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    • 2. 发明专利
    • METHOD FOR ATTACHING VAPOR DEPOSITION MATERIAL IN VACUUM EVAPORATOR
    • JPS6475667A
    • 1989-03-22
    • JP23426887
    • 1987-09-18
    • NIPPON KENTETSU CO LTD
    • FUTAGAWA JUNZONAMEKAWA KEN
    • C23C14/24
    • PURPOSE:To ensure the attachment of a vapor deposition material to a heating body and to efficiently carry out vapor deposition, by forming a vapor deposition material into tubular state and passing a heating body through the above tube to hold the vapor deposition material. CONSTITUTION:A couple of electrodes 2 are provided to the inside of a vacuum vessel 1 and a heating body 3 is disposed between the above electrodes 2, and a vapor deposition material A is attached to the heating body 3 to apply a vapor-deposited film to a material 4 to be vapor-deposited. At this time, the vapor deposition material A is formed into a shape of a tube having a diameter properly larger than that of the heating body 3 and the length of the above tube is regulated so that it is practically equal to that of the heating body 3, and then, the heating body 3 is passed through the internals space of this vapor deposition material A. Further, one end or both ends of the vapor deposition material A are caulked, if necessary. By this method, the attachment of the vapor deposition material A to the heating body 3 can be ensured and the dropping of the vapor deposition material A at the time of vapor deposition can be prevented.
    • 3. 发明专利
    • SPUTTERING DEVICE
    • JPS6379967A
    • 1988-04-09
    • JP22414486
    • 1986-09-23
    • NIPPON KENTETSU CO LTD
    • NAMEKAWA KEN
    • C23C14/56C23C14/50
    • PURPOSE:To increase the number of substrates to be treated in one process by detaining the outer periphery of a substrate holder in the title sputtering device, and fixing the holder to an electrode on the substrate side to enable the fixing of the substrate on the central part of the holder. CONSTITUTION:When the substrate holder 5 fitted with plural substrates 4 is set above a target electrode in a sputtering chamber, a member in the form of an inverted bowl provided with the detaining claws 9a arranged at three sites on the tip circumference at a 120 deg. angle away from each other is used as a mechanism 9 for mounting the substrate holder 5. The mounting mechanism 9 is provided with linkages L1 and L2 connected to a cylinder 11, and the mounting mechanism 9 can be approached to the target electrode in the sputtering chamber by the action of the cylinder 11. The substrate holder 5 has one substrate insertion hole 5a at the center and the six holes on the outer periphery, and hence the substrate can be fixed even at the center. Since detaining protrusions 5b are provided on the outer periphery at a 120 deg. angle away from each other, the holder can be easily attached and detached by virtue of the detaining claws 9a of the mounting mechanism.
    • 4. 发明专利
    • VAPOR DEPOSITION DEVICE FOR THIN FILM
    • JPH01123069A
    • 1989-05-16
    • JP27888087
    • 1987-11-04
    • NIPPON KENTETSU CO LTD
    • NAMEKAWA KEN
    • H01L21/203C23C14/50
    • PURPOSE:To enable the setting such as change of vapor deposition surfaces according to the vapor deposition conditions of work pieces by associating the rotating mechanism of a work piece holder and the rotating mechanism of a jig table to each other by respective driving means and driving the mechanisms independently. CONSTITUTION:The jig table 4 is rotatably provided around a base plate 2 installed with a vapor deposition source 3 and the work piece holders 5 are erected thereon at adequate intervals. A part on the outside circumference of the rear face of the jig table 4 is stepped and the outside circumference of said part is formed as a table gear 6. A motor 9 for control is connected to a driving gear 7 to be engaged therewith. A driven gear 10 is mounted to the end of a holder shaft 5a of the work piece holders 5 and the holders 5 are turned on the jig table 5 by a motor 14 for control. A ring gear 12 is disposed to the outside circumferential part of the base plate 2. This gear 12 is rotated concentrically with the jig table 4 or is rotated independently from each other. The settings such as the fixing and varying of the revolution and rotation of the holders 5 and the table 4 and change of the vapor deposition surfaces at the time of the revolution are thereby executed arbitrarily.
