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1. 发明申请

WO2017099596A1 IMPROVED LIGHT EMISSION IN OLEDS 审中-公开
标题翻译：改善OLEDS的发光
公开(公告)号：WO2017099596A1
公开(公告)日：2017-06-15
申请号：PCT/NL2016/050857
申请日：2016-12-08
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO , DUPONT TEIJIN FILMS U.K. LIMITED
发明人： HARKEMA, Stephan , MACKERRON, Duncan Henry , SABIK, Sami , MANDAMPARAMBIL, Rajesh
IPC分类号： H01L51/52
CPC分类号： H01L51/5268 , H01L51/52 , H01L2251/5369
摘要： Improved light emission in OLEDs The invention relates to an organic light-emitting diode (OLED) system comprising a multi-layered structure having a semiconducting organic layer (2) sandwiched between first and second electrodes (3a, 3b); further comprising a barrier layer (6) interposed between the semiconducting organic layer and a polymer substrate (1) having formed an random nanopillar structure thereon having a pillar height dimension between 50 and 1000 nanometer and a pitch in a range of 50-1000 nanometer.
摘要翻译：改善OLED中的发光本发明涉及一种包括多层结构的有机发光二极管（OLED）系统，该多层结构具有夹在第一和第二电极（3a，3b）之间的半导体有机层（2）图3b）; 进一步包括介于所述半导体有机层和聚合物基底（1）之间的阻挡层（6），所述阻挡层已在其上形成随机纳米柱结构，其具有50至1000纳米的柱高度尺寸和50-1000纳米的间距。

2. 发明公开

EP3387682A1 IMPROVED LIGHT EMISSION IN OLEDS 审中-公开
公开(公告)号：EP3387682A1
公开(公告)日：2018-10-17
申请号：EP16813157.1
申请日：2016-12-08
申请人： Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO , DuPont Teijin Films U.K. Limited
发明人： HARKEMA, Stephan , MACKERRON, Duncan Henry , SABIK, Sami , MANDAMPARAMBIL, Rajesh
IPC分类号： H01L51/52
CPC分类号： H01L51/56 , H01L51/0009 , H01L51/5056 , H01L51/5072 , H01L51/5092 , H01L51/52 , H01L51/5215 , H01L51/5218 , H01L51/5268 , H01L2251/5369
摘要： Improved light emission in OLEDs The invention relates to an organic light-emitting diode (OLED) system comprising a multi-layered structure having a semiconducting organic layer (12) sandwiched between first and second electrodes (3a, 3b); further comprising a barrier layer (6) interposed between the semiconducting organic layer and a polymer substrate (1) having formed an random nanopillar structure thereon having a pillar height dimension between 50 and 1000 nanometer and a pitch in a range of 50-1000 nanometer.

3. 发明申请

WO2016099255A1 BARRIER FOIL COMPRISING AN ELECTRICAL CIRCUIT 审中-公开
标题翻译：包围电路的障碍物
公开(公告)号：WO2016099255A1
公开(公告)日：2016-06-23
申请号：PCT/NL2015/050845
申请日：2015-12-04
申请人： KONINKLIJKE PHILIPS N.V. , NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO
发明人： MANDAMPARAMBIL, Rajesh , LIFKA, Herbert , UNNIKRISHNAN, Sandeep
IPC分类号： H01L51/52
CPC分类号： H01L51/5256 , H01L51/5203 , H01L51/5243 , H01L2251/566
摘要： Method and system for providing a barrier foil (10) comprising an electrical circuit. A barrier foil (10) comprises a layered structure comprising an organic layer (12) sandwiched between barrier layers (11, 13). A sealing material (17m) is deposited into an elongated groove (16) that is cut in the barrier foil (10). The sealed groove (17) and the barrier layers (11, 13) enclose organic material (12m) in at least part of the organic layer (12) and are adapted for preventing external moisture and/or oxygen (19) from reaching the organic material (12m). The sealing material (17m) comprises an electrically conductive material forming a first part of the electrical circuit. An electrically conducting shunt (47) is disposed on top of the foil (10) and electrically connected between the sealing material (17m) and a second part (30) of the electrical circuit.
摘要翻译：用于提供包括电路的阻挡箔（10）的方法和系统。阻挡箔（10）包括层状结构，其包括夹在阻挡层（11,13）之间的有机层（12）。将密封材料（17m）沉积到在阻挡箔（10）中切割的细长凹槽（16）中。密封的凹槽（17）和阻挡层（11,13）在有机层（12）的至少一部分中包围有机材料（12m），并且适于防止外部水分和/或氧气（19）到达有机层材料（12m）。密封材料（17m）包括形成电路的第一部分的导电材料。导电分流器（47）设置在箔（10）的顶部上并电连接在密封材料（17m）和电路的第二部分（30）之间。

