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1. 发明授权

US09378874B2 Ceramic electronic component 有权
标题翻译：陶瓷电子元件
公开(公告)号：US09378874B2
公开(公告)日：2016-06-28
申请号：US14320770
申请日：2014-07-01
申请人： Murata Manufacturing Co., Ltd.
发明人： Koji Sato , Yukio Sanada , Yasuhiro Nishisaka , Masaki Hirota
IPC分类号： H01L41/083 , H01C7/00 , H01G4/12 , H01G4/232 , H01G4/30 , H01C7/13 , H01F17/00 , H01G4/012
CPC分类号： H01C7/008 , H01C7/13 , H01F17/0013 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/30 , H01L41/083
摘要： A ceramic electronic component includes a ceramic base, first and second internal electrodes, and first and second external electrodes. The first external electrode is disposed at a first end portion of a first major surface in the longitudinal direction. The second external electrode is disposed at a second end portion of the first major surface in the longitudinal direction. A portion of each of the first and second external electrodes is opposed in the thickness direction to a region where the first and second internal electrodes are opposed to each other in the thickness direction. A condition ( 1/10)t0≦t1 ≦(⅖)t0 is satisfied, where to is the thickness of each of the first and second external electrodes and t1 is the thickness of a portion in which each of the first and second external electrodes is embedded in the first major surface.
摘要翻译：陶瓷电子部件包括陶瓷基体，第一和第二内部电极以及第一和第二外部电极。第一外部电极设置在纵向方向上的第一主表面的第一端部处。第二外部电极设置在第一主表面的纵向方向的第二端部处。第一外部电极和第二外部电极中的每一个的一部分在厚度方向上与第一和第二内部电极在厚度方向上彼此相对的区域相对。满足条件（1/10）t0＆nlE; t1＆nlE;（⅖）t0，其中，第一外部电极和第二外部电极中的每一个的厚度为哪里，并且t1是其中第一和第二外部电极电极嵌入第一主表面。

2. 发明授权

US09007161B2 Method of manufacturing ceramic electronic component, ceramic electronic component, and wiring board 有权
标题翻译：制造陶瓷电子部件，陶瓷电子部件和配线基板的方法
公开(公告)号：US09007161B2
公开(公告)日：2015-04-14
申请号：US14339506
申请日：2014-07-24
申请人： Murata Manufacturing Co., Ltd.
发明人： Koji Sato , Yukio Sanada , Yasuhiro Nishisaka
IPC分类号： H05K1/18 , H01C1/14 , H01C7/00 , H01C7/02 , H01G2/06 , H01G4/228 , H01F27/28 , H01G4/008 , H01G4/12 , H01L41/083 , H05K3/32
CPC分类号： H05K1/183 , H01C1/14 , H01C7/008 , H01C7/02 , H01F27/2804 , H01F2027/2809 , H01G2/06 , H01G4/008 , H01G4/1227 , H01G4/228 , H01L41/083 , H05K1/186 , H05K3/321 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10439 , H05K2201/10636 , Y02P70/611 , Y10T29/49085 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155
摘要： A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.
摘要翻译：陶瓷电子部件的制造方法即使在陶瓷电子部件嵌入布线基板中也能够防止特性的变化。制备含有聚合度在约1000至约1500范围内的有机粘合剂的陶瓷生片。在每个陶瓷生片的表面上形成第一导电糊层。层叠陶瓷生片以形成原料陶瓷层叠体。在原料陶瓷层叠体的表面上形成第二导电糊层。形成有第二导电膏层的原料陶瓷层叠体被烧制。

3. 发明授权

US09232673B2 Ceramic electronic component including coating layer 有权
标题翻译：陶瓷电子元件包括涂层
公开(公告)号：US09232673B2
公开(公告)日：2016-01-05
申请号：US13755197
申请日：2013-01-31
申请人： Murata Manufacturing Co., Ltd.
发明人： Yasuhiro Nishisaka , Yukio Sanada , Tetsuya Kisumi , Toshiki Nagamoto
IPC分类号： H01G4/005 , H01G4/30 , H01G4/232 , H05K7/00 , H02N2/00 , H01C7/00 , H01C1/148 , H01C7/18 , H01F17/00 , H01L41/047 , H01F27/29
CPC分类号： H05K7/00 , H01C1/148 , H01C7/008 , H01C7/18 , H01F17/0006 , H01F27/292 , H01G4/005 , H01G4/2325 , H01G4/30 , H01L41/0472 , H02N2/00
摘要： A ceramic electronic component includes a ceramic body; a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a coating layer covering a surface portion of the ceramic body on which the internal electrodes are exposed, the coating layer being made of a glass or resin medium in which metal powder particles are dispersed; and an electrode terminal provided directly on the coating layer and including a plating film. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal and have an elongated shape in cross section along a thickness direction of the coating layer. The metal powder particles defining the conduction paths have a maximum diameter not smaller than the thickness of the coating layer.
摘要翻译：陶瓷电子部件包括陶瓷体; 多个内部电极，设置在所述陶瓷体中，并且包括露出在所述陶瓷体的表面上的端部; 覆盖内部电极露出的陶瓷体的表面部分的涂层，所述涂层由分散有金属粉末颗粒的玻璃或树脂介质制成; 以及直接设置在涂层上并包括镀膜的电极端子。金属粉末颗粒限定将内部电极与电极端子电连接并沿着涂层的厚度方向具有细长形状的导电路径。限定导电路径的金属粉末颗粒具有不小于涂层厚度的最大直径。

