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1. 发明授权

US06719188B2 Rework methods for lead BGA/CGA 有权
标题翻译：铅BGA / CGA的返工方法
公开(公告)号：US06719188B2
公开(公告)日：2004-04-13
申请号：US09912192
申请日：2001-07-24
申请人： Mukta G. Farooq , Raymond A. Jackson , David C. Linnell
发明人： Mukta G. Farooq , Raymond A. Jackson , David C. Linnell
IPC分类号： B23K1018
CPC分类号： B23K1/018 , B23K2101/40 , H01L24/98 , Y10T29/49815 , Y10T29/53274 , Y10T29/53283
摘要： A method and apparatus are provided for reworking electronic component assemblies where the components are joined by solder interconnections. A cutting device employing a heated wire, blade or other cutting element is forced against and through the solder interconnections to sever the interconnections. A preferred cutting device employs moving the cutting element transverse to the solder interconnections to also provide a sawing action to the solder interconnections. Another cutting device employs a water jet to provide a high pressure stream of water that cuts and severs the solder interconnections.
摘要翻译：提供了一种方法和装置，用于重新加工电子部件组件，其中部件通过焊料互连连接。使用加热的线，刀片或其他切割元件的切割装置被迫抵抗并穿过焊料互连以切断互连。优选的切割装置采用将切割元件横向于焊接互连件移动以向焊接互连提供锯切动作。另一切割装置采用水射流来提供高压水流，其切割和切断焊料互连。

2. 发明授权

US07882623B2 Apparatus for removing interconnects to separate two parts of a workpiece 有权
标题翻译：用于去除互连以分离工件的两个部分的装置
公开(公告)号：US07882623B2
公开(公告)日：2011-02-08
申请号：US12175541
申请日：2008-07-18
申请人： Mukta G. Farooq , Ray A. Jackson , David C. Linnell , Frank L. Pompeo
发明人： Mukta G. Farooq , Ray A. Jackson , David C. Linnell , Frank L. Pompeo
IPC分类号： B23P19/00
CPC分类号： H01L21/67092 , H01L24/81 , H01L2224/81801 , H01L2924/01322 , H01L2924/14 , H05K13/0486 , Y10T29/49144 , Y10T29/49755 , Y10T29/49757 , Y10T29/53091 , Y10T29/53261 , Y10T29/53274 , Y10T29/53404 , H01L2924/00
摘要： Disclosed is an apparatus for separating interconnects between, for example, a card and a substrate. The apparatus includes one or more rotationally biased (e.g., spring-loaded, etc.) partial-circle structures (e.g., blades, squeegee, plow, etc.) and one or more temperature-sensitive releases connected to the partial-circle structures. The partial-circle structures are positioned to rotate and separate the interconnects when released by the temperature-sensitive releases. The invention can also include solder reservoirs positioned to receive solder from the interconnects separated by the partial-circle structures.
摘要翻译：公开了一种用于分离例如卡和基板之间的互连的装置。该装置包括一个或多个旋转偏置（例如，弹簧加载等）部分圆形结构（例如，叶片，刮板，犁等）和连接到部分圆形结构的一个或多个温度敏感的释放。当由温度敏感的释放释放时，部分圆形结构被定位成旋转和分离互连。本发明还可以包括定位成从由部分圆形结构分开的互连件接收焊料的焊料储存器。

3. 发明授权

US07452215B2 Ball grid array rework using a continuous belt furnace 有权
标题翻译：使用连续带式炉的球栅阵列返修
公开(公告)号：US07452215B2
公开(公告)日：2008-11-18
申请号：US11838946
申请日：2007-08-15
申请人： Mukta G. Farooq , Ray A. Jackson , David C. Linnell , Frank L. Pompeo
发明人： Mukta G. Farooq , Ray A. Jackson , David C. Linnell , Frank L. Pompeo
IPC分类号： H01R12/00
CPC分类号： H01L21/67092 , H01L24/81 , H01L2224/81801 , H01L2924/01322 , H01L2924/14 , H05K13/0486 , Y10T29/49144 , Y10T29/49755 , Y10T29/49757 , Y10T29/53091 , Y10T29/53261 , Y10T29/53274 , Y10T29/53404 , H01L2924/00
摘要： Disclosed is an apparatus for separating interconnects between, for example, a card and a substrate. The apparatus includes one or more rotationally biased (e.g., spring-loaded, etc.) partial-circle structures (e.g., blades, squeegee, plow, etc.) and one or more temperature-sensitive releases connected to the partial-circle structures. The partial-circle structures are positioned to rotate and separate the interconnects when released by the temperature-sensitive releases. The invention can also include solder reservoirs positioned to receive solder from the interconnects separated by the partial-circle structures.
摘要翻译：公开了一种用于分离例如卡和基板之间的互连的装置。该装置包括一个或多个旋转偏置（例如，弹簧加载等）部分圆形结构（例如，叶片，刮板，犁等）和连接到部分圆形结构的一个或多个温度敏感的释放。当由温度敏感的释放释放时，部分圆形结构被定位成旋转和分离互连。本发明还可以包括定位成从由部分圆形结构分开的互连件接收焊料的焊料储存器。

