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1. 发明公开

EP3024024A1 SEMICONDUCTOR MODULE 审中-公开
标题翻译：半导体模块
公开(公告)号：EP3024024A1
公开(公告)日：2016-05-25
申请号：EP14855368.8
申请日：2014-10-06
申请人： NSK Ltd.
发明人： SUNAGA, Takashi , KANEKO, Noboru , MIYOSHI, Osamu , SUZUKI, Ryoichi
IPC分类号： H01L23/48 , H01L21/60 , H01L25/07 , H01L25/18
CPC分类号： H01L24/41 , H01L23/051 , H01L23/3735 , H01L23/492 , H01L23/49811 , H01L23/49838 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L29/7393 , H01L29/78 , H01L2224/05553 , H01L2224/0603 , H01L2224/2732 , H01L2224/29101 , H01L2224/32227 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37011 , H01L2224/37013 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37611 , H01L2224/4001 , H01L2224/40095 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4099 , H01L2224/4103 , H01L2224/4112 , H01L2224/73263 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84138 , H01L2224/8421 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/9221 , H01L2924/00015 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15724 , H01L2924/19105 , H01L2924/35121 , H01L2924/365 , H01L2924/00 , H01L2924/00014 , H01L2224/291 , H01L2924/014 , H01L2924/00012 , H01L2924/01047 , H01L2224/29294 , H01L2224/293 , H01L2224/48 , H01L2224/85 , H01L2224/83 , H01L2224/84 , H01L2924/01029 , H01L2924/013 , H01L2924/00013
摘要： To provide a semiconductor module that has high reliability of electric connection by a solder and is inexpensive. A joint surface of an electrode-jointing portion (36bb) that is opposed to a surface to be jointed of a gate electrodes (G) of a bare-chip FET (35) and a joint surface of a substrate-jointing portion (36bc) that is opposed to a surface to be jointed of another wiring pattern (33c) include an outgas releasing mechanism that makes outgas generated from a molten solder during solder jointing of a metal plate connector. (3Gb) be released from solders (34c and 34f) interposed between the joint surfaces and the surfaces to be jointed.
摘要翻译：提供一种通过焊料进行电连接的可靠性高且价格便宜的半导体模块。与裸芯片FET（35）的栅电极（G）的接合面和基板接合部（36bc）的接合面相对的电极接合部（36bb）的接合面，与另一布线图案（33c）的待接合表面相对的部分包括排气释放机构，该排气释放机构在金属板连接器的焊接接合期间使熔融焊料产生的排气产生。（3Gb）从插入在接合表面和待接合表面之间的焊料（34c和34f）释放。

2. 发明授权

EP2916348B1 SEMICONDUCTOR MODULE 有权
公开(公告)号：EP2916348B1
公开(公告)日：2020-05-13
申请号：EP13851001.1
申请日：2013-10-25
申请人： NSK Ltd.
发明人： SUNAGA, Takashi , KANEKO, Noboru , MIYOSHI, Osamu
IPC分类号： B62D5/04 , H01L21/60 , H01L25/07 , H01L25/18 , H01L23/00 , H01L23/057

3. 发明授权

EP3255736B1 CONNECTOR WITH SEALING 有权
公开(公告)号：EP3255736B1
公开(公告)日：2020-01-08
申请号：EP16746714.1
申请日：2016-02-05
申请人： NSK Ltd.
发明人： MORIMOTO, Masakazu , OSAKABE, Tadayoshi , MIYOSHI, Osamu
IPC分类号： H01R13/52 , H01R13/41 , H01R12/58

5. 发明授权

EP2919328B1 CONNECTOR 有权
公开(公告)号：EP2919328B1
公开(公告)日：2017-07-19
申请号：EP13854063.8
申请日：2013-10-24
申请人： NSK Ltd.
发明人： MORIMOTO, Masakazu , OSAKABE, Tadayoshi , MIYOSHI, Osamu
IPC分类号： H01R13/41 , H01R13/52 , H01R12/58 , H01R13/04 , H01R13/629 , B60L11/18
CPC分类号： H01R13/40 , B60L11/18 , B60L11/1803 , B60L2240/12 , B60L2240/421 , B60L2240/423 , B60L2240/529 , H01R12/58 , H01R13/04 , H01R13/405 , H01R13/41 , H01R13/521 , H01R13/629 , H01R24/66 , H01R2201/26 , Y02T10/642 , Y02T10/7005

