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1. 发明授权

US08692731B2 Dielectric waveguide antenna 有权
标题翻译：介质波导天线
公开(公告)号：US08692731B2
公开(公告)日：2014-04-08
申请号：US13092091
申请日：2011-04-21
申请人： Jung Aun Lee , Myeong Woo Han , Chul Gyun Park , Moonil Kim , Seung Ho Choi , Kook Joo Lee
发明人： Jung Aun Lee , Myeong Woo Han , Chul Gyun Park , Moonil Kim , Seung Ho Choi , Kook Joo Lee
IPC分类号： H01Q13/00
CPC分类号： H01Q13/10 , H01P3/121 , H01P5/024 , H01Q13/06
摘要： Disclosed herein is a dielectric waveguide antenna including: a dielectric waveguide transmitting a signal applied from a power feeder; a dielectric waveguide radiator radiating the signal transmitted from the dielectric waveguide to the air through a first aperture; and a matching unit formed in a portion of the dielectric waveguide and controlling a serial reactance and a parallel reactance to thereby perform impedance matching between the dielectric waveguide radiator and the air, in order to reduce reflection generated in the first aperture during the radiation of the signal through the first aperture. Reflection in the aperture is reduced through the matching unit having various structures, thereby making it possible to improve characteristics of the dielectric waveguide antenna.
摘要翻译：本文公开了一种电介质波导天线，包括：传送从馈电器施加的信号的电介质波导; 电介质波导辐射器，其通过第一孔辐射从所述电介质波导发射到所述空气的信号; 以及形成在电介质波导的一部分中的匹配单元，并且控制串联电抗和并联电抗，从而在电介质波导辐射器和空气之间执行阻抗匹配，以便减少在辐射期间在第一孔径中产生的反射信号通过第一个光圈。通过具有各种结构的匹配单元减小孔径的反射，从而可以提高电介质波导天线的特性。

2. 发明授权

US08749434B2 Dielectric resonant antenna using a matching substrate 有权
标题翻译：使用匹配衬底的介质谐振天线
公开(公告)号：US08749434B2
公开(公告)日：2014-06-10
申请号：US12841884
申请日：2010-07-22
申请人： Myeong Woo Han , Jung Aun Lee , Chul Gyun Park , Seung Ho Choi , Moonil Kim , Kook Joo Lee
发明人： Myeong Woo Han , Jung Aun Lee , Chul Gyun Park , Seung Ho Choi , Moonil Kim , Kook Joo Lee
IPC分类号： H01Q1/38
CPC分类号： H01Q1/40 , H01Q9/0485 , H01Q13/106 , H01Q13/18
摘要： A dielectric resonator antenna is disclosed that includes a multi-layer substrate on which a plurality of insulating layers and conductor layers are alternately stacked. The dielectric resonator antenna also includes a first conductor plate that has an opening part on the upper portion of the top insulating layer of the multi-layer substrate and a second conductor plate that is formed on the lower portion of the bottom insulating layer from the first conductor plate. The insulating layer is formed with at least two stacked layers and is disposed at a position corresponding to the opening part. The dielectric resonator antenna also includes a plurality of first metal via holes, a feeding part and a matching substrate that is stacked on the opening part and is stacked with at least one insulating layer.
摘要翻译：公开了一种介质谐振器天线，其包括多层基板，多层绝缘层和导体层交替层叠在该多层基板上。介质谐振器天线还包括：第一导体板，其在多层基板的顶部绝缘层的上部具有开口部分;以及第二导体板，其形成在底部绝缘层的下部，导体板。绝缘层形成有至少两个层叠层，并且设置在与开口部对应的位置。介质谐振器天线还包括多个第一金属通孔，馈电部分和匹配基板，其堆叠在开口部分上并与至少一个绝缘层堆叠。

