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1. 发明申请

US20150348893A1 METHOD OF MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT COMPRISING ALUMINUM NITRIDE INTERPOSER 审中-公开
标题翻译：制造包含氮化铝介质的三维集成电路的方法
公开(公告)号：US20150348893A1
公开(公告)日：2015-12-03
申请号：US14289937
申请日：2014-05-29
申请人： NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
发明人： CHIH WANG , CHI-HAW CHIANG , YU-PING WANG , YANG-KUO KUO
IPC分类号： H01L23/498 , H01L21/48 , H01L23/00
CPC分类号： H01L23/49827 , H01L23/15 , H01L23/3121 , H01L23/49816 , H01L23/49833 , H01L2224/131 , H01L2224/16235 , H01L2924/05032 , H01L2924/13091 , H01L2924/14 , H01L2924/141 , H01L2924/1421 , H01L2924/1436 , H01L2924/1461 , H01L2924/20261 , H01L2924/20301 , H01L2924/2064 , H01L2924/20641 , H01L2924/40102 , H01L2924/40503 , H01L2924/00014
摘要： A method of manufacturing a three-dimensional integrated circuit comprising an aluminum nitride interposer is introduced. The method includes providing a first circuit component; providing a plurality of first conductive blocks on the first circuit component; providing an aluminum nitride interposer on the first circuit component, wherein the aluminum nitride interposer has microvias each comprising therein a conductor with an end in contact with a corresponding one of the first conductive blocks; providing second conductive blocks on the aluminum nitride interposer, wherein the second conductive blocks are in contact with the other ends of the conductors in the microvias; and providing at least a second circuit component disposed on the aluminum nitride interposer and electrically connected to the first circuit component through the first and second conductive blocks and the conductors.
摘要翻译：引入了包括氮化铝插入件的三维集成电路的制造方法。该方法包括提供第一电路部件; 在所述第一电路部件上提供多个第一导电块; 在所述第一电路部件上提供氮化铝插入件，其中所述氮化铝插入件具有微孔，每个微孔包括其中与所述第一导电块中的相应一个接触的端部的导体; 在所述氮化铝插入件上提供第二导电块，其中所述第二导电块与所述微孔中导体的另一端接触; 以及提供至少第二电路部件，其设置在所述氮化铝插入件上并通过所述第一和第二导电块和所述导体与所述第一电路部件电连接。

2. 发明申请

US20150345040A1 METHOD OF MANUFACTURING NICKEL-BASED ALLOY BARRIER LAYER OF WIRING CONNECTION TERMINAL 审中-公开
标题翻译：制造接线连接端子的镍基合金障碍层的方法
公开(公告)号：US20150345040A1
公开(公告)日：2015-12-03
申请号：US14289879
申请日：2014-05-29
申请人： National Chung Shan Institute of Science and Technology
发明人： CHI-HAW CHIANG , CHIH WANG , YU-PING WANG , CHUN-YU LEE , REN-RUEY FANG , YANG-KUAO KUO
IPC分类号： C25D3/56 , C25D5/48 , C25D7/06 , C25D5/18
CPC分类号： C25D3/562 , C25D5/12 , C25D7/0607
摘要： A method of manufacturing a nickel-based alloy barrier layer of a wiring connection terminal includes providing a substrate having a metal wiring; electroplating a nickel or a nickel-based alloy to the metal wiring at a deposition rate of 15-30 μm/hr to form a first layer thereon, wherein the first layer is of a thickness of 0.5 μm-5 μm, and the nickel-based alloy layer has nickel content of at least 50%; and plating a gold layer to the first layer to form thereon a second layer of a thickness of 0.03 μm-0.3 μm. The surface of the nickel-based alloy electroplated layer features a crystalline-phase structure full of micro-protuberances, and the thickness of the gold plated layer is reduced to 0.03 μm.
摘要翻译：制造布线连接端子的镍基合金阻挡层的方法包括提供具有金属布线的基板; 以15-30μm/小时的沉积速率将镍或镍基合金电镀到金属布线上以在其上形成第一层，其中第一层的厚度为0.5μm-5μm，镍合金层的镍含量至少为50％; 并将金层电镀到第一层上以在其上形成厚度为0.03μm-0.3μm的第二层。镍基合金电镀层的表面具有充满微突起的结晶相结构，镀金层的厚度减小到0.03μm。

3. 发明申请

US20150303574A1 NONPLANAR ANTENNA EMBEDDED PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：非天线天线嵌入式包装结构及其制造方法
公开(公告)号：US20150303574A1
公开(公告)日：2015-10-22
申请号：US14551192
申请日：2014-11-24
申请人： NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
发明人： CHI-HAW CHIANG , CHIA-HUA CHANG , CHIH WANG , CHUN-YU LEE
IPC分类号： H01Q9/04
CPC分类号： H01Q9/045 , H01Q9/0471
摘要： A nonplanar antenna embedded package structure and a method of manufacturing the same are introduced. The structure includes a nonplanar antenna component. The nonplanar antenna component comprises an antenna substrate, metal wiring, through-hole, and metal bump. The substrate surface covers the metal wiring. The through-hole penetrates the substrate from the antenna substrate bottom side but does not penetrate the metal wiring, and does not affect its appearance. The metal bump is implanted in the through-hole from the antenna substrate bottom side to join the metal wiring. An electronic component having a copper cable is provided. An end of the copper cable protrudes from the electronic component and is inserted into the through-hole of the antenna component to join the metal bump, thereby forming the nonplanar antenna embedded package structure characterized by: preventing the antenna metal wiring from exposing, and reducing interference otherwise arising from antenna resonance frequency and noise.
摘要翻译：介绍了非平面天线嵌入式封装结构及其制造方法。该结构包括非平面天线部件。非平面天线部件包括天线基板，金属布线，通孔和金属凸块。基板表面覆盖金属布线。通孔从天线基板底侧穿透基板，但不穿透金属布线，并且不影响其外观。金属凸块从天线基板底侧注入到通孔中以连接金属布线。提供具有铜缆的电子部件。铜电缆的一端从电子部件伸出并插入到天线部件的通孔中以接合金属凸块，从而形成非平面天线嵌入式封装结构，其特征在于：防止天线金属布线暴露，并且减少由天线共振频率和噪声引起的干扰。

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