4. 发明授权

US07299530B2 Ball grid array rework using a continuous belt furnace 有权
标题翻译：使用连续带式炉的球栅阵列返修
公开(公告)号：US07299530B2
公开(公告)日：2007-11-27
申请号：US10680622
申请日：2003-10-07
申请人： Mukta G. Farooq , Ray A. Jackson , David C. Linnell , Frank L. Pompeo
发明人： Mukta G. Farooq , Ray A. Jackson , David C. Linnell , Frank L. Pompeo
IPC分类号： B23P19/04
CPC分类号： H01L21/67092 , H01L24/81 , H01L2224/81801 , H01L2924/01322 , H01L2924/14 , H05K13/0486 , Y10T29/49144 , Y10T29/49755 , Y10T29/49757 , Y10T29/53091 , Y10T29/53261 , Y10T29/53274 , Y10T29/53404 , H01L2924/00
摘要： Disclosed is an apparatus for separating interconnects between, for example, a card and a substrate. The apparatus includes one or more rotationally biased (e.g., spring-loaded, etc.) partial-circle structures (e.g., blades, squeegee, plow, etc.) and one or more temperature-sensitive releases connected to the partial-circle structures. The partial-circle structures are positioned to rotate and separate the interconnects when released by the temperature-sensitive releases. The invention can also include solder reservoirs positioned to receive solder from the interconnects separated by the partial-circle structures.
摘要翻译：公开了一种用于分离例如卡和基板之间的互连的装置。该装置包括一个或多个旋转偏置（例如，弹簧加载等）部分圆形结构（例如，叶片，刮板，犁等）和连接到部分圆形结构的一个或多个温度敏感的释放。当由温度敏感的释放释放时，部分圆形结构被定位成旋转和分离互连。本发明还可以包括定位成从由部分圆形结构分开的互连件接收焊料的焊料储存器。

5. 发明申请

US20080271312A1 BALL GRID ARRAY REWORK USING A CONTINUOUS BELT FURNACE 有权
标题翻译：使用连续皮带炉的球网阵列
公开(公告)号：US20080271312A1
公开(公告)日：2008-11-06
申请号：US12175541
申请日：2008-07-18
申请人： Mukta G. Farooq , Ray A. Jackson , David C. Linnell , Frank L. Pompeo
发明人： Mukta G. Farooq , Ray A. Jackson , David C. Linnell , Frank L. Pompeo
IPC分类号： B23P19/00
CPC分类号： H01L21/67092 , H01L24/81 , H01L2224/81801 , H01L2924/01322 , H01L2924/14 , H05K13/0486 , Y10T29/49144 , Y10T29/49755 , Y10T29/49757 , Y10T29/53091 , Y10T29/53261 , Y10T29/53274 , Y10T29/53404 , H01L2924/00
摘要： Disclosed is an apparatus for separating interconnects between, for example, a card and a substrate. The apparatus includes one or more rotationally biased (e.g., spring-loaded, etc.) partial-circle structures (e.g., blades, squeegee, plow, etc.) and one or more temperature-sensitive releases connected to the partial-circle structures. The partial-circle structures are positioned to rotate and separate the interconnects when released by the temperature-sensitive releases. The invention can also include solder reservoirs positioned to receive solder from the interconnects separated by the partial-circle structures.
摘要翻译：公开了一种用于分离例如卡和基板之间的互连的装置。该装置包括一个或多个旋转偏置（例如，弹簧加载等）部分圆形结构（例如，叶片，刮板，犁等）和连接到部分圆形结构的一个或多个温度敏感的释放。当由温度敏感的释放释放时，部分圆形结构被定位成旋转和分离互连。本发明还可以包括定位成从由部分圆形结构分开的互连件接收焊料的焊料储存器。