3. 发明申请

US20110133991A1 DIELECTRIC RESONATOR ANTENNA EMBEDDED IN MULTILAYER SUBSTRATE 审中-公开
标题翻译：埋在多层基板中的介质谐振器天线
公开(公告)号：US20110133991A1
公开(公告)日：2011-06-09
申请号：US12710163
申请日：2010-02-22
申请人： Jung Aun Lee , Moonil Kim , Kook Joo Lee , Chul Gyun Park
发明人： Jung Aun Lee , Moonil Kim , Kook Joo Lee , Chul Gyun Park
IPC分类号： H01Q9/04
CPC分类号： H01Q9/0485 , H01Q13/00
摘要： Disclosed is a dielectric resonator antenna embedded in a multilayer substrate, which includes a multilayer substrate, a first conductor plate having an opening, a second conductor plate formed on the bottom of a lowermost insulating layer resulting from stacking at least two insulating layers downward from the first conductor plate, a plurality of metal via holes passing through around the opening at a predetermined interval, and a feeder for transmitting a frequency signal to the dielectric resonator embedded by the metal boundaries defined by the first conductor plate, the second conductor plate and the plurality of metal via holes, thus exhibiting low sensitivity to fabrication error and the external environment.
摘要翻译：公开了一种嵌入多层基板中的介质谐振器天线，其包括多层基板，具有开口的第一导体板，形成在最下层绝缘层底部的第二导体板，第一导体板，以预定间隔穿过开口周围的多个金属通孔，以及用于将频率信号传输到由第一导体板，第二导体板和第二导体板限定的金属边界嵌入的介质谐振器的馈电器多个金属通孔，因此对制造误差和外部环境的敏感性低。

4. 发明申请

US20130169376A1 DIFFERENTIAL MODE AMPLIFIER DRIVING CIRCUIT 有权
标题翻译：差分模式放大器驱动电路
公开(公告)号：US20130169376A1
公开(公告)日：2013-07-04
申请号：US13420267
申请日：2012-03-14
申请人： Myeong Woo Han , Jung Aun Lee , Kook Joo Lee , Moonil Kim
发明人： Myeong Woo Han , Jung Aun Lee , Kook Joo Lee , Moonil Kim
IPC分类号： H01P5/10
CPC分类号： H01P5/10
摘要： There is provided a differential mode amplifier driving circuit, including: a first port having one end connected to a single signal; a second port having one end connected to a differential signal; a first transmission line having one end grounded; and a third port having one end connected to the first transmission line and the other end connected to the differential signal.
摘要翻译：提供了一种差模放大器驱动电路，包括：第一端口，其一端连接到单个信号; 第二端口，其一端连接到差分信号; 一端接地的第一传输线; 以及第三端口，其一端连接到第一传输线，另一端连接到差分信号。

5. 发明授权

US08723732B2 Dielectric resonator antenna embedded in multilayer substrate for enhancing bandwidth 有权
标题翻译：介质谐振器天线嵌入在多层衬底中，用于增强带宽
公开(公告)号：US08723732B2
公开(公告)日：2014-05-13
申请号：US12833688
申请日：2010-07-09
申请人： Jung Aun Lee , Chul Gyun Park , Moonil Kim , Kook Joo Lee
发明人： Jung Aun Lee , Chul Gyun Park , Moonil Kim , Kook Joo Lee
IPC分类号： H01Q1/38
CPC分类号： H01Q1/38 , H01Q1/2283 , H01Q9/0485
摘要： A dielectric resonator antenna embedded in a multilayer substrate is described. The dielectric resonator antenna includes a multilayer substrate, a first conductive plate, a second conductive plate, a plurality of first metal via holes, a feeding part configured to feed a dielectric resonator, and a conductive pattern part inserted into the dielectric resonator so that a vertical metal interface is formed in the dielectric resonator.
摘要翻译：描述嵌入在多层基板中的介质谐振器天线。介质谐振器天线包括多层基板，第一导电板，第二导电板，多个第一金属通孔，配置为馈送介质谐振器的馈电部分和插入到介质谐振器中的导电图案部分，使得在介质谐振器中形成垂直金属界面。

