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    • 2. 发明申请
    • MICROSCOPIC STRUCTURE PACKAGING METHOD AND DEVICE WITH PACKAGED MICROSCOPIC STRUCTURE
    • 具有包装微结构的微结构包装方法和装置
    • WO2009147556A3
    • 2010-06-24
    • PCT/IB2009052083
    • 2009-05-19
    • NXP BVVERHEIJDEN GREJA J A MDAAMEN ROELROOSEN HAROLD H
    • VERHEIJDEN GREJA J A MDAAMEN ROELROOSEN HAROLD H
    • B81C1/00
    • B81C1/00476B81C2201/0108B81C2203/0136
    • The present invention discloses a method of packaging a microscopic structure (12). The method comprises the steps of forming the microscopic structure (12) on a substrate (10); depositing a layer (14) of a thermally decomposable polymer over the substrate, thereby embedding the microscopic structure; patterning the deposited layer (14) such that the microscopic structure is embedded in a portion of the patterned layer, the side walls of said portion (14) forming a substantially right angle with the substrate (10); growing a capping layer (18) over the portion, wherein the substantially right angles cause the formation of at least one channel (20) from the portion (14) through the capping layer (18); and decomposing the polymer, whereby the decomposition products escape from the portion (14) through said channel (20). The present invention further discloses a device including a microscopic structure packaged in accordance with the above method.
    • 本发明公开了一种包装微结构(12)的方法。 该方法包括在基板(10)上形成微观结构(12)的步骤。 在衬底上沉积可热分解的聚合物层(14),从而嵌入微观结构; 图案化沉积层(14),使得微观结构嵌入图案化层的一部分中,所述部分(14)的侧壁与衬底(10)形成大致直角; 在所述部分上生长覆盖层(18),其中所述基本上直角导致从所述部分(14)穿过所述封盖层(18)形成至少一个通道(20)。 并分解聚合物,由此分解产物通过所述通道(20)从部分(14)逸出。 本发明还公开了一种根据上述方法包装的微观结构的装置。