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1. 发明专利

JPH03222898A PUMPING PLANT 失效
公开(公告)号：JPH03222898A
公开(公告)日：1991-10-01
申请号：JP1592190
申请日：1990-01-25
申请人： NIKOKU KIKAI KOGYO KK , OMI TADAHIRO
发明人： OMI TADAHIRO , SATOU ROKUHEIJI
IPC分类号： F04D29/10 , F04D5/00 , F04D29/12
摘要： PURPOSE:To prevent any friction powder due to sliding contact from mixing into a fluid passage by installing an exhaust passage for a fluid at the fluid passage side in a range from a sliding contact part between a rotary seal body and a fixed seal body to a ring seal part lying between the rotary seal body and a turning shaft. CONSTITUTION:A liquid such as extrapure water or the like being sucked in a fluid passage 37 is enhanced of its pressure by a blade groove 35b of an impeller 35 and then discharged out of a discharge port. At time of rotation of this impeller, a fixed seal body 26 of a mechanical seal 6 and a rotary seal body 29 being pressed by a spring 30 are made slidingly contact with each other whereby some friction powder are produced there. A shaft hole 42 is formed in the central part of a turning shaft 7, while each of through holes 43, 44 is installed at both sides of an O-ring seal 28 on an outer surface of the turning shaft 7, and they are connected to the shaft hole 42, namely, used as an exhaust passage 41. Therefore no friction powder is mixed in the fluid flowing in a shaft through part 1a between the mechanical seal 6 and the turning shaft 7 from the fluid passage 37 under pressure, thus it is discharged out of the exhaust passage 41 without being mixed in the friction powder and the fluid passage 37.

2. 发明专利

JPH03206396A PUMP 失效
公开(公告)号：JPH03206396A
公开(公告)日：1991-09-09
申请号：JP34199189
申请日：1989-12-30
申请人： OMI TADAHIRO , NIKOKU KIKAI KOGYO KK , NICHIZOU SEIMITSU KENMA KK
发明人： OMI TADAHIRO , OOSAKI SANNOJIYOU , SATOU ROKUHEIJI , SATO KENJI
IPC分类号： F04D5/00 , F04B53/00 , F04D29/40 , H01L21/304
摘要： PURPOSE:To feed highly pure liquid by forming at least main part of the outer surface of a liquid contact section in a pump, from a material having a surface subjected to mirror-surface finish by an electrolytic composite polishing so as to reduce fine particles and the elusion of metal. CONSTITUTION:In a pump, for example, a vortex flow pump, a plurality of blades 18 are formed at the peripheral edge of a disc. An impeller 12 fitted on a rotary shaft 16 is journalled to a bearing 17 through the intermediary of a seal box 14. Further, the casing 13 and the impeller 12 define therebetween a fluid passage 20 which is communicated with a fluid inlet port 19. With this arrangement, at least a main part of the outer surface of a liquid contact part in the pump is formed from a material having a surface subjected to mirror- surface finish by electrolytic composite polishing. Further, the surface roughness of the mirror surface is set to a value less than 0.1mumRmax. Thereby, it is possible to feed liquid having a high purity near to a theoretical purity.