6. 发明授权

US09147923B2 Differential mode amplifier driving circuit 有权
标题翻译：差模放大器驱动电路
公开(公告)号：US09147923B2
公开(公告)日：2015-09-29
申请号：US13420267
申请日：2012-03-14
申请人： Myeong Woo Han , Jung Aun Lee , Kook Joo Lee , Moonil Kim
发明人： Myeong Woo Han , Jung Aun Lee , Kook Joo Lee , Moonil Kim
IPC分类号： H03H11/32 , H01P5/10 , H03F1/56
CPC分类号： H01P5/10
摘要： There is provided a differential mode amplifier driving circuit, including: a first port having one end connected to a single signal; a second port having one end connected to a differential signal; a first transmission line having one end grounded; and a third port having one end connected to the first transmission line and the other end connected to the differential signal.
摘要翻译：提供了一种差模放大器驱动电路，包括：第一端口，其一端连接到单个信号; 第二端口，其一端连接到差分信号; 一端接地的第一传输线; 以及第三端口，其一端连接到第一传输线，另一端连接到差分信号。

7. 发明授权

US09245858B2 Semiconductor device package with integrated antenna for wireless applications 有权
标题翻译：具有集成天线的半导体器件封装，用于无线应用
公开(公告)号：US09245858B2
公开(公告)日：2016-01-26
申请号：US13238622
申请日：2011-09-21
申请人： Myeong Woo Han , Do Jae Yoo , Jung Aun Lee , Jung Ho Yoon , Chul Gyun Park
发明人： Myeong Woo Han , Do Jae Yoo , Jung Aun Lee , Jung Ho Yoon , Chul Gyun Park
IPC分类号： H01L31/0203 , H01L33/52 , H01L31/18 , H01L23/66 , H01L23/31 , H01L21/56 , H01L23/00 , H01Q1/22 , H01Q23/00 , H01Q5/40
CPC分类号： H01L23/66 , H01L21/4853 , H01L21/56 , H01L21/561 , H01L21/78 , H01L23/3121 , H01L24/24 , H01L24/73 , H01L24/82 , H01L24/97 , H01L2223/6677 , H01L2223/6683 , H01L2224/48091 , H01L2924/01029 , H01L2924/15787 , H01L2924/181 , H01Q1/2283 , H01Q5/40 , H01Q23/00 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device package is provided with integrated antenna for wireless applications. The semiconductor device package comprises a substrate including a semiconductor chip mounted thereon; a protective layer covering the semiconductor chip; a metal pattern mounted on the protective layer; and a first connective member connecting the semiconductor chip and the metal pattern. According to this configuration, the semiconductor device package is capable of being easily manufactured while minimizing the electrical distance between the metal pattern for use as an antenna and the semiconductor chip.
摘要翻译：半导体器件封装设有用于无线应用的集成天线。半导体器件封装包括其上安装有半导体芯片的衬底; 覆盖半导体芯片的保护层; 安装在保护层上的金属图案; 以及连接半导体芯片和金属图案的第一连接构件。根据该结构，半导体器件封装能够容易地制造，同时最小化用作天线的金属图案与半导体芯片之间的电距离。