4. 发明申请

WO2015156661A1 METHOD OF PRODUCING A PATTERNED NANOWIRES NETWORK 审中-公开
标题翻译：生产图形纳米网络的方法
公开(公告)号：WO2015156661A1
公开(公告)日：2015-10-15
申请号：PCT/NL2014/050218
申请日：2014-04-07
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO , OSAKA UNIVERSITY
发明人： ARAKI, Teppei , MANDAMPARAMBIL, Rajesh , YAKIMETS, Iryna , SUGANUMA, Katsuaki , VAN DEN BRAND, Jeroen , JIU, Jinting
IPC分类号： H05K3/20 , H05K1/09 , H05K1/02
CPC分类号： H05K3/207 , H05K1/0283 , H05K1/097 , H05K2201/026
摘要： The prior art has failed to provide an adequate method of producing a patterned nanowires network, for which the invention seeks a solution. To this end, it is proposed to provide a method of producing a patterned nanowires network, the method comprising the steps of: providing a nanowire donor film comprising a donor layer of nanowire material mixed with an adhesive epoxy; aligning a laser beam of a laser system and guiding the nanowire donor film distanced from a substrate surface; impinging the laser beam on the nanowire donor film; in such a way that the nanowire donor film is activated to cover a selected part of substrate surface with nanowire matter transferred from the donor layer; and wherein the laser beam is restricted in timing and energy, in such a way that the nanowire matter is sintered into a patterned nanowires network. Accordingly, a patterning method is provided, wherein the nanowire network can be transferred to an acceptor substrate with a desired pattern, and at the same time providing for a sintering process during transferring by suitable tuning of the patterned radiation.
摘要翻译：现有技术未能提供生产图案化纳米线网络的适当方法，本发明寻求解决方案。为此，提出了制造图案化纳米线网络的方法，该方法包括以下步骤：提供纳米线供体膜，该纳米线供体膜包含与粘合剂环氧树脂混合的纳米线材料施主层; 对准激光系统的激光束并引导远离衬底表面的纳米线施主膜; 将激光束照射在纳米线供体膜上; 以使得纳米线供体膜被激活以覆盖从施主层转移的纳米线物质的衬底表面的选定部分; 并且其中激光束的时序和能量受到限制，使得纳米线物质被烧结成图案化的纳米线网络。因此，提供了一种图案化方法，其中可以将纳米线网络转移到具有所需图案的受主衬底，并且同时在通过适当调谐图案化辐射的转移期间提供烧结工艺。