3. 发明专利

JP2003224079A HEAT TREATING METHOD, HEAT TREATING DEVICE AND MANUFACTURING METHOD FOR SILICON EPITAXIAL WAFER 审中-公开
公开(公告)号：JP2003224079A
公开(公告)日：2003-08-08
申请号：JP2002023684
申请日：2002-01-31
申请人： SHINETSU HANDOTAI KK , OMI TADAHIRO
发明人： KANETANI KOICHI , NISHIZAWA TAKESHI , OMI TADAHIRO , SUGAWA SHIGETOSHI
IPC分类号： H01L21/677 , H01L21/205 , H01L21/324 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a heat treating method capable of reducing the amount of brought-in moisture to a heat treating chamber (reaction chamber), a heat treating device and a manufacturing method for a silicon epitaxial wafer. SOLUTION: The heat treating method is for executing a heat treatment to a silicon single crystal substrate W by using a heat treating device 10 provided with a load lock chamber 20, a heat treating chamber 30, and a transfer chamber 40 for transferring the silicon single crystal substrate W between the load lock chamber 20 and the heat treating chamber 30. After performing work for enabling the atmosphere outside the heat treating device 10 to flow into the transfer chamber 40, a transfer chamber inner wall heating process is executed for heating the inner wall of the transfer chamber 40 to a temperature lower than the temperature of the heat treatment performed in the heat treating chamber 40. Thereafter, the silicon single crystal substrate W inside the load lock chamber 20 is carried through the transfer chamber 40 to the heat treating chamber 30, and the heat treatment is performed in the heat treating chamber 30. COPYRIGHT: (C)2003,JPO

4. 发明专利

JP2003214671A CLEAN ROOM 审中-公开
公开(公告)号：JP2003214671A
公开(公告)日：2003-07-30
申请号：JP2002014906
申请日：2002-01-24
申请人： OMI TADAHIRO , KUMAGAI GUMI CO LTD
发明人： OMI TADAHIRO , YAMADA TAKAHISA , SUMIHAMA HIROSHI , NAKAZAWA KATSUNORI , SUZUKI HIROKAZU , MURAOKA KENJI , MIURA MASAYASU
IPC分类号： E04F13/07 , E04F13/00 , E04F13/08 , E04F15/18 , E04H5/02 , F24F7/06
摘要： PROBLEM TO BE SOLVED: To solve a problem of a conventional clean room, wherein anti-static measures for walls and floors are not sufficiently made, so they are electrically charged, dusts accumulate due to static charge, a static electricity spark causes organic reaction, and then gas generate, causing problems in manufacturing semiconductors. SOLUTION: This clean room has a conductive sheet floor finishing material (conductive vinyl chloride sheet 4) extending to a wall substrate surface (2), and has a conductive sheet wall finishing material (conductive cloth 5) through which electricity is conducted to the sheet floor finishing material extending to the wall substrate surface. COPYRIGHT: (C)2003,JPO

5. 发明专利

JP2003213952A STRUT BASE WRAPPER FOR CLEAN ROOM 审中-公开
公开(公告)号：JP2003213952A
公开(公告)日：2003-07-30
申请号：JP2002014925
申请日：2002-01-24
申请人： OMI TADAHIRO , KUMAGAI GUMI CO LTD
发明人： OMI TADAHIRO , YAMADA TAKAHISA , SUMIHAMA HIROSHI , NAKAZAWA KATSUNORI , SUZUKI HIROKAZU , MURAOKA KENJI , MIURA MASAYASU
IPC分类号： E04B1/24 , E04H5/02
摘要： PROBLEM TO BE SOLVED: To solve a problem of a conventional clean room base wrapper, the problem being caused by non-conduction thereof to a steel strut and difficult grounding of current charged on a surface of the steel strut, resulting in stagnation of electric charge on the surface of the steel strut and adverse effect on semiconductor production, etc. SOLUTION: There is provided a new strut base wrapper 1 for the clean room, which consists of a base wrapping frame 2, and base wrapping concrete 5. The base wrapping frame 2 is formed of an electric conductor, and encloses the periphery of a base of the strut 42 in a manner being spaced away from the strut so as to form a space in which concrete is placed. The base wrapping concrete 5 is placed in the space between the base wrapping frame 2 and the strut 42. An inner side of the base wrapping frame 2 is electrically connected to the strut 42 via a conductive rod 4. Further, a surface of the strut, a floor surface, and an upper surface of the base wrapping concrete are subjected to conductive treatment, and the strut surface and the floor surface which have been subjected to the conductive treatment are brought into conduction with each other via the upper surface of the base wrapping concrete which has been subjected to the conductive treatment, and the conductive base wrapping frame. COPYRIGHT: (C)2003,JPO

