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1. 发明授权

US06337463B1 Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole 有权
标题翻译：用激光制作通孔的方法，适合制作孔的覆铜层压板，以及用于制作孔的辅助材料
公开(公告)号：US06337463B1
公开(公告)日：2002-01-08
申请号：US09271897
申请日：1999-03-18
申请人： Morio Gaku , Nobuyuki Ikeguchi , Yasuo Tanaka , Yoshihiro Kato
发明人： Morio Gaku , Nobuyuki Ikeguchi , Yasuo Tanaka , Yoshihiro Kato
IPC分类号： B23K2600
CPC分类号： H05K3/0038 , B23K26/18 , H05K1/0373 , H05K3/427 , H05K2201/0112 , H05K2201/0215 , H05K2201/0323 , H05K2203/1383
摘要： A method of making a small-diameter through hole having high reliability with regard to a hole wall at a high rate with the energy of a high-output carbon dioxide gas laser without pre-making any hole in a copper foil, forming or disposing a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol on at least a copper foil surface to be irradiated with the carbon dioxide gas laser, and irradiating a surface thereof with necessary pulses of the carbon dioxide gas laser to form the penetration hole, and an auxiliary material for use when a penetration hole is made in the copper-clad laminate with a carbon dioxide gas laser, the auxiliary material being a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol.
摘要翻译：一种制造小孔直径通孔的方法，其具有高孔率的孔壁，高速率地输出高输出二氧化碳气体激光器的能量，而不在铜箔中预先制造任何孔，形成或布置包含或含有3至97体积％的至少一种选自熔点为900℃以上的金属化合物粉末，碳粉末和金属粉末的粉末的有机物的片材，以及至少在300KJ / mol的键能上至少要用二氧化碳气体激光器照射的铜箔表面，并用二氧化碳气体激光器的必要脉冲照射其表面以形成贯通孔，辅助在用二氧化碳气体激光器在覆铜层压板中形成贯通孔时使用的材料，辅助材料是含有3〜97体积％的至少一种粉末的涂层或片材，所述粉末选自 G 该组合物由金属化合物粉末，碳粉末和金属粉末组成，其熔点至少为900℃，结合能为至少300KJ / mol。

2. 发明授权

US06750422B2 Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole 有权
标题翻译：用激光制作通孔的方法，适合制作孔的覆铜层压板，以及用于制作孔的辅助材料
公开(公告)号：US06750422B2
公开(公告)日：2004-06-15
申请号：US10028734
申请日：2001-12-28
申请人： Morio Gaku , Nobuyuki Ikeguchi , Yasuo Tanaka , Yoshihiro Kato
发明人： Morio Gaku , Nobuyuki Ikeguchi , Yasuo Tanaka , Yoshihiro Kato
IPC分类号： B23K2600
CPC分类号： H05K3/0038 , B23K26/18 , H05K1/0373 , H05K3/427 , H05K2201/0112 , H05K2201/0215 , H05K2201/0323 , H05K2203/1383
摘要： A method of making a small-diameter through hole having high reliability with regard to a hole wall at a high rate with the energy of a high-output carbon dioxide gas laser without pre-making any hole in a copper foil, forming or disposing a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol on at least a copper foil surface to be irradiated with the carbon dioxide gas laser, and irradiating a surface thereof with necessary pulses of the carbon dioxide gas laser to form the penetration hole, and an auxiliary material for use when a penetration hole is made in the copper-clad laminate with a carbon dioxide gas laser, the auxiliary material being a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol.
摘要翻译：一种制造小孔直径通孔的方法，其具有高孔率的孔壁，高速率地输出高输出二氧化碳气体激光器的能量，而不在铜箔中预先制造任何孔，形成或布置包含或含有3至97体积％的至少一种选自熔点为900℃以上的金属化合物粉末，碳粉末和金属粉末的粉末的有机物的片材，以及至少在300KJ / mol的键能上至少要用二氧化碳气体激光器照射的铜箔表面，并用二氧化碳气体激光器的必要脉冲照射其表面以形成贯通孔，辅助在用二氧化碳气体激光器在覆铜层压板中形成贯通孔时使用的材料，辅助材料是含有3〜97体积％的至少一种粉末的涂层或片材，所述粉末选自 G 该组合物由金属化合物粉末，碳粉末和金属粉末组成，其熔点至少为900℃，结合能为至少300KJ / mol。