4. 发明授权

US09363896B2 Ceramic electronic component and method for manufacturing the same 有权
公开(公告)号：US09363896B2
公开(公告)日：2016-06-07
申请号：US14154204
申请日：2014-01-14
申请人： Murata Manufacturing Co., Ltd.
发明人： Yasuhiro Nishisaka , Yukio Sanada , Koji Sato , Seiichi Matsumoto
IPC分类号： H01G4/228 , H05K1/18 , H01G4/232 , H01G4/30 , H01C7/00 , H01F27/28 , H01L41/083
CPC分类号： H05K1/182 , H01C7/008 , H01F27/28 , H01F27/2804 , H01G4/008 , H01G4/12 , H01G4/232 , H01G4/30 , H01L41/083 , H01L41/1876
摘要： A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

5. 发明授权

US09224543B2 Ceramic electronic component including glass coating layer 有权
标题翻译：陶瓷电子元件包括玻璃涂层
公开(公告)号：US09224543B2
公开(公告)日：2015-12-29
申请号：US13755224
申请日：2013-01-31
申请人： Murata Manufacturing Co., Ltd.
发明人： Yasuhiro Nishisaka , Yukio Sanada , Tetsuya Kisumi , Akira Ishizuka
IPC分类号： H01G4/005 , H01G4/232 , H01G4/30 , H01G13/00
CPC分类号： H01G13/006 , H01G4/005 , H01G4/2325 , H01G4/30
摘要： A ceramic electronic component includes a ceramic body, a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a glass coating layer covering a portion of the surface of the ceramic body on which the internal electrodes are exposed; and an electrode terminal provided directly on the glass coating layer and including a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The internal electrodes project from the surface of the ceramic body into the glass coating layer without passing through the glass coating layer. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal.
摘要翻译：陶瓷电子部件包括陶瓷体，设置在陶瓷体中的多个内部电极，其包括暴露在陶瓷体的表面上的端部; 覆盖所述内部电极露出的所述陶瓷体的表面的一部分的玻璃涂层; 以及直接设置在玻璃涂层上并包括镀膜的电极端子。玻璃涂层由金属粉末颗粒分散的玻璃介质制成。内部电极从陶瓷体的表面突出到不经过玻璃涂层的玻璃涂层中。金属粉末颗粒限定将内部电极与电极端子电连接的传导路径。

6. 发明授权

US09275804B2 Ceramic electronic component and method for producing the same 有权
标题翻译：陶瓷电子元件及其制造方法
公开(公告)号：US09275804B2
公开(公告)日：2016-03-01
申请号：US13755232
申请日：2013-01-31
申请人： Murata Manufacturing Co., Ltd.
发明人： Yasuhiro Nishisaka , Yukio Sanada , Tetsuya Kisumi , Toshiki Nagamoto , Masato Kimura , Seiji Koga
IPC分类号： H01G4/30 , H01G4/232 , H01G13/00
CPC分类号： H01G13/006 , H01G4/2325 , H01G4/30 , H01G4/306
摘要： A ceramic electronic component includes a ceramic body, a glass coating layer, and an electrode terminal. The ceramic body includes a plurality of internal electrodes whose ends are exposed on the surface of the ceramic body. The glass coating layer covers a portion of the ceramic body on which the internal electrodes are exposed. The electrode terminal is provided directly on the glass coating layer. The electrode terminal includes a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The metal powder particles define conduction paths that electrically connect the internal electrodes with the electrode terminal.
摘要翻译：陶瓷电子部件包括陶瓷体，玻璃涂层和电极端子。陶瓷体包括多个内部电极，其端部暴露在陶瓷体的表面上。玻璃涂层覆盖内部电极露出的陶瓷体的一部分。电极端子直接设置在玻璃涂层上。电极端子包括镀膜。玻璃涂层由金属粉末颗粒分散的玻璃介质制成。金属粉末颗粒限定将内部电极与电极端子电连接的传导路径。

7. 发明授权

US08891225B2 Ceramic electronic component and method for manufacturing the same 有权
标题翻译：陶瓷电子元件及其制造方法
公开(公告)号：US08891225B2
公开(公告)日：2014-11-18
申请号：US14071684
申请日：2013-11-05
申请人： Murata Manufacturing Co., Ltd.
发明人： Yasuhiro Nishisaka , Yukio Sanada , Koji Sato , Seiichi Matsumoto
IPC分类号： H01G4/00 , H05K1/18 , H01G4/232 , H01G4/30 , H01C7/00 , H01F27/28 , H01L41/083
CPC分类号： H05K1/182 , H01C7/008 , H01F27/28 , H01F27/2804 , H01G4/008 , H01G4/12 , H01G4/232 , H01G4/30 , H01L41/083 , H01L41/1876
摘要： A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.
摘要翻译：陶瓷电子部件包括陶瓷元件组件和外部电极。外部电极设置在陶瓷元件组件上。外部电极包括下面的电极层和第一个Cu镀膜。底层电极层设置在陶瓷元件组件上。第一Cu镀膜设置在下面的电极层上。底层电极层包括可在Cu中扩散的金属和陶瓷接合材料。在Cu中可扩散的金属在第一Cu镀膜的下面的电极层侧的至少一个表面层中扩散。

8. 发明授权

US08587925B2 Ceramic electronic component and method for manufacturing the same 有权
公开(公告)号：US08587925B2
公开(公告)日：2013-11-19
申请号：US13923396
申请日：2013-06-21
申请人： Murata Manufacturing Co., Ltd.
发明人： Yasuhiro Nishisaka , Yukio Sanada , Koji Sato , Seiichi Matsumoto
IPC分类号： H01G4/00
CPC分类号： H05K1/182 , H01C7/008 , H01F27/28 , H01F27/2804 , H01G4/008 , H01G4/12 , H01G4/232 , H01G4/30 , H01L41/083 , H01L41/1876
摘要： A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

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