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1. 发明专利

JP2003247921A TREATMENT DEVICE BEFORE WAFER INSPECTION 审中-公开
公开(公告)号：JP2003247921A
公开(公告)日：2003-09-05
申请号：JP2002051557
申请日：2002-02-27
申请人： NSE TEKKU KK , TECHNOS KK
发明人： NAKAZAWA TAKAO , NISHIKATA YASUKATSU , ISHII TAKEYUKI , OTSUKI KAZUFUMI , IMAMURA TAKUMI
IPC分类号： G01N1/28 , G01N33/38
摘要： PROBLEM TO BE SOLVED: To realize a treatment device before wafer inspection capable of improving analysis precision further by devising a drying means used in a treatment process before inspection. SOLUTION: In this treatment device before wafer inspection constituted in such a way that a naturally oxidized film formed on a surface of a silicon wafer 7 (8) is made to react to hydrofluoric acid steam or hydrofluoric acid solution to be dissolved, and liquid droplets S of the dissolved liquid collected in a predetermined section on the silicon wafer are dried by the drying means 9 to process into a dried trace for measuring and analyzing degree of pollution, the drying means 9 is provided with a light source part 15 incorporating a lamp 17 and a light introducing bar 25 extended from the light source part and having a light projection face at a tip. COPYRIGHT: (C)2003,JPO

2. 发明专利

JP2003124176A AUTOMATIC WAFER-CARRIER CLEANING APPARATUS 审中-公开
公开(公告)号：JP2003124176A
公开(公告)日：2003-04-25
申请号：JP2001314530
申请日：2001-10-11
申请人： NSE TEKKU KK
发明人： NISHIKATA YASUKATSU , ISHII TAKEYUKI , OTSUKI KAZUFUMI , KURUSU KATSUHIRO
IPC分类号： B25J15/00 , B25J15/06 , B25J15/08 , B65G49/07 , H01L21/304 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To enhance cleaning-work efficiency by realizing the best handling property while achieving minimization of a clean room in automating wafer- carrier cleaning. SOLUTION: A wafer carrier 1 comprises a front-opened container body 2 and a door 3 which is attached/detached to/from the container body 2 with a locking mechanism. In a clean room, the door 3 is detached from the container body 2, and the both are held in a cleaning machine 6 and are cleaned with a cleaning liquid. Then the door 3 is attached to the container body 2 with the locking mechanism, and the wafer carrier 1 is transferred to the outside of the clean room. The clean room is provided with a loader-unloader unit 10 that rotatively holds the wafer carrier, the cleaning machine 6, and a robot 20 installed between the both. The robot has a first hand part 23 for the container base body and a second hand part 30 for the door. The robot is capable of detaching/attaching the door 3 from/to the container body 2 in the loader- unloader unit 10, and simultaneously transfers the container body 2 and the door 3 between the loader-unloader unit and the cleaning machine.

