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1. 发明专利

JP2004014975A Flexible circuit board with metal foil 审中-公开
公开(公告)号：JP2004014975A
公开(公告)日：2004-01-15
申请号：JP2002169645
申请日：2002-06-11
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： YOSHIMI TAKESHI , OWAKI YASUHITO , TOJO YASUHISA
IPC分类号： H05K1/09 , H05K1/05
摘要： PROBLEM TO BE SOLVED: To provide a flexible circuit board having a metal foil, which has less variations in warping without making the metal foil thick. SOLUTION: A flexible circuit board has an insulation layer on the main surface of the metal foil, a wiring pattern, and a covering resin layer all laminated in this order. The wiring pattern is made by laminating 2 to 4 metal layers so that the pattern becomes 50 μm thick or thinner. The metal base layer neighboring the insulation layer is made 0.1 μm thick or thinner. COPYRIGHT: (C)2004,JPO

2. 发明专利

JPH11233906A CIRCUIT BOARD 失效
公开(公告)号：JPH11233906A
公开(公告)日：1999-08-27
申请号：JP2693298
申请日：1998-02-09
申请人： NITTO DENKO CORP
发明人： OMOTE TOSHIHIKO , OWAKI YASUHITO , ITO KENICHIRO
IPC分类号： H05K1/09 , H05K1/02 , H05K3/24
摘要： PROBLEM TO BE SOLVED: To prevent the occurrence of short circuits due to ion migration, even if spaces between wirings on a conductive circuit are narrow by coating the entire surface of the conductor circuit which does not make contact with an insulating layer, with a metallic thin film formed through electroless plating. SOLUTION: The entire surface of a conductor circuit 1 which is not in contact with an insulating layer 2 is coated with a metallic thin film 3 formed by electroless plating. The coverage by the metallic thin film 3 is set to 95% or more of the surface of the conductor circuit 1 which is not in contact with the insulating layer 2. A metallic base 4 is disposed under the insulating layer 2, and a cover lay 5 is formed on the conductor circuit 1. In order to prevent ion migration which starts from the end of the conductor circuit 1, it is preferable to dispose the end of the conductor circuit 1 entered in on the inner side of the end of the insulating layer 2 preferably by 0.01-0.02 mm. In this way, no short circuit due to ion migration will occur between the wirings of the conductor circuit.

3. 发明专利

JPH08306726A WIRE BONDER AND BONDING METHOD 失效
公开(公告)号：JPH08306726A
公开(公告)日：1996-11-22
申请号：JP13590595
申请日：1995-05-08
申请人： NITTO DENKO CORP
发明人： OWAKI YASUHITO , MOTOGAMI MITSURU
IPC分类号： H01L21/60
摘要： PURPOSE: To provide a wire bonding method in which a sufficient bonding strength is ensured by suppressing the bending moment generated together with the looping of wire thereby minimizing the reaction acting at the bonded part. CONSTITUTION: In a method for wire bonding a semiconductor chip by thermocompression or ultrasonic thermocompression, the wire bonding is carried out while heating only the wire 3 side. Alternatively, a body 1 to be bonded is heated additionally when the wire 3 side is heated.

4. 发明专利

JPH07312466A WIRING BOARD 失效
公开(公告)号：JPH07312466A
公开(公告)日：1995-11-28
申请号：JP10295194
申请日：1994-05-17
申请人： NITTO DENKO CORP
发明人： OWAKI YASUHITO , MOTOGAMI MITSURU
IPC分类号： H05K1/02 , H05K1/03 , H05K3/38
摘要： PURPOSE:To realize the migration resistance and long-term insulation properties of a wiring board by a method wherein insulative bonding agent layers are formed of a formation material of a specified glass transition temperature or higher and insulative bonding agent layers, which correspond to wiring conductors, are formed of a formation material of the specified glass transition temperature or lower between the insulative bonding agent layers and a plurality of the wiring conductors. CONSTITUTION:A wiring board 1 is formed by a method wherein each insulative bonding agent layer 12 is formed on both surfaces of an insulating base film 11, a plurality of wiring conductors 14 are formed on each of the two insulative bonding agent layers 12 at prescribed intervals between them and moreover, insulative bonding agent layers 3, which correspond to the conductors 14, are respectively formed between the two layers 12 and the conductors 14. The layers 12 are formed of a formation material of a glass transition temperature of 100 deg.C or higher and the layers 13 are formed of a formation material of a glass transition temperature of 80 deg.C or lower. Thereby, the layers 13, in which a migration is easy to generate, do not exist between the conductors 14 and the migration resistance and long-term insulation reliability of the wiring board can be realized.