5. 发明申请

WO2015088334A1 METHOD AND SYSTEM FOR PROVIDING A CARRIER WITH AN EMBEDDED PATTERNED METAL STRUCTURE 审中-公开
标题翻译：用嵌入式图形金属结构提供载体的方法和系统
公开(公告)号：WO2015088334A1
公开(公告)日：2015-06-18
申请号：PCT/NL2014/050840
申请日：2014-12-08
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO
发明人： ANDRIESSEN, Hieronymus Antonius Josephus Maria , MANDAMPARAMBIL, Rajesh , GILOT, Jan
IPC分类号： H01L51/52
CPC分类号： B23K26/0063 , B23K26/0624 , B23K26/361 , B23K26/362 , B23K26/40 , B23K26/402 , B23K26/57 , B23K2201/40 , B23K2203/16 , B23K2203/172 , B23K2203/50 , H01L51/5212
摘要： A method is presented for providing a carrier (CR) with an embedded patterned metal structure (EMM). The carrier at least includes a polymer foil (FS). The method comprise the steps of providing a carrier (CR) having a first side (S1) with an initial embedded patterned metal structure (EM). The carrier is then irradiated at a second side (S2) opposite the first side with a radiation beam (BM) that is at least partially transmitted through the carrier (CR) and at least partially absorbed by the initial embedded patterned metal structure (EM), therewith locally heating the initial embedded patterned metal structure and causing a removal of metal (DB) from the initial embedded patterned metal structure.
摘要翻译：提出了一种提供具有嵌入式图案化金属结构（EMM）的载体（CR）的方法。载体至少包括聚合物箔（FS）。该方法包括提供具有初始嵌入式图案化金属结构（EM）的具有第一侧（S1）的载体（CR）的步骤。然后在与第一侧相对的第二侧（S2）处照射载体，其中辐射束（BM）至少部分地透射穿过载体（CR）并且至少部分地被初始嵌入式图案化金属结构（EM）吸收，从而局部加热初始嵌入式图案化的金属结构并且使得从初始嵌入式图案化金属结构去除金属（DB）。

6. 发明申请

WO2015030589A1 PROCESS AND DONOR CARRIER FOR MANUFACTURING A SEMI-CONDUCTOR DEVICE USING LIGHT INDUCED TRANSFER 审中-公开
标题翻译：使用光诱导传输制造半导体器件的工艺和载体
公开(公告)号：WO2015030589A1
公开(公告)日：2015-03-05
申请号：PCT/NL2014/050588
申请日：2014-08-29
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO , KONINKLIJKE PHILIPS N.V. , COHERENT EUROPE B.V.
发明人： LIFKA, Herbert , MANDAMPARAMBIL, Rajesh , PRENEN, An Maria , JENSE, Wouter , MOORHOUSE, Colin , KUETHER, Lars
IPC分类号： H01L21/20 , C23C14/28 , C23C14/14
CPC分类号： C23C14/14 , C23C14/048 , H01L21/02532 , H01L21/02675
摘要： A semi-conductor device is manufactured using a light induced forward transfer process, by transferring donor material from a transparent donor substrate. A donor layer with semi-conductor material and doping material is used. The donor layer may be of amorphous silicon with implanted doping. The donor substrate and a target substrate are placed facing each other. The donor layer is irradiated with light through the donor substrate at a selected position on the surface of the donor substrate, using sufficient energy to melt the donor layer at the irradiated position and to transfer to the target substrate in the molten state. On the target substrate the donor material crystallizes. Successive transfer steps of this type for transferring material to the same target substrate, using donor layers having different types and/or concentrations of donor material, may be used to manufacture a more complex device.
摘要翻译：使用光诱导的正向转移工艺制造半导体器件，通过从施主材料的透明转移基质转移供体材料。使用具有半导体材料和掺杂材料的施主层。施主层可以是具有注入掺杂的非晶硅。供体基板和目标基板彼此面对放置。供体层在施主衬底的表面上的选定位置通过供体衬底用光照射，使用足够的能量在辐照位置熔化供体层，并在熔融状态下转移到目标衬底。在靶基质上，供体材料结晶。可以使用这种用于将材料转移到同一目标基质上的连续转移步骤，使用具有不同类型和/或浓度的供体材料的供体层来制造更复杂的装置。