6. 发明授权

US5964396A Enhanced ceramic ball grid array using in-situ solder stretch with clip 失效
标题翻译：增强型陶瓷球栅阵列使用原位焊料拉伸夹
公开(公告)号：US5964396A
公开(公告)日：1999-10-12
申请号：US909801
申请日：1997-08-12
申请人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
发明人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
IPC分类号： H01L23/12 , B23K3/06 , H01L21/60 , H05K3/34 , B23K31/02 , B23K37/04
CPC分类号： B23K3/0638 , H05K3/3436 , B23K2201/36 , H01L2924/00013 , H01L2924/0002 , H05K2203/0195 , H05K2203/0465 , H05K2203/306 , Y02P70/613
摘要： A device is provided for stretching solder interconnection joints between two substrates of an electronic module. The device employs an expandable metal to exert a separating (stretching) force to the two substrates whereby a lifting rod attached to a clamping bridge is cause to move upwards by expansion of the expandable metal raising a first substrate clamped thereto. A lifting bridge in connection with the clamping bridge is caused to move downward to maintain the lifting bridge in contact with the second substrate being interconnected to the first substrate.
摘要翻译：提供一种用于在电子模块的两个基板之间拉伸焊料互连接头的装置。该装置使用可膨胀金属对两个基板施加分离（拉伸）力，借此通过膨胀可膨胀金属的方式使附接到夹紧桥的提升杆向上移动，从而提升夹持在其上的第一基板。引起与夹紧桥连接的升降桥向下运动，以使升降桥与第二基板相互接触而与第一基板互连。

7. 发明授权

US5553766A In-situ device removal for multi-chip modules 失效
标题翻译：多芯片模块的原位设备拆除
公开(公告)号：US5553766A
公开(公告)日：1996-09-10
申请号：US342563
申请日：1994-11-21
申请人： Raymond A. Jackson , Kathleen A. Lidestri , David C. Linnell , Raj N. Master
发明人： Raymond A. Jackson , Kathleen A. Lidestri , David C. Linnell , Raj N. Master
IPC分类号： B23K1/018 , H05K13/04 , H05K3/34 , B23K3/00
CPC分类号： H05K13/0486 , B23K1/018 , B23K2201/40
摘要： Deformation of a lifting ring of bimetallic structure or memory metal is matched to a solder softening or melting temperature to apply forces to lift a chip from a supporting structure, such as a substrate or multi-chip module, only when the solder connections between the chip and the supporting structure are softened or melted. The temperature of the chip, module and solder connections there between is achieved in a commercially available box oven or belt furnace or the like and results in much reduced internal chip temperatures and thermal gradients within the chip as compared to known hot chip removal processes. Tensile and/or shear forces at solder connections and chip and substrate contacts are much reduced in comparison with known cold chip removal processes. Accordingly, the process is repeatable at will without significant damage to or alteration of electrical characteristics of the chip or substrate.
摘要翻译：双金属结构或记忆金属的提升环的变形与焊料软化或熔化温度匹配，以施加力以从支撑结构（例如基板或多芯片模块）提升芯片，只有当芯片之间的焊料连接支撑结构软化或熔化。与市售的盒式炉或带式炉等相比，芯片，模块和焊料连接的温度是可以实现的，并且与已知的热切屑去除工艺相比，在芯片内的内部芯片温度和热梯度大大降低。与已知的冷芯片去除工艺相比，焊料连接和芯片和基板触点处的拉伸和/或剪切力大大降低。因此，该过程可以随意重复，而不会显着损坏或改变芯片或衬底的电特性。

8. 发明授权

US5975409A Ceramic ball grid array using in-situ solder stretch 失效
标题翻译：陶瓷球栅阵列使用原位焊料拉伸
公开(公告)号：US5975409A
公开(公告)日：1999-11-02
申请号：US909865
申请日：1997-08-12
申请人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
发明人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
IPC分类号： H01L21/60 , H05K3/34 , B23K31/02 , B23K37/04
CPC分类号： H01L24/81 , H01L24/75 , H05K3/3436 , H01L2224/16 , H01L2224/75 , H01L2224/75743 , H01L2224/81801 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/30107 , H05K2203/0195 , H05K2203/0465 , H05K2203/082 , H05K2203/306 , Y02P70/613
摘要： A method and apparatus is provided for forming an elongated solder joint between two soldered substrates of an electronic module by applying a controlled separating force between the two soldered substrates during and/or after heating of the module. The solder joints are plasticized, preferably to the molten state above the liquidus temperature, and are thereby stretched and the module is then cooled to solidify the stretched joints. An apparatus and method are provided which preferably uses a vacuum device as the separating force to stretch the existing solder joints to the desired solder height and configuration which is preferably an hour-glass shape.
摘要翻译：提供了一种方法和装置，用于在电子模块的两个焊接的基板之间通过在模块的加热期间和/或之后施加受控的分离力来在两个焊接的基板之间形成细长的焊接接头。焊接接头被塑化，优选地熔化到高于液相线温度的熔融状态，并且由此被拉伸，然后将模块冷却以固化拉伸接头。提供了一种优选使用真空装置作为将现有焊料接头拉伸到期望的焊料高度和优选为沙漏形状的构造的分离力的装置和方法。