3. 发明授权

US06736988B1 Copper-clad board suitable for making hole with carbon dioxide laser, method of making hole in said copper-clad board and printed wiring board comprising said copper-clad board 有权
标题翻译：适于用二氧化碳激光器制作孔的铜包覆板，在所述铜包覆板上制造孔的方法和包括所述铜包覆板的印刷线路板
公开(公告)号：US06736988B1
公开(公告)日：2004-05-18
申请号：US09699419
申请日：2000-10-31
申请人： Morio Gaku , Nobuyuki Ikeguchi , Yoshihiro Kato , Taro Yoshida
发明人： Morio Gaku , Nobuyuki Ikeguchi , Yoshihiro Kato , Taro Yoshida
IPC分类号： H01B1300
CPC分类号： B32B15/08 , B32B15/20 , B32B27/20 , B32B27/281 , B32B2311/12 , B32B2379/08 , B32B2457/08 , H05K3/0038 , H05K3/025 , H05K3/384 , H05K3/427 , H05K2201/0112 , H05K2201/0154 , H05K2201/0209 , H05K2201/0355 , H05K2203/0346 , H05K2203/0353 , H05K2203/0723
摘要： A copper-clad board suitable for making a hole with a carbon dioxide gas laser, which copper-clad board is obtained by disposing a double-side-treated copper foil provided with a metallic-treatment layer having a high absorption rate of a carbon dioxide gas laser energy on at least one surface, at least on an outer layer of a thermosetting resin composition layer such that the metallic-treatment layer is formed on a shiny surface of the copper foil which shiny surface is to be a surface layer, and laminate-forming the double-side-treated copper foil and the thermosetting resin composition layer under heat and pressure, to make an alloy of the metallic-treatment layer and the copper by the above heating, a method of making hole in the above copper-clad board and a printed wiring board comprising the above copper-clad board.
摘要翻译：一种适于用二氧化碳气体激光器制造孔的铜包覆板，该铜包覆板通过设置具有二氧化碳吸收率高的金属处理层的双面处理铜箔而获得在至少一个表面上，至少在热固性树脂组合物层的外层上的气体激光能量，使得金属处理层形成在光泽表面为表面层的铜箔的光泽表面上，层压在加热和加压下形成双面处理铜箔和热固性树脂组合物层，通过上述加热形成金属处理层和铜的合金，在上述铜包层中制造孔的方法板和包括上述铜包覆板的印刷线路板。

4. 发明授权

US06708404B1 Method of producing high-density copper clad multi-layered printed wiring board having highly reliable through hole 有权
标题翻译：制造高可靠性通孔的高密度铜包层多层印刷电路板的方法
公开(公告)号：US06708404B1
公开(公告)日：2004-03-23
申请号：US09593494
申请日：2000-06-14
申请人： Morio Gaku , Nobuyuki Ikeguchi , Yoshihiro Kato , Hiroki Aoto
发明人： Morio Gaku , Nobuyuki Ikeguchi , Yoshihiro Kato , Hiroki Aoto
IPC分类号： H01K310
CPC分类号： H05K3/0038 , B23K2101/42 , H05K3/429 , H05K2201/0112 , H05K2201/0215 , H05K2201/0323 , H05K2203/0346 , H05K2203/1383 , Y10T29/49155 , Y10T29/49165
摘要： A method of making a high-density copper-clad multi-layered printed wiring board having a reliable through hole including providing a stacked assembly including three copper foil layers and at least two resin layers; providing an auxiliary material on a top surface of the stacked assembly and providing a backup sheet on a bottom surface of the stacked assembly to form an assembly; subjecting the top surface of the assembly to pulsed oscillation from a carbon dioxide laser to form at least one through-hole to produce a pulsed assembly; reducing the thickness of the front and reverse copper foil layers and simultaneously with reducing, removing copper foil burrs, to produce a cleaned assembly; and plating the cleaned assembly with copper to produce the high-density copper-clad multi-layered printed wiring board.
摘要翻译：一种制造具有可靠通孔的高密度铜包层多层印刷布线板的方法，包括提供包括三个铜箔层和至少两个树脂层的层叠组件; 在所述堆叠组件的顶表面上提供辅助材料，并且在所述堆叠组件的底表面上提供备用片以形成组件; 对组件的顶表面进行来自二氧化碳激光器的脉冲振荡以形成至少一个通孔以产生脉冲组件; 减少前后铜箔层的厚度，同时减少去除铜箔毛刺，生产清洁组件; 并用铜电镀清洁组件，以生产高密度铜包层多层印刷线路板。