6. 发明专利

JP2003213917A PERFORATED FLOOR OF CLEAN ROOM 审中-公开
公开(公告)号：JP2003213917A
公开(公告)日：2003-07-30
申请号：JP2002014936
申请日：2002-01-24
申请人： OMI TADAHIRO , KUMAGAI GUMI CO LTD
发明人： OMI TADAHIRO , SUZUKI HIROKAZU , MURAOKA KENJI , MIURA MASAYASU
IPC分类号： E04H5/02 , E04F15/024 , E04F15/18
摘要： PROBLEM TO BE SOLVED: To solve such a problem that in a perforated floor of conventional clean rooms, since the end of each perforated floor plate forming the perforated floor is not electrically connected, the floor can not shade electromagnetic waves of a high frequency band. SOLUTION: In the perforated floor of a clean room in which a plurality of perforated floor plates 1 constituted of a conductive body having a plurality of formed holes are laid so as to arrange side by side. The external peripheral end of adjacent perforated floor plates 1 are electrically connected by a shield gasket 4, and the corner 6 of each perforated floor plate 1 is fixedly screwed in a metallic base piece 5 through a shield packing 7. In this way, each perforated floor plate 1 is electrically connected to a steel joist 60. COPYRIGHT: (C)2003,JPO

7. 发明专利

JP2003213812A INTERIOR SYSTEM FOR CLEAN ROOM 审中-公开
公开(公告)号：JP2003213812A
公开(公告)日：2003-07-30
申请号：JP2002016255
申请日：2002-01-24
申请人： OMI TADAHIRO , HITACHI PLANT ENG & CONSTR CO , TAKASAGO THERMAL ENGINEERING , BENITSUKUSU KK
发明人： OMI TADAHIRO , SHIRAI YASUYUKI , HANAOKA HIDEO , KOBAYASHI KIKUJI , HONMA TAKESHI , SHIBATA KUNIHIRO , SAITO KAZUO , KUDO MASAMITSU , TOMIKAWA SHINOBU , SAIRENJI AKIRA
IPC分类号： E04B1/92
摘要： PROBLEM TO BE SOLVED: To provide an interior system for a clean room ensuring electromagnetic wave shielding by positively carrying out electrical connection at a joint part between panels in constructing the clean room with interior panels. SOLUTION: Rubber vibration insulators are interposed at the joint parts of a floor panel, a wall panel and a ceiling panel constituting the interior material of the clean room, and the panels are jointed by electromagnetic shielding plates across the rubber vibration insulators while connecting them to construct the clean room as rigid structure, and the clean room of rigid structure is constructed interposing the rubber vibration insulators at the internal wall surface of a building wall finishing material. The electromagnetic wave shielding plate is stuck to the building finishing material, and a spring member made of a conductive material is interposed with a space between the interior panel and the electromagnetic wave shielding plate to construct the clean room. The electromagnetic wave shielding plate is formed of a Galvalume Steel Sheet (R), and the spacing for fixing the electromagnetic wave shielding plate to the other electromagnetic wave shielding plate is set to the multiple of the wavelength or less on the basis of frequency centering on the electromagnetic wave to be shielded. COPYRIGHT: (C)2003,JPO