5. 发明专利

JPH07270478A CROSSTALK INSPECTION METHOD FOR PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH07270478A
公开(公告)日：1995-10-20
申请号：JP8739194
申请日：1994-03-31
申请人： NITTO DENKO CORP
发明人： MOTOGAMI MITSURU , OWAKI YASUHITO
IPC分类号： G01R31/02 , G01R27/26
摘要： PURPOSE:To eliminate a problem on reflection and easily inspect a crosstalk by measuring a crosstalk between wires with pulses as well as capacitance between the wires for evaluation on the basis of a preliminarily obtained relationship between the crosstalk and capacitance. CONSTITUTION:A characteristic impedance matching resistor R0 is connected to both ends of each of wired conductors 11 and 12 of each measuring printed circuit board, and a pulse is inputted to the deriving side conductor 11 from a pulse generator 4. On the other hand, output induced in the derived side conductor 12 is measured with a wide band oscilloscope 5. A crosstalk coefficient is, then, obtained from a ratio of output to input. Furthermore, the resistor R0 is detached and capacitance between the wiring conductors 11 and 12 is measured with an impedance analyzer or the like, thereby showing graphically a relationship between the crosstalk and the capacitance in advance. Then, capacitance between the wires of a printed circuit board as an inspection object is measured, and resulting capacitance is collated with the graph for evaluating a crosstalk.

6. 发明专利

JPH0351802A PRODUCTION OF MULTILAYERED ANTIREFLECTION FILM 失效
公开(公告)号：JPH0351802A
公开(公告)日：1991-03-06
申请号：JP18809689
申请日：1989-07-20
申请人： NITTO DENKO CORP
发明人： MIYAZAKI TSUKASA , OWAKI YASUHITO
IPC分类号： G02B1/11 , G02B1/115
摘要： PURPOSE:To improve productivity and workability by interposing a specific deposition preventive plate for successively and continuously forming a perpendicularly vapor-deposited film and diagonally vapor-deposited film in the flow direction of a film base material between a vapor deposition roll and an evaporating source. CONSTITUTION:The device is constituted to execute the vacuum deposition of the evaporating source 6 on the vapor deposition roll 4 onto the film base material 5. The deposition preventive plate 7 having a through-hole for forming the perpendicularly vapor-deposited film and a through-hole 7a for forming the diagonally vapor-deposited film is interposed between the vapor deposition roll 4 and the evaporating source 6. The perpendicularly vapor-deposited film is first formed in the part 4A on the vapor deposition roll 4 via the through-hole 7a of the deposition preventive plate 7 and further, the diagonally vapor-deposited film is formed in the part 4b on the vapor deposition roll 4 through the through-hole 7b of the deposition preventive plate 7. Namely, the 1st layer consisting of a dielectric layer 60A of a high refractive index which is the perpendicularly vapor-deposited film is formed on the film base material 5 and the 2nd layer consisting of a dielectric layer 60B having of a low refractive index which is the diagonally vapor-deposited film are successively and continuously laminated and formed in this order. The films are thus formed with good productivity and workability.

7. 发明专利

JPH02234101A PRODUCTION OF MULTILAYRED ANTIREFLECTION MATERIAL 失效
公开(公告)号：JPH02234101A
公开(公告)日：1990-09-17
申请号：JP5438489
申请日：1989-03-07
申请人： NITTO DENKO CORP
发明人： MIYAZAKI TSUKASA , OWAKI YASUHITO
IPC分类号： G02B1/11 , G02B1/115
摘要： PURPOSE:To form two antireflection layers which are in contact with each other and are different in refractive index from each other by using the same material and forming the low-refractive index layer of the antireflection layers in such a manner that a transparent base material is disposed diagonally with an evaporating source and is subjected to vapor deposition. CONSTITUTION:The evaporating source 1 and the transparent base material 2 are so disposed that the angle theta between both 1 and 2 attains 90 deg.. The 1st antireflection layer 3 is formed by vapor deposition on the surface of the transparent base material 1. The angle theta is then so adjusted as to attain about 20 to 60 deg. and the 2nd antireflection layer 4 is formed by vapor deposition on the 1st antireflection layer by using the same evaporating source 1 as the evaporating source used for forming the 1st antireflection layer 3. The multilayered antireflection material to be obtd. in such a manner is laminated successively with the high-refractive index layer 3 and the low-refractive index layer 4 on the transparent base material 2. The formation of the high-refractive index layer 3 and the low-refractive index layer 4 in contact with each other of the same material is possible in this way and the laborious operation of changing the evaporating source 1 is eliminated.

8. 发明专利

JP2010029713A Catheter and manufacturing method for the same 有权
标题翻译：导管及其制造方法
公开(公告)号：JP2010029713A
公开(公告)日：2010-02-12
申请号：JP2009258084
申请日：2009-11-11
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： KANETO MASAYUKI , OWAKI YASUHITO , OSAWA TETSUYA
IPC分类号： A61B5/0215 , A61B5/00 , A61B5/01
摘要： PROBLEM TO BE SOLVED: To provide a catheter, reducing increase in thickness of a tube due to a multiplication of a signal wire connected to an electronic part in an electronic part-mounted type catheter. SOLUTION: In this catheter 100, the electronic part 2 is mounted in a front end or an intermediate part of a tube 1, the signal wire electrically connected to the electronic part 2 is arranged from the vicinity of the electronic part 2 through the inside of the tube 1 to the rear end part of the tube 1. The catheter includes a wiring pattern 4 of a flexible wiring circuit board 10 where the signal wire is inserted in the tube 1. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种导管，由于连接到电子部件安装型导管中的电子部件的信号线的乘法，减小了管的厚度增加。
解决方案：在该导管100中，电子部件2安装在管1的前端或中间部分，电连接到电子部件2的信号线从电子部件2的附近通过管1的内部连接到管1的后端部。导管包括柔性布线电路板10的布线图案4，其中信号线插入管1中。版权所有（C）2010 ，JPO＆INPIT