9. 发明授权

US06497357B2 Apparatus and method for removing interconnections 失效
标题翻译：用于去除互连的装置和方法
公开(公告)号：US06497357B2
公开(公告)日：2002-12-24
申请号：US09850350
申请日：2001-05-07
申请人： Raymond A. Jackson , Scott A. Bradley , Stephen A. DeLaurentis , Mario J. Interrante , David C. Linnell
发明人： Raymond A. Jackson , Scott A. Bradley , Stephen A. DeLaurentis , Mario J. Interrante , David C. Linnell
IPC分类号： B23K120
CPC分类号： B08B1/008 , B08B7/0071 , H01L21/4864 , H05K3/3436 , H05K3/3457
摘要： A method for removing at least one molten or solid structure from a surface including: placing the surface with the at least one molten or solid structure in a fixture; disposing said wiper assembly acted on by a bias proximate the at least one molten or solid structure; retaining the wiper assembly in a first position with a device having a first temperature point level equivalent to or higher than a second melting point level of the at least one molten or solid structure; and raising the temperature of the fixture to the first temperature point level; wherein the at least one molten or solid structure is wiped from the surface when the device reaches the first temperature point level. An apparatus for removing at least one molten or solid structure from a substrate for rework, the apparatus comprising: a fixture for sustaining and biasing the substrate against a wiper assembly; the wiper assembly configured and positioned to slidably engage at least a portion of the substrate; a bias for translating the wiper assembly along a surface of the substrate having the at least one molten or solid structure to be removed; and a guide block assembly capable of guiding and locking the wiper assembly.
摘要翻译：一种用于从表面去除至少一种熔融或固体结构的方法，包括：将具有至少一种熔融或固体结构的表面放置在固定装置中; 将所述擦拭器组件布置成靠近所述至少一个熔融或固体结构的偏压; 将所述刮水器组件保持在具有等于或高于所述至少一个熔融或固体结构的第二熔点水平的第一温度点水平的装置的第一位置; 并将夹具的温度提高到第一温度点水平; 其中当所述装置达到所述第一温度点水平时，所述至少一个熔融或固体结构从所述表面擦拭。一种用于从基板去除至少一个熔融或固体结构以进行返修的装置，所述装置包括：固定装置，用于将所述基板保持并偏置在刮水器组件上; 所述擦拭器组件被构造和定位成可滑动地接合所述衬底的至少一部分; 用于沿着具有要移除的至少一个熔融或固体结构的衬底的表面平移擦拭器组件的偏压; 以及能够引导和锁定刮水器组件的导块组件。

10. 发明授权

US5968670A Enhanced ceramic ball grid array using in-situ solder stretch with spring 失效
标题翻译：增强陶瓷球栅阵列使用弹簧原位焊料拉伸
公开(公告)号：US5968670A
公开(公告)日：1999-10-19
申请号：US909864
申请日：1997-08-12
申请人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , James H. Covell, II , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
发明人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , James H. Covell, II , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
IPC分类号： B23K35/02 , H01L21/60 , H01L23/48 , H05K3/34 , B23K35/14
CPC分类号： H01L24/81 , B23K35/0222 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H05K3/3436 , H01L2224/10135 , H01L2224/13076 , H01L2224/131 , H01L2224/14051 , H01L2224/14505 , H01L2224/16058 , H01L2224/16227 , H01L2224/17051 , H01L2224/81136 , H01L2224/81139 , H01L2224/81801 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/30107 , H05K2201/09781 , H05K2201/10265 , H05K2203/0415 , H05K2203/0465 , H05K2203/306 , Y02P70/613 , Y10T428/12222 , Y10T428/12333 , Y10T428/12486
摘要： A method and apparatus are provided for forming an elongated solder joint between two soldered substrates of an electronic module or an electronic module in the process of being fabricated by using expandable solder bump means disposed between the substrates. The expandable solder bumps means comprise solder having a higher reflow temperature than the solder used to join the substrates and expansion means such as a compressed spring encased within the solder and are activated (expanded) by reflowing at a higher temperature than the melting point temperature of the solder joints.
摘要翻译：提供了一种方法和装置，用于在通过使用设置在基板之间的可膨胀焊料凸块装置制造过程中，在电子模块或电子模块的两个焊接基板之间形成细长焊接接头。可膨胀焊料凸点装置包括具有比用于接合基板的焊料更高的回流温度的焊料和诸如包封在焊料内的压缩弹簧的膨胀装置，并且通过在比熔融温度高于焊点。

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