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    • 5. 发明申请
    • METHOD AND SYSTEM FOR REMOVING UNDESIRED PLANT PARTS
    • 用于去除不利植物部分的方法和系统
    • WO2008108653A1
    • 2008-09-12
    • PCT/NL2008/050135
    • 2008-03-07
    • NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNOZEELEN, RonaldVAN ZWET, Erwin John
    • ZEELEN, RonaldVAN ZWET, Erwin John
    • A01G1/06A01G5/00A01G7/00A01G7/06A01H4/00
    • A01G3/00A01G7/06A01G2003/005A01G2005/005
    • Method and system for removing undesired plant parts (9). A first cap (7) and means (13) are provided for lowering that cap over the supposed plant parts location, pushing downwards any leafs (8) etc. Around the supposed plant parts location. Means (15) are provided for making at least one image of the supposed plant parts location from several sides through the cap. Processing means (3) process the image (s) of the supposed plant parts location and localize any plant part to be removed. Means (16) are provided for excising any plant part through the first cap under control of said processing means (3). A second cap (14) may be provided extending outside and arranged co-movable with the first cap (7). The means for making at least one image of the supposed plant parts location and the means for excising any plant part to be removed reside inside the gap between the first cap and the second cap.
    • 用于去除不期望的植物部件的方法和系统(9)。 提供第一盖(7)和装置(13),用于将所述盖子降低到所述假定的植物部件位置上,向下推动任何叶片(8)等。围绕假定的植物部件位置。 提供装置(15)用于通过盖从多个侧面制造假定的植物部分位置的至少一个图像。 处理装置(3)处理假定的植物部分位置的图像,并定位待移除的任何植物部分。 提供装置(16),用于在所述处理装置(3)的控制下通过第一盖板切除任何植物部分。 第二盖(14)可以设置成向外延伸并与第一盖(7)共同移动。 用于制造假定的植物部位位置的至少一个图像的装置和用于切除要移除的任何植物部分的装置驻留在第一帽和第二帽之间的间隙内。
    • 8. 发明申请
    • HIGH POWER ADAPTIVE MIRROR
    • 高功率自适应镜子
    • WO2017105240A1
    • 2017-06-22
    • PCT/NL2016/050883
    • 2016-12-16
    • NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO
    • VAN ZWET, Erwin JohnVAN DEN DOOL, Teunis CornelisNIEUWKOOP, Evert
    • G02B26/06G02B26/08
    • G02B26/0825G02B26/06G02B26/0841G02B26/0866
    • According to an aspect of the invention, there is provided a mirror structure for adaptive optics devices, characterized in that it comprises: an elastically deformable layer in response to an applied force, said deformable layer comprising a central portion reflective to said an incident light beam (F); a support substrate positioned spaced with respect to said deformable layer; a spacer element connected to said elastically deformable layer and support substrate and positioned there between, said spacer element being arranged so that the separation distance between said first and second inner surface is in the range between 2 and 100 micron; an inner chamber at least partially defined by said first and substrate and by said spacer element, said inner chamber containing a pressurized gas (G); an actuator system capable of causing a deformation of said central portion counteracting the pressure of said pressurized gas; wherein, in use, said central portion is deformed according to profiles such as to control said light beam. Advantages may include thermal robustness and improved dimensional scaling properties.
    • 根据本发明的一个方面,提供了一种用于自适应光学装置的反射镜结构,其特征在于其包括:响应于所施加的力的可弹性变形层,所述可变形层包括中央 对所述入射光束(F)反射的部分; 相对于所述可变形层间隔设置的支撑基板; 连接到所述可弹性变形层和支撑衬底并定位在其间的间隔元件,所述间隔元件布置成使得所述第一和第二内表面之间的分隔距离在2和100微米之间的范围内; 至少部分地由所述第一和衬底以及所述隔离元件限定的内室,所述内室包含加压气体(G); 致动器系统,所述致动器系统能够引起所述中心部分的变形抵消所述加压气体的压力; 其中在使用中,所述中央部分根据轮廓变形以控制所述光束。 优势可能包括热稳定性和改进的尺寸缩放性能。
    • 9. 发明申请
    • METHOD OF DETERMINING AN OVERLAY ERROR, MANUFACTURING METHOD AND SYSTEM FOR MANUFACTURING OF A MULTILAYER SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURED THEREBY
    • 确定覆盖误差的方法,用于制造多层半导体器件的制造方法和系统以及由其制造的半导体器件
    • WO2017086787A1
    • 2017-05-26
    • PCT/NL2016/050803
    • 2016-11-17
    • NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO
    • KUIPER, StefanVAN ZWET, Erwin JohnBÄUMER, Stefan Michael BrunoSADEGHIAN MARNANI, Hamed
    • H01L21/66G03F7/20
    • H01L22/12G03F7/70633H01L22/20
    • Method of determining an overlay error, manufacturing method and system for manufacturing of a multilayer semiconductor device, and semiconductor device manufactured thereby. This document describes a method of determining an overlay error during manufacturing of a multilayer semiconductor device. Manufacturing of the semiconductor device comprises forming a stack of material layers comprising depositing of at least two subsequent patterned layers (26, 27) of semiconductor material, the patterned layers comprising a first patterned layer (26) having a first marker element (29) and a second patterned layer (27) having a second marker element (37). The determining of the overlay error comprises determining relative positions of the first and second marker element in relation to each other, such as to determine the overlay error between the first patterned layer and the second patterned layer. In addition an imaging step is performed on at least one of said first and second patterned layer, for determining relative positions of the respective first (29) or second (37) marker element and a pattern feature of a device pattern (30, 36) comprised by said respective first (26) and second (27) patterned layer.
    • 确定重叠误差的方法,用于制造多层半导体器件的制造方法和系统以及由此制造的半导体器件。 该文件描述了在制造多层半导体器件期间确定重叠误差的方法。 所述半导体器件的制造包括形成包括沉积至少两个半导体材料的后续图案化层(26,27)的材料层堆叠,所述图案化层包括具有第一标记元件(29)的第一图案化层(26)和 具有第二标记元件(37)的第二图案化层(27)。 确定重叠误差包括确定第一和第二标记元件相对于彼此的相对位置,例如以确定第一图案化层和第二图案化层之间的重叠误差。 此外,在所述第一和第二图案化层中的至少一个上执行成像步骤,用于确定相应的第一(29)或第二(37)标记元件和器件图案(30,36)的图案特征的相对位置, 由所述相应的第一图案层(26)和第二图案层(27)构成。