置包括：供给部，其将原料气体和惰性气体供给到处理室，微波供应部分，其沿着待处理材料的处理表面提供产生等离子体的微波脉冲;以及电压施加部分，其对处理室中支持的待处理材料施加负偏置电压脉冲，以便在待处理材料的处理表面上展开鞘层。根据成膜程序，用于形成膜的设备的计算机控制负偏压脉冲的施加定时和微波脉冲的供给定时，使得负偏置电压脉冲的施加时间的比例一个微波脉冲的供给时间相对于一个微波脉冲的供给时间的时间为0.9以上。

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