8. 发明专利

JP2003208929A EARTHING SYSTEM OF BUILDING 审中-公开
公开(公告)号：JP2003208929A
公开(公告)日：2003-07-25
申请号：JP2002006987
申请日：2002-01-16
申请人： OMI TADAHIRO , KUMAGAI GUMI CO LTD
发明人： OMI TADAHIRO , SHIRAI YASUYUKI , SUZUKI HIROKAZU , ENDO TETSUO
IPC分类号： E04H9/14 , H01R4/66 , H02B1/16
摘要： PROBLEM TO BE SOLVED: To provide an earthing system of a building, which can protect an electronic equipment from lightning and lightning surge, electromagnetic wave noise or the like by eliminating potential differences between the earth and the equipment installed in the building. SOLUTION: Steel frames 14a, 14b of a trunk body 13 and the earths of equipments 16a to 16c, 17a to 17c concentrated at distribution boards 18a, 18b of respective stories are electrically connected respectively, and plural earth piles 11 are driven directly beneath the building 10, and the earth piles 11 are mutually connected by embedding a mesh layer 12 formed by twisted conductive wires, and by electrically connecting this embedding mesh layer 12 and the steel frames 14a, 14b, the earthing of the building 10 is made to be carried out. COPYRIGHT: (C)2003,JPO

9. 发明专利

JP2003202174A AIR COOLING DEVICE 审中-公开
公开(公告)号：JP2003202174A
公开(公告)日：2003-07-18
申请号：JP2002002182
申请日：2002-01-09
申请人： OMI TADAHIRO , KOBAYASHI SADAO , NICHIAS CORP , TAISEI CORP , TAKASAGO THERMAL ENGINEERING , HITACHI PLANT ENG & CONSTR CO
发明人： OMI TADAHIRO , SHIRAI YASUYUKI , KOBAYASHI SADAO , TERADA ISAO , OKABE TOSHIHISA , TANIGUCHI TAKASHI , MORI NAOKI , ITO HIROSHI , WAKAYAMA YOSHIHIDE , INABA HITOSHI , SAITO KAZUO , KOBAYASHI KIKUJI , HANAOKA HIDEO
IPC分类号： F25D9/00 , F24F1/00 , F24F5/00 , F25D7/00 , F28C1/04
摘要： PROBLEM TO BE SOLVED: To provide an air cooling device satisfactory in thermal efficiency, low in liquid gas ratio, low in pressure drop and capable of saving a space and energy. SOLUTION: This air cooling device is provided with an oblique honeycomb having openings on both of front and rear surfaces and both of upper and lower surfaces and arranged to have air to be cooled introduced from the front surface opening part and cooled air discharged from the rear surface opening part, a cooling water supply means supplying cooling water to the upper surface opening part of the oblique honeycomb, a cooling unit including a water receiving part receiving discharged water discharged from the lower surface opening part of the oblique honeycomb, and a blower means introducing air to be cooled to the front surface opening part of the oblique honeycomb and discharging cooled air from the rear surface opening part of the oblique honeycomb. The air-cooling device is provided with at least one cooling unit and height of one oblique honeycomb in the cooling unit is 200-800 mm. COPYRIGHT: (C)2003,JPO

10. 发明专利

JP2003188157A PLASMA PROCESSING APPARATUS 审中-公开
公开(公告)号：JP2003188157A
公开(公告)日：2003-07-04
申请号：JP2002370897
申请日：2002-12-20
申请人： OMI TADAHIRO , TOKYO ELECTRON LTD
发明人： OMI TADAHIRO , HIRAYAMA MASAKI
IPC分类号： C23C16/44 , C23C16/503 , H01L21/3065 , H01L21/31
摘要： PROBLEM TO BE SOLVED: To provide a small, low-cost stage cooling mechanism for a plasma processing apparatus, which performs such plasma processing as filming or dry-etching a substrate that is an object to be processed. SOLUTION: For a plasma processing apparatus, there are provided a conductive stage 301 that places an object in a container, a structure that can apply a DC voltage or high frequency power to this stage 301, a cooling passage 303, provided in the stage 301 and made of high thermal conductive metal, for cooling the object, and a high thermal conductivity insulation 304, provided between the stage 301 and this cooling passage 303, which has high heat conductivity so as to transmit heat of the stage 301 to the refrigerant, and has high electrical insulation so as not to transmit the DC voltage or high frequency power applied to the stage 301 to the refrigerant. COPYRIGHT: (C)2003,JPO

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