7. 发明申请

WO2014073963A1 METHOD FOR BONDING BARE CHIP DIES 审中-公开
标题翻译：用于连接裸芯片的方法
公开(公告)号：WO2014073963A1
公开(公告)日：2014-05-15
申请号：PCT/NL2013/050800
申请日：2013-11-08
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO , IMEC
发明人： SMITS, Edsger Constant Pieter , PERINCHERY, Sandeep Menon , VAN DEN BRAND, Jeroen , MANDAMPARAMBIL, Rajesh , SCHOO, Harmannus Franciscus Maria
IPC分类号： H01L21/60 , H01L21/48 , B23K3/06 , B23K35/26 , C09J9/02 , H01L23/00 , H01L33/62 , H01L23/498 , H01L23/485 , H01L21/683
CPC分类号： H01L24/83 , B23K35/02 , B23K35/26 , B23K35/262 , C09J5/06 , C09J2201/61 , C09J2203/326 , C09J2205/31 , H01L21/4853 , H01L21/50 , H01L21/563 , H01L21/6835 , H01L23/49816 , H01L23/4985 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/73 , H01L24/81 , H01L24/92 , H01L33/62 , H01L2021/60277 , H01L2221/68359 , H01L2221/68381 , H01L2224/11003 , H01L2224/111 , H01L2224/1111 , H01L2224/1133 , H01L2224/13005 , H01L2224/13111 , H01L2224/1329 , H01L2224/133 , H01L2224/14131 , H01L2224/27001 , H01L2224/29011 , H01L2224/29013 , H01L2224/29034 , H01L2224/73103 , H01L2224/73104 , H01L2224/742 , H01L2224/75252 , H01L2224/81191 , H01L2224/81192 , H01L2224/81815 , H01L2224/81862 , H01L2224/83192 , H01L2224/83224 , H01L2224/83862 , H01L2224/9211 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H01L2924/381 , H01L2224/81 , H01L2224/83 , H01L2924/2076 , H01L2924/01047 , H01L2924/01029 , H01L2924/00 , H01L2924/00012
摘要： A method is provided for assembly of a micro-electronic component comprising the steps of: providing a conductive die bonding material comprising of a conductive thermosettable resin material or flux based solder and a dynamic release layer adjacent to the conductive thermoplastic material die bonding material layer; and impinging a laser beam on the dynamic release layer adjacent to the die bonding material layer; in such a way that the dynamic release layer is activated to direct conductive die bonding material matter towards the pad structure to be treated to cover a selected part of the pad structure with a transferred conductive die bonding material; and wherein the laser beam is restricted in timing and energy, in such a way that the die bonding material matter remains thermosetting. Accordingly adhesive matter can be transferred while preventing that the adhesive is rendered ineffective by thermal overexposure in the transferring process.
摘要翻译：提供了一种用于组装微电子部件的方法，包括以下步骤：提供包含导电热固性树脂材料或焊剂基焊料的导电芯片接合材料和邻近导电热塑性材料芯片接合材料层的动态剥离层; 并将激光束照射在与芯片接合材料层相邻的动态释放层上; 使得动态释放层被激活以将导电芯片接合材料物质朝向要处理的焊盘结构物以通过转移的导电芯片接合材料覆盖所述焊盘结构的选定部分; 并且其中激光束的定时和能量受到限制，使得芯片接合材料物质保持热固化。因此，可以转移粘合剂，同时防止粘合剂在转印过程中通过热过度曝光而变得无效。

