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    • 8. 发明专利
    • DEVICE AND METHOD FOR CORRECTING PATTERNS
    • JP2000052072A
    • 2000-02-22
    • JP21915098
    • 1998-08-03
    • NTN TOYO BEARING CO LTD
    • SARUTA MASAHIROSHIMIZU SHIGEO
    • G02F1/13B23K26/03H05K3/22B23K26/00B23K26/02
    • PROBLEM TO BE SOLVED: To carry out proper firing regardless of the dimension of the ratio of a pattern part by deciding a firing condition while radiating a laser light near a paste from the ratio obtained by an image processing mechanism for obtaining the ratio of the area where a pattern part and a paste part in the region irradiated with the laser light are added against the area of a substrate part on which patterns are not formed. SOLUTION: A portion 20 in a substrate, where a paste is applied, is monitored by a CCD camera. The size of a laser light radiation region 21 is decided by a slit mechanism, and the ratio of the area where a pattern part 23 and the paste part 20 in the region 21 are added against the area of a glass part 22 is obtained, so as to decide the radiation energy and the radiation time of the laser light. When the temperature in the region 21 is measured during firing, and the laser light ejecting device and an output control mechanism are fedback, a firing condition can be kept constant. Thereby, the paste is fired by size of the ratio of the pattern part 23, so that high precision correction can be carried out without remaining the distortion on the substrate.