    • 6. 发明专利
    • FILTER AND METHOD FOR WASHING FILTER MEDIUM
    • JPH0631113A
    • 1994-02-08
    • JP34524992
    • 1992-12-01
    • NIPPON KENTETSU CO LTD
    • NAMEKAWA KENINABA MASAYOSHI
    • B01D24/02B01D24/00B01D24/46B01D29/46B01D29/62
    • PURPOSE:To wash a filter medium with a small quantity of washing water and in a short time although in a conventional device for rapid filtration where a filter medium is installed in a closed filtering tank, the washing of the filter medium is made by backwash and a large amount of washing water and a lot of time are required and the clogging is caused in a short time particularly when treated water after biological treatment is filtered. CONSTITUTION:A receiving plate 7 and a press plate 8 which are water permeable are provided in a filtering tank and between them are inserted filter media 6 in the shape of a small sphere in a wire rod bundle in layers and the press plate is constituted so that it can vertically be moved. The filter media are washed by the compression and vertical movement of the press plate. In another embodiment, a basket 15 in the shape of a sphere is installed in a filtering tank and a movable partition plate 16 is installed in the basket and similar filter media in the shape of a small sphere are inserted in the basket in layers. And when the filter media are washed, the tank filter is filled with washing water to agitate them and the washing water is discharged and this operation is repeated several times. This is what is called a batch system.
    • 8. 发明专利
    • SPUTTERING FILM FORMING APPARATUS
    • JPH01147066A
    • 1989-06-08
    • JP30376987
    • 1987-12-01
    • NIPPON KENTETSU CO LTD
    • NAMEKAWA KEN
    • C23C14/54H01L21/203
    • PURPOSE:To accurately control the thickness of a film formed on a substrate without lowering film-forming efficiency by disposing a monitor glass on the opening on the target side of an optical axis cylinder passed through the rotating shaft of a substrate holder and detecting the thickness of a film formed on the monitor glass. CONSTITUTION:An optical axis cylinder 81 is provided so that it is passed through the rotating shaft 8 of a substrate holder 2, and a monitor glass G is disposed at the target-side opening 82 of the optical axis cylinder 81. By rotating the substrate holder 2, sputter atoms sputtered from a target 3 are allowed to adhere uniformly to respective substrates 21. At this time, light is emitted from a floodlight-projecting part 12 and transmitted via a a floodlight-projecting window 11 by the monitor glass G, and then, the quantity of the transmitted light is detected via a transparent window 84 by means of a received light-detecting part 9. Then, based on the difference between the light quantity from the floodlight-projecting part 12 and the light quantity detected by the received light-detecting part 9, the thickness of a film on the monitor glass G is detected. This film thickness is determined, in the above state or after subjected to conversion measurement, as the thickness of a film on the substrates 21, by which the thickness of the film on the substrates 21 can be controlled.
    • 9. 发明专利
    • METHOD FOR ATTACHING VAPOR DEPOSITION MATERIAL IN VACUUM EVAPORATOR
    • JPS6475666A
    • 1989-03-22
    • JP23426787
    • 1987-09-18
    • NIPPON KENTETSU CO LTD
    • FUTAGAWA JUNZONAMEKAWA KEN
    • C23C14/24
    • PURPOSE:To ensure the attachment of a vapor deposition material to a heating body and to efficiently carry out vapor deposition, by forming a vapor deposition material into a coil state and then passing a heating body through the above coil. CONSTITUTION:A heating body 3 is provided between a couple of electrodes 2 disposed in a vacuum vessel 1 and a vapor deposition material A is attached to the above to apply a vapor-deposited film to a material 4 to be vapor- deposited. At this time, first the vapor deposition material A consisting of a wire is formed into the state of a coil having a diameter properly larger than that of the heating body 3. Subsequently, the heating body 3 is passed through the inside of the coil-shaped vapor deposition material A, and, if necessary, one end or both ends of the vapor deposition material A are caulked. By this method, the attachment of the vapor deposition material A to the heating body 3 can be efficiently carried out, and the dropping of the vapor deposition material A in the diffusion of the vapor deposition material A at the time of vapor deposition can be prevented.
    • 10. 发明专利
    • AUTOMATIC VALVE FOR VACUUM APPARATUS
    • JPS61262285A
    • 1986-11-20
    • JP10085785
    • 1985-05-13
    • NIPPON KENTETSU CO LTD
    • NAMEKAWA KEN
    • F16K31/44
    • PURPOSE:To open and close a valve having a large diameter and a large stroke by a relatively small electromagnetic coil by using a pair of arms which are pivotally supported and operated by electromagnetic coils and returned by springs. CONSTITUTION:The engagement parts 12 and 22 at the top edge of the arms 10 and 20 which are operated by electromagnetic coils 14 and 24 and returned by spring 15 and 25 are allowed to contact with a rod 1 installed onto a valve body 7. Each of the engagement parts 12 and 22 of the arms 10 and 20 possesses the engagement action in one direction. Further, the engagement part 12 of the first arm 10 is shifted to the position free from the engagement at the stroke edge. Further, the engagement part 22 of the second arm 20 shifts to the position where the rod 1 is not urged by the urging of the related electromagnetic coil 24. With such constitution, a valve having a large diameter and a large stroke can be opened and closed by a relatively small electromagnetic coil.