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1. 发明专利

JP2006080250A Supporting plate for soldering 审中-公开
标题翻译：支撑板焊接
公开(公告)号：JP2006080250A
公开(公告)日：2006-03-23
申请号：JP2004261801
申请日：2004-09-09
申请人： Nitto Shinko Kk , 日東シンコー株式会社
发明人： OKAMOTO KINJI
IPC分类号： H05K3/34 , B23K3/00
摘要： PROBLEM TO BE SOLVED: To provide a supporting plate for soldering which reduces the concern of a short circuit, conduction failure, etc., and suppresses heat damage to electrical components in a soldering process.
SOLUTION: The supporting plate is used for soldering a printed wiring board, which is carried out as the supporting plate bears the printed wiring board mounted thereon. The supporting plate has heat resistance sufficient enough to support the printed wiring board in the soldering process, and is made of a heat resistant resin admixture composed of a resin of 100 pts.wt. and an aluminum hydroxide of 50-300 pts.wt.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种焊接用支撑板，其减少了短路，导通故障等的担心，并且抑制了焊接工艺中的电气部件的热损伤。
解决方案：支撑板用于焊接印刷线路板，该印刷电路板在支撑板承载安装在其上的印刷线路板时进行。支撑板具有足够的耐热性以在焊接过程中支撑印刷电路板，并且由由100重量份的树脂组成的耐热树脂混合物制成。和50-300重量份的氢氧化铝版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2004010738A METHOD FOR MANUFACTURING DRY PREPREG AND DRY PREPREG MANUFACTURED BY THIS MANUFACTURING METHOD AND FIBER REINFORCED PLASTIC PRODUCT 审中-公开
公开(公告)号：JP2004010738A
公开(公告)日：2004-01-15
申请号：JP2002165306
申请日：2002-06-06
申请人： NITTO SHINKO KK
发明人： OKAMOTO KINJI
IPC分类号： C08J5/24
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a dry prepreg which excels in mass production and reduces the production cost, a dry prepreg manufactured by using this manufacturing method, and a glass mat laminated sheet product. SOLUTION: The method for manufacturing a dry prepreg comprises mixing a dicyclopentadiene-modified unsaturated polyester with an aromatic radically polymerizable monomer as the essential components, impregnating a glass mat with the obtained mixed solution, and then subjecting the resulting impregnated glass mat to heat drying treatment. The dry prepreg and the glass mat laminated sheet product is manufactured by using this manufacturing method. COPYRIGHT: (C)2004,JPO

3. 发明专利

JP2002322588A METHOD FOR MANUFACTURING MASKING MATERIAL AND MASKING MATERIAL 失效
公开(公告)号：JP2002322588A
公开(公告)日：2002-11-08
申请号：JP2001127391
申请日：2001-04-25
申请人： NITTO SHINKO KK
发明人： OKAMOTO KINJI , YAMAZAKI KAZUICHI , SHINKAWA TAKENOBU
IPC分类号： B29B15/08 , B29K223/00 , B29K267/00 , B29K277/00 , B32B5/28 , B32B25/20 , C25D5/02 , H01L23/50 , H05K3/24
摘要： PROBLEM TO BE SOLVED: To prevent generation and adhesion of carbonized materials at the time of laser machining and thereby to provide a masking material excellent in physical strength, dimensional stability, heat resistance, electrical characteristics and heat and humidity resistant characteristics or the like. SOLUTION: In the masking material and a method for manufacturing the masking material in which an opening is formed by applying laser machining to a laminated body of a fiber-reinforced synthetic resin layer and a silicone rubber layer, an inorganic filler is dispersed and compounded in a heat-resistant synthetic resin in the fiber-reinforced synthetic resin layer so that the carbonized materials generated at the time of laser machining are easily removed.