6. 发明公开

EP2955790A1 MULTIPOLE CONNECTOR 有权
标题翻译：多极连接器
公开(公告)号：EP2955790A1
公开(公告)日：2015-12-16
申请号：EP14749617.8
申请日：2014-01-15
申请人： NSK Ltd.
发明人： SUNAGA, Takashi , KANEKO, Noboru , MIYOSHI, Osamu
IPC分类号： H01R12/55 , H01R12/52 , H01R13/405 , H01R24/60 , H01R43/24
摘要： A multipolar connector is provided. It is possible to prevent deformation of a particular pin-shaped terminal of plural pin-shaped terminals arranged in a line in a direction perpendicular to a connection direction of the multipolar connector, and also possible to prevent positional displacements of the particular pin-shaped terminal and other pin-shaped terminals. The multipolar connector (101) includes plural pin-shaped terminals (110) arranged in a line in a direction (arrow X direction) perpendicular to a connection direction (arrow Y direction) of the multipolar connector to extend in the connection direction, and a hold member (120) configured to extend in the direction perpendicular to the connection direction and hold the plural pin-shaped terminals (110) at a predefined pitch. A protection section (121) to protect a particular pin-shaped terminal (110) of the plural pin-shaped terminals (110) is provided at a part of the hold member (120) to extend from the hold member (120) to protrude in the connection direction of the particular pin-shaped terminal (110) to be protected and cover around the particular pin-shaped terminal (110).
摘要翻译：提供多极连接器。可以防止在垂直于多极连接器的连接方向的方向上排列成一列的多个销形端子中的特定销形端子的变形，并且还可以防止特定销形端子的位置偏移和其他针形端子。多极连接器（101）包括：在与多极连接器的连接方向（箭头Y方向）垂直的方向（箭头X方向）上沿连接方向延伸的多个销状端子（110）;以及（120），其被构造成在垂直于连接方向的方向上延伸并且以预定间距保持多个销形端子（110）。用于保护多个销形端子（110）中的特定销形端子（110）的保护部分（121）设置在保持部件（120）的一部分处以从保持部件（120）延伸以突出在要保护的特定销形端子（110）的连接方向上并且覆盖特定销形端子（110）。

7. 发明授权

EP2955790B1 MULTIPOLE CONNECTOR 有权
公开(公告)号：EP2955790B1
公开(公告)日：2020-02-26
申请号：EP14749617.8
申请日：2014-01-15
申请人： NSK Ltd.
发明人： SUNAGA, Takashi , KANEKO, Noboru , MIYOSHI, Osamu
IPC分类号： H01R12/58 , H01R13/405 , H01R24/60 , H01R43/24 , H01R107/00 , H05K1/14

8. 发明授权

EP2982570B1 MOTOR CONTROL DEVICE AND PRODUCTION METHOD THEREFOR 有权
标题翻译：马达控制装置及其制造方法
公开(公告)号：EP2982570B1
公开(公告)日：2017-03-22
申请号：EP14778428.4
申请日：2014-04-02
申请人： NSK Ltd.
发明人： MORIMOTO, Masakazu , OSAKABE, Tadayoshi , MIYOSHI, Osamu
IPC分类号： B62D5/04
CPC分类号： H02K5/225 , B62D5/0406 , H01L2224/4103 , H01L2924/00014 , H02K9/22 , H02K11/33 , H05K13/0023 , Y10T29/49169 , H01L2224/37099

