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1. 发明授权

US5420520A Method and apparatus for testing of integrated circuit chips 失效
标题翻译：用于集成电路芯片测试的方法和装置
公开(公告)号：US5420520A
公开(公告)日：1995-05-30
申请号：US76069
申请日：1993-06-11
申请人： Morris Anschel , Anthony P. Ingraham , Charles R. Lamb , Michael D. Lowell , Voya R. Markovich , Wolfgang Mayr , Richard G. Murphy , Mark V. Pierson , Tamar A. Powers , Timothy S. Reny , Scott D. Reynolds , Bahgat G. Sammakia , Wayne R. Storr
发明人： Morris Anschel , Anthony P. Ingraham , Charles R. Lamb , Michael D. Lowell , Voya R. Markovich , Wolfgang Mayr , Richard G. Murphy , Mark V. Pierson , Tamar A. Powers , Timothy S. Reny , Scott D. Reynolds , Bahgat G. Sammakia , Wayne R. Storr
IPC分类号： G01R31/26 , G01R31/28 , H01L21/66 , H01R13/02 , G01R1/073 , G01R31/02
CPC分类号： G01R31/2863 , G01R31/2886 , G01R31/2862 , G01R31/287 , G01R31/2877 , G01R31/2879
摘要： A method of testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O, power, and ground contacts. In the method of the invention a chip test fixture system is provided. The chip test fixture system has contacts corresponding to the contacts on the semiconductor chip. The carrier contacts have dendritic surfaces. The chip contacts are brought into electrically conductive contact with the conductor pads on the chip test fixture system. Test signal input vectors are applied to the inputs of the semiconductor chip, and output signal vectors are recovered from the semiconductor chip. After testing the chip is removed from the substrate.
摘要翻译：公开了一种测试半导体芯片的方法。单个半导体芯片具有I / O，电源和接地触点。在本发明的方法中，提供了一种芯片测试夹具系统。芯片测试夹具系统具有对应于半导体芯片上的触点的触点。载体触点具有树枝状表面。芯片触点与芯片测试夹具系统上的导体焊盘导电接触。测试信号输入矢量被施加到半导体芯片的输入，从半导体芯片恢复输出信号矢量。测试后，芯片从基板上取下。

2. 发明授权

US5769644A Shelf for housing printed circuit boards 失效
标题翻译：外壳印刷电路板架
公开(公告)号：US5769644A
公开(公告)日：1998-06-23
申请号：US722431
申请日：1996-09-06
申请人： Richard G. Murphy , Bruce I. Dolan
发明人： Richard G. Murphy , Bruce I. Dolan
IPC分类号： H05K7/14 , H01R9/09
CPC分类号： H05K7/1448
摘要： A shelf for housing printed circuit boards in which a back plane has an extension in the form of a back plane extender printed circuit board electrically connected to the back plane and extending forwards from the back plane at one side of the shelf. In a location forwardly of the back plane, the extender printed circuit board carries a connector structure which extends outwards from the extender printed circuit board and has connectors outwards from the extender printed circuit board. These connectors are accessible either from the front or rear of the shelf dependent upon connector orientation. This structure avoids the need for connectors on the rear face of the back plane thus allowing for the back plane to be located further to the rear and permitting increase in size in circuit boards to be mounted within the shelf. The connector structure is preferably detachable so as to permit its replacement with a different design of connector structure. The connector structure may include its own printed circuit board which when changed for a board of different design may change the operation of the total circuit board arrangement including the back plane.
摘要翻译：一种用于容纳印刷电路板的搁架，其中背面具有电气连接到背板并且从搁板一侧的背面向前延伸的背面扩展器印刷电路板形式的延伸部。在背板的前方位置，扩展印刷电路板承载从扩展器印刷电路板向外延伸的连接器结构，并且具有从扩展器印刷电路板向外的连接器。这些连接器可以根据连接器方向从机架的前部或后部进入。这种结构避免了对背面的后表面上的连接器的需要，从而允许背板进一步位于后部，并允许电路板中的尺寸增加以安装在搁板内。连接器结构优选是可拆卸的，以便允许用不同的连接器结构设计进行更换。连接器结构可以包括其自己的印刷电路板，当对于不同设计的电路板进行改变时，可以改变包括背板的总电路板布置的操作。