8. 发明公开

EP3080850A1 METHOD AND SYSTEM FOR PROVIDING A CARRIER WITH AN EMBEDDED PATTERNED METAL STRUCTURE 审中-公开
标题翻译：方法和系统提供载体具有嵌入式图案的金属结构
公开(公告)号：EP3080850A1
公开(公告)日：2016-10-19
申请号：EP14815086.5
申请日：2014-12-08
申请人： Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO
发明人： ANDRIESSEN, Hieronymus Antonius Josephus Maria , MANDAMPARAMBIL, Rajesh , GILOT, Jan
IPC分类号： H01L51/52
CPC分类号： B23K26/0063 , B23K26/0624 , B23K26/361 , B23K26/362 , B23K26/40 , B23K26/402 , B23K26/57 , B23K2201/40 , B23K2203/16 , B23K2203/172 , B23K2203/50 , H01L51/5212
摘要： A method is presented for providing a carrier (CR) with an embedded patterned metal structure (EMM). The carrier at least includes a polymer foil (FS). The method comprise the steps of providing a carrier (CR) having a first side (S1) with an initial embedded patterned metal structure (EM). The carrier is then irradiated at a second side (S2) opposite the first side with a radiation beam (BM) that is at least partially transmitted through the carrier (CR) and at least partially absorbed by the initial embedded patterned metal structure (EM), therewith locally heating the initial embedded patterned metal structure and causing a removal of metal (DB) from the initial embedded patterned metal structure.
摘要翻译：一种方法，提出了一种用于在嵌入式图案化金属结构（EMM）提供载体（CR）用。所述载体至少包括聚合物箔（FS）。该方法包括：提供载流子（CR）具有第一侧（S1）与初始嵌入式图案化金属结构（EM）的步骤。该载体然后在第二侧（S2）的第一侧用辐射束（BM）相对照射并通过载体（CR）被至少部分地反mitted并且至少部分地由初始嵌入式图案化金属结构吸收（EM）有与局部加热初始嵌入式图案化金属结构并引起从初始嵌入式图案化金属结构的除去金属（DB）。

9. 发明公开

EP2917931A1 METHOD FOR BONDING BARE CHIP DIES 有权
标题翻译：方法绑定芯片阵列
公开(公告)号：EP2917931A1
公开(公告)日：2015-09-16
申请号：EP13801876.7
申请日：2013-11-08
申请人： Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO , IMEC vzw
发明人： SMITS, Edsger Constant Pieter , PERINCHERY, Sandeep Menon , VAN DEN BRAND, Jeroen , MANDAMPARAMBIL, Rajesh , SCHOO, Harmannus Franciscus Maria
IPC分类号： H01L21/60 , H01L21/48 , B23K3/06 , B23K35/26 , C09J9/02 , H01L23/00 , H01L33/62 , H01L23/498 , H01L23/485 , H01L21/683
CPC分类号： H01L24/83 , B23K35/02 , B23K35/26 , B23K35/262 , C09J5/06 , C09J2201/61 , C09J2203/326 , C09J2205/31 , H01L21/4853 , H01L21/50 , H01L21/563 , H01L21/6835 , H01L23/49816 , H01L23/4985 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/73 , H01L24/81 , H01L24/92 , H01L33/62 , H01L2021/60277 , H01L2221/68359 , H01L2221/68381 , H01L2224/11003 , H01L2224/111 , H01L2224/1111 , H01L2224/1133 , H01L2224/13005 , H01L2224/13111 , H01L2224/1329 , H01L2224/133 , H01L2224/14131 , H01L2224/27001 , H01L2224/29011 , H01L2224/29013 , H01L2224/29034 , H01L2224/73103 , H01L2224/73104 , H01L2224/742 , H01L2224/75252 , H01L2224/81191 , H01L2224/81192 , H01L2224/81815 , H01L2224/81862 , H01L2224/83192 , H01L2224/83224 , H01L2224/83862 , H01L2224/9211 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H01L2924/381 , H01L2224/81 , H01L2224/83 , H01L2924/2076 , H01L2924/01047 , H01L2924/01029 , H01L2924/00 , H01L2924/00012
摘要： A method is provided for assembly of a micro-electronic component comprising the steps of: providing a conductive die bonding material comprising of a conductive thermosettable resin material or flux based solder and a dynamic release layer adjacent to the conductive thermoplastic material die bonding material layer; and impinging a laser beam on the dynamic release layer adjacent to the die bonding material layer; in such a way that the dynamic release layer is activated to direct conductive die bonding material matter towards the pad structure to be treated to cover a selected part of the pad structure with a transferred conductive die bonding material; and wherein the laser beam is restricted in timing and energy, in such a way that the die bonding material matter remains thermosetting. Accordingly adhesive matter can be transferred while preventing that the adhesive is rendered ineffective by thermal overexposure in the transferring process.

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