3. 发明专利

JP2003344243A Method for pretreatment for wafer inspection, and treating device 有权
标题翻译：用于防水检查和处理设备的预处理方法
公开(公告)号：JP2003344243A
公开(公告)日：2003-12-03
申请号：JP2002156835
申请日：2002-05-30
申请人： Nisso Engineering Co Ltd , Nse Tekku Kk , エヌエスイー・テック株式会社 , 日曹エンジニアリング株式会社
发明人： NISHIKATA YASUKATSU , NAKAZAWA TAKAO , ISHII TAKEYUKI , OTSUKI KAZUFUMI , IMAMURA TAKUMI
IPC分类号： G01N1/00 , G01N1/28 , H01L21/306 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To enhance analytical precision, to reduce the size of a device, and to allow simplification of control or the like.
SOLUTION: In this pretreatment method for wafer inspection having a liquid dropping process for dropping a hydrofluoric acid solution on a surface of a silicon wafer W of an inspection object, a liquid collecting process for dissolving a natural oxide film or the like on the surface of the silicon wafer W by the dropped liquid drop to be taken in, and a recovery process for recovering the taken-in liquid drop as a sample for measuring a degree of contamination from the wafer, a common nozzle 2 is used as a nozzle for sucking up the hydrofluoric acid solution used in the liquid dropping process from a container to be dropped on the surface of the silicon wafer, a nozzle for capturing the dropped liquid drop to scan the surface of the silicon wafer, and a nozzle for suction-recovering the liquid drop after the scan as an analyzing sample, the common nozzle 2 is automatically moved to the respective processes under the condition where the nozzle 2 is supported by a nozzle holding and moving mechanism 4, and the nozzle 2 is replaced with a new common nozzle in every silicon wafer of the inspection object.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提高分析精度，减小装置的尺寸，并且允许简化控制等。解决方案：在这种用于将检查对象的硅晶片W的表面上滴加氢氟酸的液滴法的晶片检查预处理方法中，将用于将天然氧化物膜等溶解的液体收集工艺通过滴入的液滴使硅晶片W的表面被吸入，并且用于回收作为用于测量晶片的污染程度的样本的吸收液滴的恢复处理，公共喷嘴2被用作从用于滴落在硅晶片表面的容器中吸出用于滴液过程的氢氟酸溶液的喷嘴，用于捕获滴下的液滴以扫描硅晶片的表面的喷嘴和用于抽吸的喷嘴 - 将扫描后的液滴恢复为分析样品，在喷嘴2被喷嘴保持和m保持的状态下，公共喷嘴2自动移动到各个处理排出机构4，并且在检查对象的每个硅晶片中用新的公共喷嘴代替喷嘴2。版权所有（C）2004，JPO

4. 发明专利

JP2003075312A Processing method and processing device before wafer inspection 审中-公开
标题翻译：加工方法和加工方法在进行检测之前
公开(公告)号：JP2003075312A
公开(公告)日：2003-03-12
申请号：JP2001266653
申请日：2001-09-04
申请人： Nisso Engineering Co Ltd , Nse Tekku Kk , エヌエスイー・テック株式会社 , 日曹エンジニアリング株式会社
发明人： HARADA MICHIYUKI , YONETANI AKIRA , KACHI TOSHIMITSU , HORIKI YASUYUKI , NISHIKATA YASUKATSU , NAKAZAWA TAKAO
IPC分类号： G01N1/00 , G01N1/28 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To improve inspection accuracy and workability by facilitating automation of a manual operation and by allowing a naturally oxidized film on the surface of a wafer to be surely and efficiently taken in a hydrofluoric acid droplet dropped at the same time.
SOLUTION: This processing method and this processing device are used when a hydrofluoric acid is dropped on the surface of a silicon wafer 7 to dissolve and take the naturally oxidized film 7b on the silicon wafer surface in the dropped droplet S, and the droplet S2 is recovered as a sample for measuring the degree of pollution of the silicon wafer. They are provided at least with a droplet dropping means 44 for automatically dropping the hydrofluoric acid droplet S on the silicon wafer surface, a droplet detection means 40 for detecting the position of the droplet S2 after being dropped and moved on the silicon wafer surface, and a jig 60 capable of catching the detected droplet S2 and of sucking and collecting it inside. The jig 60 is movably controlled based on a detection signal of the detection means 40 and catches the detected droplet S2. The droplet can be recovered by sucking and collecting it in the jig 60 after the silicon wafer surface is stroked by the droplet S2.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：通过促进手动操作的自动化以及允许在晶片表面上的自然氧化膜可靠地有效地吸收在同时滴下的氢氟酸液滴中来提高检查精度和可加工性。解决方案：当在硅晶片7的表面上滴加氢氟酸以在滴下的液滴S中溶解并取出硅晶片表面上的自然氧化膜7b时使用该处理方法和该处理装置，并且液滴S2为作为测量硅晶片污染程度的样品回收。它们至少设置有用于自动滴落硅晶片表面上的氢氟酸液滴S的液滴滴落装置44，用于在硅晶片表面上下落和移动之后检测液滴S2的位置的液滴检测装置40，以及夹具60能够捕捉检测到的液滴S2并将其收集并收集在其内部。夹具60基于检测装置40的检测信号可动地控制，并且捕捉检测到的液滴S2。通过在硅晶片表面被液滴S2击打之后，通过将其吸收并收集在夹具60中来回收液滴。

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