3. 发明授权

US06336814B1 Flexible cable I/O module system 失效
标题翻译：柔性电缆I / O模块系统
公开(公告)号：US06336814B1
公开(公告)日：2002-01-08
申请号：US09606066
申请日：2000-06-29
申请人： Richard G. Kusyk , Richard G. Murphy , Bruce Irwin Dolan , Craig Donald Suitor
发明人： Richard G. Kusyk , Richard G. Murphy , Bruce Irwin Dolan , Craig Donald Suitor
IPC分类号： H01R1200
CPC分类号： H05K7/1449 , H01R9/2491
摘要： A shelf for housing printed circuit packs in which a backplane has a connector along its top or bottom edge. Connector modules are connected to the backplane by vertical attachment to the backplane edge connector such that the connector modules are located above or below the backplane. The connector modules may be oriented either to be front facing or rear facing. The backplane connector is adapted to accept modules of varying widths and having different connectors thereon.
摘要翻译：用于容纳印刷电路板的搁架，其中背板沿其顶部或底部边缘具有连接器。连接器模块通过垂直连接到背板边缘连接器而连接到背板，使得连接器模块位于背板的上方或下方。连接器模块可以被定向成面向前或后面。背板连接器适于接受不同宽度的模块并且在其上具有不同的连接器。

4. 发明授权

US06510056B1 Hinged removable connector module 有权
标题翻译：铰链可拆卸连接器模块
公开(公告)号：US06510056B1
公开(公告)日：2003-01-21
申请号：US09671252
申请日：2000-09-28
申请人： Richard G. Kusyk , Richard G. Murphy , Bruce Irwin Dolan , Craig Donald Suitor
发明人： Richard G. Kusyk , Richard G. Murphy , Bruce Irwin Dolan , Craig Donald Suitor
IPC分类号： H05K700
CPC分类号： H04Q1/10 , H04Q1/035 , H04Q1/116 , H04Q1/155 , H04Q2201/10 , H04Q2201/12 , H05K7/1449
摘要： The present invention is directed to a shelf for housing PCPs. A backplane extends across the shelf. A connector module having the OAM&P connectors is electrically connected to the backplane and has two positions. In one position it extends sideways from the shelf with the connectors in a front to rear direction. In the second position, the OAM&P connector module is substantially flush with the side of the shelf.
摘要翻译：本发明涉及一种用于容纳PCP的搁板。背板延伸穿过架子。具有OAM＆P连接器的连接器模块电连接到背板并具有两个位置。在一个位置，它从架子侧向延伸，连接器沿前后方向延伸。在第二位置，OAM＆P连接器模块与架子的侧面基本齐平。

5. 发明授权

US5517385A Decoupling capacitor structure 失效
标题翻译：去耦电容器结构
公开(公告)号：US5517385A
公开(公告)日：1996-05-14
申请号：US277791
申请日：1994-07-20
申请人： John Galvagni , Richard G. Murphy , George J. Saxenmeyer
发明人： John Galvagni , Richard G. Murphy , George J. Saxenmeyer
IPC分类号： H01G4/38 , H01G4/20
CPC分类号： H01G4/385 , Y10T29/435
摘要： A capacitor structure is described as having a plurality of dielectric materials located so that each dielectric material is in parallel between capacitor plates. The capacitor value of this structure is preset, therefore, for operation electrically at different specific temperatures. The description gives a specific stacked arrangement for the various dielectric materials in which this capacitor can be formed, as one example of that to which it is adaptable.
摘要翻译：电容器结构被描述为具有多个介电材料，其定位成使得每个电介质材料在电容器板之间并联。该结构的电容器值被预先设定，因此用于在不同的特定温度下进行电气操作。该描述给出了可以形成该电容器的各种介电材料的特定堆叠布置，作为其适用的一个示例。

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