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    • 4. 发明专利
    • Electronic substrate protective sheet
    • 电子基板保护板
    • JP2010006954A
    • 2010-01-14
    • JP2008168082
    • 2008-06-27
    • Nof Corp日油株式会社
    • TAKAYAMA SHINSUKEYAMADA TOMIO
    • C08J5/18C08F255/00H05K3/28
    • PROBLEM TO BE SOLVED: To provide an electronic substrate protective sheet having satisfactory adhesiveness to an electronic component and an electronic substrate and having high reliability of a protection function by simultaneously satisfying coating properties and filling properties.
      SOLUTION: The electronic substrate protective sheet is formed by molding a graft copolymer obtained by graft-polymerizing 10 to 30 pts.mass following graft component (b) to 70 to 90 pts.mass following copolymer (a) and has 100 to 1,000 μm thickness. The copolymer (a) is obtained by copolymerizing 60 to 98 mass% olefinic monomer (a1) and 2 to 40 mass% at least one polar monomer (a2) selected from the group consisting of an ethylenic unsaturated carboxylic acid, an ethylenic unsaturated carboxylate and an ethylenic unsaturated dicarboxylic anhydride. The graft component (b) includes 70 to 95 mass% aromatic monofunctional ethylenic unsaturated monomer (b1) and 5 to 30 mass% bifunctional ethylenic unsaturated monomer (b2).
      COPYRIGHT: (C)2010,JPO&INPIT
    • 解决的问题:提供一种电子部件和电子基板的密合性良好的电子基板保护片,通过同时满足涂布性和填充性,具有高可靠性的保护功能。 解决方案:电子基片保护片是通过将共聚物(a)后的接枝组分(b)接枝聚合10〜30质量份至70〜90质量份而得到的接枝共聚物成型而形成的,并具有100〜 厚度为1000μm。 共聚物(a)通过共聚合60〜98质量%的烯烃单体(a1)和2〜40质量%的至少一种选自烯属不饱和羧酸,不饱和羧酸烯键式不饱和羧酸的极性单体(a2)和 烯属不饱和二羧酸酐。 接枝组分(b)包含70至95质量%的芳族单官能烯属不饱和单体(b1)和5至30质量%的双官能烯属不饱和单体(b2)。 版权所有(C)2010,JPO&INPIT
    • 5. 发明专利
    • Thermally melt-adhesive sheet for printed circuit board
    • 印刷电路板用热熔胶片
    • JP2009126900A
    • 2009-06-11
    • JP2007301402
    • 2007-11-21
    • Nof Corp日油株式会社
    • TAKAYAMA SHINSUKEYAMADA TOMIOSONODA KENSAKU
    • C08F255/00C08F279/00C09J7/00C09J151/00
    • PROBLEM TO BE SOLVED: To provide a thermally melt-adhesive sheet for printed circuit boards, having good adhesiveness to metals and substrate resins without causing the sagging of resins on substrates to be adhered and the slippage of adherends even under a high temperature.
      SOLUTION: Provided is the thermally melt-adhesive sheet for printed circuit boards, formed by molding a graft copolymer obtained by grafting 15 to 40 pts.mass of a graft component (b) to 60 to 85 pts.mass of the following copolymer (a). The copolymer (a) is obtained by copolymerizing (a1) 60 to 95 mass% of a non-polar α-olefin or a non-polar conjugated diene with (a2) 5 to 40 mass% of at least one polar monomer selected from the group consisting of ethylenic unsaturated bond-containing carboxylic acids, ethylenic unsaturated bond-containing carboxylic anhydrides, ethylenic unsaturated bond-containing carboxylates, and ethylenic unsaturated bond-containing alcohols. The graft component (b) includes 70 to 95 mass% of a non-polar aromatic monofunctional ethylenic unsaturated monomer (b1) and 5 to 30 mass% of a difunctional ethylenic unsaturated monomer (b2).
      COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供一种用于印刷电路板的热熔粘合片,对金属和基材树脂具有良好的粘合性,而不会使待粘合的基底上的树脂下垂,甚至在高温下也粘附于被粘物的滑动 。 解决方案:提供一种印刷电路板用热熔粘合片,其通过将通过将15〜40质量份的接枝成分(b)接枝至60〜85重量份的接枝共聚物 共聚物(a)。 共聚物(a)通过(a1)将(a1)60〜95质量%的非极性α-烯烃或非极性共轭二烯与(a2)5〜40质量%的至少一种选自 由含烯键式不饱和键的羧酸,含烯键式不饱和键的羧酸酐,含烯键式不饱和键的羧酸酯和含有烯属不饱和键的醇组成的组。 接枝成分(b)包含70〜95质量%的非极性芳香族单官能乙烯性不饱和单体(b1)和5〜30质量%的双官能烯键式不饱和单体(b2)。 版权所有(C)2009,JPO&INPIT