9. 发明专利

JP2006179606A Wiring circuit board 审中-公开
标题翻译：接线电路板
公开(公告)号：JP2006179606A
公开(公告)日：2006-07-06
申请号：JP2004369871
申请日：2004-12-21
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： OWAKI YASUHITO
IPC分类号： H05K1/02 , H01L23/12 , H05K1/18
CPC分类号： H05K1/111 , H01L21/4857 , H01L21/563 , H01L23/13 , H01L23/36 , H01L23/3677 , H01L23/49822 , H01L24/32 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01004 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15153 , H01L2924/3025 , H05K1/0206 , H05K1/056 , H05K3/108 , H05K3/423 , H05K2201/09554 , H05K2201/09845 , H05K2201/10674 , H05K2203/0733 , Y02P70/611 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide a wiring circuit board for obtaining excellent heat radiating property even when semiconductor devices are mounted with the flip-chip mounting system.
SOLUTION: A base aperture 8 and a thin layer 9 surrounding the base aperture 8 are formed on a base insulating layer 3 corresponding to a mounting portion 7. Moreover, the internal terminal 15 of a terminal 13 is arranged on the thin layer 9 and a heat radiator 17 is formed within the base aperture 8 in contact with a reinforcing portion 2. Accordingly, since the front surface of the internal terminal 15 is arranged lower than the front surface of the heat radiator 17, a semiconductor element S and the heat radiator 17 mounted via a bump 25 can be provided adjacently. As a result, excellent heat radiating property can be attained because the heat generated by semiconductor element S can be efficiently transmitted to the reinforcing plate 2 via the heat radiator 17, while the semiconductor element S is surely mounted to the wiring circuit board 1.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：即使当半导体器件安装有倒装芯片安装系统时，也提供一种用于获得优异散热特性的布线电路板。解决方案：基座孔8和围绕基座8的薄层9形成在对应于安装部分7的基底绝缘层3上。此外，端子13的内部端子15布置在薄层 9和散热器17形成在与加强部分2接触的基座孔8内。因此，由于内部端子15的前表面布置成比散热器17的前表面低，所以半导体元件S和经由凸块25安装的散热器17可以相邻地设置。结果，由于半导体元件S产生的热能够通过散热器17有效地传递到加强板2，同时半导体元件S可靠地安装到布线电路板1上，所以可以获得优异的散热性能。 P>版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2006165268A Wiring circuit board and its connection structure 有权
标题翻译：接线电路及其连接结构
公开(公告)号：JP2006165268A
公开(公告)日：2006-06-22
申请号：JP2004354531
申请日：2004-12-07
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： OYABU KYOYA , OWAKI YASUHITO
IPC分类号： H05K1/11 , G11B5/60 , H05K1/02 , H05K1/14
CPC分类号： H05K3/363 , H05K1/056 , H05K3/3442 , H05K3/366 , H05K2201/0394 , H05K2201/09181 , H05K2203/167
摘要： PROBLEM TO BE SOLVED: To provide a wiring circuit board which ensures a high accuracy interconnection of circuit boards in mutually intersecting directions by a simple constitution while devising its miniaturization, and the connection structure of the wiring circuit boards connected in mutually intersecting directions.
SOLUTION: Relay side terminals 9 of a suspension board 1 with circuits are disposed along its widthwise one end edge, and in the relay side terminals 9 have each a terminal side notch 10 cut widthwise inward from its one end edge approximately like a half arc. Base insulation layer notches 12 corresponding to the terminal side notches 10 are formed on a first base insulation layer 3. Bumps 29 on the suspension side terminals 26 of a relay flexible wiring circuit board 21 are fitted into the terminal side notches 10 to electrically connect them.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种布线电路板，其通过简单的结构确保电路板在相互交叉的方向上的高精度互连，同时设计其小型化，以及连接在相互交叉的方向上的布线电路板的连接结构。解决方案：具有电路的悬架板1的继电器侧端子9沿其宽度方向一端边缘设置，并且在继电器侧端子9中具有从其一个端部边缘宽度方向向内切割的端子侧切口10，半弧。在第一基底绝缘层3上形成有对应于端子侧凹口10的基底绝缘层凹口12.中继柔性布线电路板21的悬挂侧端子26上的凸起29嵌合到端子侧凹口10中以将它们电连接。版权所有（C）2006，JPO＆NCIPI

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