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    • 7. 发明授权
    • Method for manufacturing contact structures of wirings
    • 制造接线接触结构的方法
    • US07288442B2
    • 2007-10-30
    • US10634867
    • 2003-08-06
    • Hyang-Shik KongMyung-Koo HurChi-Woo Kim
    • Hyang-Shik KongMyung-Koo HurChi-Woo Kim
    • H01L21/84H01L21/00
    • G02F1/13439G02F1/13458H01L21/76801H01L21/76838H01L23/53209H01L27/12H01L27/124H01L27/1288H01L29/458H01L2924/0002H01L2924/00
    • First, a conductive material of aluminum-based material is deposited and patterned to form a gate wire including a gate line, a gate pad, and a gate electrode. A gate insulating layer is formed by depositing nitride silicon in the range of more than 300° C. for 5 minutes, and a semiconductor layer and an ohmic contact layer are sequentially formed. Next, a conductor layer of a metal such as Cr is deposited and patterned to form a data wire include a data line intersecting the gate line, a source electrode, a drain electrode and a data pad. Then, a passivation layer is deposited and patterned to form contact holes exposing the drain electrode, the gate pad and the data pad. Next, indium zinc oxide is deposited and patterned to form a pixel electrode, a redundant gate pad and a redundant data pad respectively connected to the drain electrode, the gate pad and the data pad.
    • 首先,将铝基材料的导电材料沉积并图案化以形成包括栅极线,栅极焊盘和栅电极的栅极线。 通过在大于300℃的范围内沉积氮化硅5分钟形成栅极绝缘层,并依次形成半导体层和欧姆接触层。 接下来,沉积并图案化诸如Cr的金属的导体层以形成数据线,其包括与栅极线相交的数据线,源电极,漏电极和数据焊盘。 然后,沉积并图案化钝化层以形成暴露漏电极,栅极焊盘和数据焊盘的接触孔。 接下来,沉积并图案化氧化铟锌以形成分别连接到漏电极,栅极焊盘和数据焊盘的像素电极,冗余栅极焊盘和冗余数据焊盘。
    • 9. 发明授权
    • Method for manufacturing contact structures of wiring
    • 制造布线接触结构的方法
    • US07575963B2
    • 2009-08-18
    • US11874769
    • 2007-10-18
    • Hyang-Shik KongMyung-Koo HurChi-Woo Kim
    • Hyang-Shik KongMyung-Koo HurChi-Woo Kim
    • H01L21/84H01L21/00
    • G02F1/13439G02F1/13458H01L21/76801H01L21/76838H01L23/53209H01L27/12H01L27/124H01L27/1288H01L29/458H01L2924/0002H01L2924/00
    • First, a conductive material of aluminum-based material is deposited and patterned to form a gate wire including a gate line, a gate pad, and a gate electrode. A gate insulating layer is formed by depositing nitride silicon in the range of more than 300° C. for 5 minutes, and a semiconductor layer an ohmic contact layer are sequentially formed. Next, a conductor layer of a metal such as Cr is deposited and patterned to form a data wire include a data line intersecting the gate line, a source electrode, a drain electrode and a data pad. Then, a passivation layer is deposited and patterned to form contact holes exposing the drain electrode, the gate pad and the data pad. Next, indium zinc oxide is deposited and patterned to form a pixel electrode, a redundant gate pad and a redundant data pad respectively connected to the drain electrode, the gate pad and the data pad.
    • 首先,将铝基材料的导电材料沉积并图案化以形成包括栅极线,栅极焊盘和栅电极的栅极线。 通过在大于300℃的范围内沉积氮化硅5分钟形成栅极绝缘层,并依次形成半导体层欧姆接触层。 接下来,沉积并图案化诸如Cr的金属的导体层以形成数据线,其包括与栅极线相交的数据线,源电极,漏电极和数据焊盘。 然后,沉积并图案化钝化层以形成暴露漏电极,栅极焊盘和数据焊盘的接触孔。 接下来,沉积并图案化氧化铟锌以形成分别连接到漏电极,栅极焊盘和数据焊盘的像素电极,冗余栅极焊盘和冗余数据焊盘。