8. 发明授权

US08736031B2 Semiconductor package 有权
标题翻译：半导体封装
公开(公告)号：US08736031B2
公开(公告)日：2014-05-27
申请号：US13200406
申请日：2011-09-23
申请人： Jung Aun Lee , Myeong Woo Han , Do Jae Yoo , Chul Gyun Park
发明人： Jung Aun Lee , Myeong Woo Han , Do Jae Yoo , Chul Gyun Park
IPC分类号： H01L23/552
CPC分类号： H01L23/66 , H01L23/3121 , H01L2223/6677 , H01L2224/48195 , H01L2224/48227 , H01L2924/3025 , H01Q1/2283 , H01Q9/0414 , H01L2924/00
摘要： There is provided a semiconductor package, and more particularly, a semiconductor package including an antenna embedded in an inner portion thereof. The semiconductor package includes: a semiconductor chip; a main antenna disposed to be adjacent to the semiconductor chip and electrically connected thereto; a sealing part sealing both of the semiconductor chip and the main antenna; and an auxiliary antenna formed on an outer surface of the sealing part and coupled to the main antenna.
摘要翻译：提供了一种半导体封装，更具体地说，提供一种包括嵌入在其内部的天线的半导体封装。半导体封装包括：半导体芯片; 主天线，其设置成与半导体芯片相邻并与其电连接; 密封半导体芯片和主天线的密封部; 以及形成在密封部分的外表面上并且连接到主天线的辅助天线。

9. 发明申请

US20130015544A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US20130015544A1
公开(公告)日：2013-01-17
申请号：US13238622
申请日：2011-09-21
申请人： Myeong Woo HAN , Do Jae Yoo , Jung Aun Lee , Jung Ho Yoon , Chul Gyun Park
发明人： Myeong Woo HAN , Do Jae Yoo , Jung Aun Lee , Jung Ho Yoon , Chul Gyun Park
IPC分类号： H01L31/0203 , H01L33/52 , H01L31/18
CPC分类号： H01L23/66 , H01L21/4853 , H01L21/56 , H01L21/561 , H01L21/78 , H01L23/3121 , H01L24/24 , H01L24/73 , H01L24/82 , H01L24/97 , H01L2223/6677 , H01L2223/6683 , H01L2224/48091 , H01L2924/01029 , H01L2924/15787 , H01L2924/181 , H01Q1/2283 , H01Q5/40 , H01Q23/00 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： There is provided a semiconductor package including: a substrate including a semiconductor chip mounted thereon; a protective layer covering the semiconductor chip; a metal pattern mounted on the protective layer; and a first connective member connecting the semiconductor chip and the metal pattern.
摘要翻译：提供了一种半导体封装，包括：其上安装有半导体芯片的基板; 覆盖半导体芯片的保护层; 安装在保护层上的金属图案; 以及连接半导体芯片和金属图案的第一连接构件。

10. 发明申请

US20130009320A1 Semiconductor package and method of manufacturing the same 审中-公开
标题翻译：半导体封装及其制造方法
公开(公告)号：US20130009320A1
公开(公告)日：2013-01-10
申请号：US13200335
申请日：2011-09-23
申请人： Do Jae Yoo , Jung Ho Yoon , Chul Gyun Park , Myeong Woo Han , Jung Aun Lee
发明人： Do Jae Yoo , Jung Ho Yoon , Chul Gyun Park , Myeong Woo Han , Jung Aun Lee
IPC分类号： H01L23/48 , H01L21/56
CPC分类号： H01L23/66 , H01L21/4853 , H01L21/4857 , H01L21/486 , H01L21/56 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/78 , H01L23/3142 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/5226 , H01L23/5389 , H01L24/19 , H01L24/73 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L2223/6616 , H01L2223/6677 , H01L2223/6683 , H01L2224/0401 , H01L2224/04105 , H01L2224/16225 , H01L2224/32145 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01029 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2924/3011 , H05K1/185 , H05K2203/061 , H01L2224/81 , H01L2924/00 , H01L2924/00012
摘要： There are provided a semiconductor package including an antenna formed integrally therewith, and a method of manufacturing the same. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part or the substrate part and electrically connected to the semiconductor chip.
摘要翻译：提供了包括与其一体形成的天线的半导体封装及其制造方法。半导体封装包括：半导体芯片; 密封半导体芯片的密封部分; 形成在所述密封部的至少一个表面上的基板部; 以及形成在所述密封部或所述基板部上并与半导体芯片电连接的天线部。

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