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    • 8. 发明申请
    • METHOD AND SYSTEM FOR RAPIDLY DEVELOPING SENS0R-ENABLED SOFTWARE APPLICATIONS
    • 用于快速开发SENSOR启动软件应用的方法和系统
    • WO2008002731A3
    • 2008-11-13
    • PCT/US2007069246
    • 2007-05-18
    • AUGUSTA SYSTEMS INCHARVEY CLINTMOODY JOHNWILLIAMS II JACKIEESPOSITO II PATRICKTHOMAS GEORGEREED JAREDKESECKER II BIRANESPOSITO PATRICK
    • HARVEY CLINTMOODY JOHNWILLIAMS II JACKIEESPOSITO II PATRICKTHOMAS GEORGEREED JAREDKESECKER II BIRANESPOSITO PATRICK
    • G06F9/44
    • G06F8/36
    • The teachings herein disclose methods and apparatus that provide software components (objects) as building blocks for rapidly developing sensor-enabled software applications. In at least one embodiment, a component-based software toolset provides data source components (30) for obtaining sensor data, data series components (32) for automatically collecting sensor data incoming from data source components, data field components (42) for controlling that collection, and data destination components (34) for automatically receiving data from the data series components. By providing methods and properties within these and other components in the toolset, the programmer builds sophisticated, hierarchical data flow processing with little or no manual programming. The toolset may further include group components for merging data from multiple data series components, and for linking different data series components, and the data source/destination component definitions may include network socket-enabled components for LAN, WAN data collection, for example.
    • 本文的教导公开了将软件组件(对象)作为构建块提供的方法和装置,用于快速开发具有传感器功能的软件应用程序。 在至少一个实施例中,基于组件的软件工具集提供用于获取传感器数据的数据源组件(30),用于自动收集从数据源组件传入的传感器数据的数据系列组件(32),用于控制该数据源组件 收集和数据目的地组件(34),用于从数据系列组件自动接收数据。 通过在工具集中的这些和其他组件中提供方法和属性,程序员可以很少或没有手动编程来构建复杂的分层数据流处理。 工具集还可以包括用于合并来自多个数据系列组件的数据的组组件,以及用于链接不同数据系列组件的数据源/目标组件定义可以包括例如用于LAN,WAN数据采集的网络套接字使能组件。
    • 10. 发明申请
    • COMPOSITE FILM FOR BOARD LEVEL EMI SHIELDING
    • 用于板级EMI屏蔽的复合膜
    • WO2012058131A3
    • 2012-06-28
    • PCT/US2011057418
    • 2011-10-24
    • HENKEL CORPCHENG CHIH-MINXIA BOTHOMAS GEORGE
    • CHENG CHIH-MINXIA BOTHOMAS GEORGE
    • H05K9/00H05K3/28
    • G21F1/00H05K9/0088
    • An EMI shielding composite film for use in printed circuit boards has at least two layers, a top layer electrically conductive in all directions (isotropic), and a bottom layer electrically conductive only in the Z (thickness) direction (anisotropic) after thermo-compression. The bottom layer is in contact with the grounding pads of the circuitry of the electronic device to be shielded. The conductive top layer functions similarly to metallic boxes to prevent the electromagnetic radiation from both entering the boxes and escaping into the environment. The bottom layer interconnects the top conductive layer to the grounding pads on the PCB after thermo-compression so that electromagnetic waves collected by the top layer are directed and released to PCB grounding pads through the bottom layer.
    • 用于印刷电路板的EMI屏蔽复合膜具有至少两层,在所有方向上导电的顶层(各向同性)和仅在热压缩后的Z(厚度)方向(各向异性)上导电的底层 。 底层与要屏蔽的电子设备的电路的接地焊盘接触。 导电顶层的作用类似于金属盒,以防止电磁辐射进入箱体并逃逸到环境中。 底层在热压缩之后将顶部导电层与PCB上的接地焊盘相互连接,使得由顶层收集的电磁波通过底层引导并释放到PCB接地焊盘。