4. 发明专利

JPH10175261A HEAT INSULATING MATERIAL FOR ELECTROMAGNETICALLY HEATED COOKER 失效
公开(公告)号：JPH10175261A
公开(公告)日：1998-06-30
申请号：JP35960296
申请日：1996-12-17
申请人： NITTO SHINKO KK
发明人： OKAMOTO KINJI
IPC分类号： A47J36/04 , B32B5/00
摘要： PROBLEM TO BE SOLVED: To prevent dust from being dissipated and also enhance heat resistance and durability by providing front and back surface layers with heat resistance and an intermediate layer with heat resistance and heat insulating properties between both surface layers, and binding the surface layers together on the peripheral edge part. SOLUTION: Front and back surface layers 1, 1 with heat resistance are provided and also each of intermediate layers 2 with heat resistance and heat insulating properties is provided between the front/back surface layers 1, 1. In addition, a sealing material 3 is bent in a U-shape and bonded on the peripheral edge parts of both surface layers 1, 1 and the intermediate layers 2, and thus the entire circumferences of the peripheral edge parts of the surface layers 1, 1 are sealed. Further, the front/back surface layers 1, 1 are heat-resistant at about 200 deg.C or more, e.g. within a short time such as one hour or less. Especially, for safety, heat resistance and price, a silicone resin is used, and its layer is 0.025-3mm thick. The intermediate layers 2 are also heat-resistant at 200 deg.C or more and especially an aramid resin with outstanding heat insulating properties is used. The layers 2 are 0.15-15mm thick. For the sealing material 3, a metal tape is of the best choice from the viewpoint of sealing and heat dissipation properties.

5. 发明专利

JP2006137807A Epoxy resin molded article and its production method 审中-公开
标题翻译：环氧树脂模制品及其生产方法
公开(公告)号：JP2006137807A
公开(公告)日：2006-06-01
申请号：JP2004326734
申请日：2004-11-10
申请人： Nitto Shinko Kk , 日東シンコー株式会社
发明人： OKAMOTO KINJI
IPC分类号： C08L63/00 , C08J5/24 , C08K3/22
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin molded article which well retains workability and moldability, and has good heat resistance, good heat conductivity, and high strength.
SOLUTION: This epoxy resin molded article whose reinforcing material is impregnated with an epoxy resin is characterized in that aluminum hydroxide powder having a large diameter particle group having particle diameters of 15 to 100 μm and a small diameter particle group having particle diameters of 250.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种良好地保持加工性和成型性的环氧树脂模塑制品，并且具有良好的耐热性，良好的导热性和高强度。解决方案：该增强材料用环氧树脂浸渍的环氧树脂成型体的特征在于，具有粒径为15〜100μm的大直径粒子群的氢氧化铝粉末和粒径为 <4μm配合量为250〜350重量份。每100 pts.wt 的环氧树脂，环氧树脂包含≥70质量％的环氧当量≤250的环氧树脂和环氧当量> 250的环氧树脂。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005089648A Electrical insulation molding 审中-公开
标题翻译：电绝缘成型
公开(公告)号：JP2005089648A
公开(公告)日：2005-04-07
申请号：JP2003326487
申请日：2003-09-18
申请人： Nitto Shinko Kk , 日東シンコー株式会社
发明人： OKAMOTO KINJI
IPC分类号： C08J5/24 , B29C43/00 , B29K67/00 , B29K105/08 , C08K3/22 , C08K7/14 , C08L67/06 , H01B3/00 , H01B3/02
摘要： PROBLEM TO BE SOLVED: To provide an electrical insulation molding markedly improved in arc resistance without detriment to its good moldability.
SOLUTION: The electrical insulation molding is prepared by impregnating a reinforcement with a mixture containing a particulate filler, and a curing agent for the binder resin to form a prepreg and molding the formed prepreg and is characterized in that the filler has a particle size distribution containing at least 70 mass% (in total) larger particle diameter particles of a particle diameter of 15 to 100 μm and smaller particle diameter particles of a particle diameter of below 4 μm, the mass ratio of (the content of the larger particle diameter particles) to (the content of the smaller particle diameter particles) is 10:6 to 10:14, and the content of the filler is 75 to 85 mass% based on the total of the mass of the binder resin and the mass of the nonvolatiles of the curing agent for the binder resin.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供电绝缘性显着提高的电绝缘成型，而不损害其良好的成型性。解决方案：通过用含有颗粒填料的混合物浸渍增强剂和用于粘合剂树脂的固化剂以形成预浸料并模制所形成的预浸料坯来制备电绝缘模制件，其特征在于，所述填料具有颗粒尺寸分布包含至少70质量％（总计）粒径为15〜100μm的较大粒径的粒子和粒径小于4μm的较小粒径的粒子，（大粒子的含量）直径颗粒）与（较小粒径颗粒的含量）之比为10:6至10:14，并且填料的含量相对于粘合剂树脂的总质量为75〜85质量％，质量为用于粘合剂树脂的固化剂的非挥发物。版权所有（C）2005，JPO＆NCIPI

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