9. 发明公开

EP2916349A1 SEMICONDUCTOR MODULE 有权
标题翻译： HALBLEITERMODUL
公开(公告)号：EP2916349A1
公开(公告)日：2015-09-09
申请号：EP13851225.6
申请日：2013-10-25
申请人： NSK Ltd.
发明人： SUNAGA, Takashi , KANEKO, Noboru , MIYOSHI, Osamu
IPC分类号： H01L21/60 , H01L23/48 , H01L25/07 , H01L25/18
CPC分类号： H05K7/02 , H01L23/142 , H01L23/3735 , H01L23/49811 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/291 , H01L2224/29294 , H01L2224/293 , H01L2224/32227 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37013 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/40095 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4103 , H01L2224/4112 , H01L2224/48 , H01L2224/73263 , H01L2224/77272 , H01L2224/83191 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/85 , H01L2224/9221 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/19105 , H01L2924/3011 , H01L2924/351 , H05K1/181 , H05K2201/10166 , H05K2201/1031 , H05K2201/10409 , Y02P70/611 , H01L2924/00015 , H01L2924/00014 , H01L2224/83 , H01L2224/84 , H01L2224/33 , H01L2924/00012 , H01L2924/00
摘要： To provide a semiconductor module capable of shortening of the manufacturing tact time, reducing the manufacturing costs, and improving assembility. A semiconductor module (30) includes substrate (31) made of metal, an insulating layer (32) formed on the substrate (31), a plurality of wiring patterns (33a to 33d) formed on the insulating layer (32), a bare-chip transistor (35) mounted on a wiring pattern (33a) via a solder (34a); and a metal plate connector (36a, 36b) jointing an electrode (S, G) of the bare-chip transistor (35) and a wiring pattern (33b, 33c) via a solder (34b, 34c) . The metal plate connector (36a, 36b) has a bridge shape, and has a flat surface and a center of gravity at a middle portion of the component.
摘要翻译：提供能够缩短制造节拍时间的半导体模块，降低制造成本，提高组装性。半导体模块（30）包括由金属制成的基板（31），形成在基板（31）上的绝缘层（32），形成在绝缘层（32）上的多个布线图案（33a〜33d）通过焊料（34a）安装在布线图案（33a）上的芯片晶体管（35）; 以及通过焊料（34b，34c）将裸芯片晶体管（35）的电极（S，G）和布线图案（33b，33c）接合的金属板连接器（36a，36b）。金属板连接器（36a，36b）具有桥接形状，并且在部件的中间部分具有平坦表面和重心。

10. 发明公开

EP2916348A1 SEMICONDUCTOR MODULE 审中-公开
标题翻译：半导体模块
公开(公告)号：EP2916348A1
公开(公告)日：2015-09-09
申请号：EP13851001.1
申请日：2013-10-25
申请人： NSK Ltd.
发明人： SUNAGA, Takashi , KANEKO, Noboru , MIYOSHI, Osamu
IPC分类号： H01L21/60 , H01L25/07 , H01L25/18
摘要： A semiconductor module is provided for shortening a manufacturing tact time and reduce manufacturing costs and for ensuring reliability of a bonding portion. The semiconductor module includes a substrate (31) formed of a metal, an insulating layer (32) formed on the substrate (31), a plurality of wiring patterns (33a to 33d) formed on the insulating layer (32), a bare-chip transistor (35) mounted on one wiring pattern (33a) via a solder (34a), and copper connectors (36a, 36b) that connects electrodes (S, G) formed on the bear-chip transistor (35) and other wiring patterns (33b, 33c) via a solder (34b, 34c). The copper connectors (36a, 36b) has a bridge shape, has a width-reduced portion (36ag) formed in the vicinity of the bonding face (36af) to the electrodes (S, G), and has a stress-reducing portion (36ak) formed on the bonding face (36af) bonded to the electrode (S, G).
摘要翻译：提供半导体模块用于缩短制造节拍时间并降低制造成本并确保接合部分的可靠性。半导体模块包括由金属形成的基板（31），形成在基板（31）上的绝缘层（32），形成在绝缘层（32）上的多个布线图案（33a至33d），通过焊料（34a）安装在一个布线图案（33a）上的片状晶体管（35），以及连接形成在该片状晶体管（35）上的电极（S，G）的铜连接器（36a，36b）（33b，33c）通过焊料（34b，34c）连接。铜连接器36a，36b具有桥接形状，在与电极（S，G）的接合面（36af）附近形成有宽度缩小部（36ag），并具有应力缓和部（形成在结合到电极（S，G）的结合面（36af）上。

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