5. 发明授权

US10212813B2 Resin composition, prepreg, and laminated sheet 有权
公开(公告)号：US10212813B2
公开(公告)日：2019-02-19
申请号：US13639351
申请日：2011-04-07
申请人： Takaaki Ogashiwa , Hiroshi Takahashi , Tetsuro Miyahira , Yoshihiro Kato
发明人： Takaaki Ogashiwa , Hiroshi Takahashi , Tetsuro Miyahira , Yoshihiro Kato
IPC分类号： B32B27/08 , B32B27/38 , H05K1/05 , C08G59/40 , C08G59/62 , C08J5/24 , C09D163/00 , C08K3/22 , C08L63/00 , C08L71/00 , C09D171/00 , C08K5/3415 , C08K3/013
摘要： There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler.

6. 发明授权

US09232648B2 Molybdenum compound powder, prepreg, and laminate 有权
标题翻译：钼化合物粉末，预浸料和层压板
公开(公告)号：US09232648B2
公开(公告)日：2016-01-05
申请号：US14347075
申请日：2012-09-12
申请人： Tetsuro Miyahira , Yoshihiro Kato , Takaaki Ogashiwa , Hiroshi Takahashi
发明人： Tetsuro Miyahira , Yoshihiro Kato , Takaaki Ogashiwa , Hiroshi Takahashi
IPC分类号： B32B3/02 , H05K1/03 , C01G39/00 , C01G39/02 , C08J5/24 , C08K9/02 , C08L63/00 , C09C1/00 , C08L71/12 , B32B27/20
CPC分类号： H05K1/0373 , B32B27/20 , C01G39/00 , C01G39/02 , C01P2004/61 , C01P2004/62 , C01P2004/84 , C08J5/24 , C08K3/22 , C08K9/02 , C08K2003/2255 , C08L63/00 , C08L71/12 , C09C1/0003 , H05K2201/0224 , Y10T428/24893 , Y10T428/256
摘要： The present invention provides a novel surface-treated molybdenum compound powder and provides a prepreg, a laminate, a metal foil laminate, a printed wiring board, and the like that have a low thermal expansion coefficient in the planar direction, and excellent drillability, heat resistance, and flame retardancy. The surface-treated molybdenum compound powder of the present invention has at least part of the surface thereof coated with an inorganic oxide, and this is used as a filler.
摘要翻译：本发明提供了一种新型的表面处理的钼化合物粉末，并且提供了在平面方向上具有低热膨胀系数的预浸料，层压体，金属箔层压体，印刷线路板等，并且具有优异的可钻性，热阻力和阻燃性。本发明的经表面处理的钼化合物粉末的表面的至少一部分涂覆有无机氧化物，并将其用作填料。

7. 发明申请

US20140227531A1 RESIN COMPOSITION, PREPREG, AND LAMINATE 有权
标题翻译：树脂组合物，PREPREG和层压板
公开(公告)号：US20140227531A1
公开(公告)日：2014-08-14
申请号：US14122073
申请日：2012-05-29
申请人： Takaaki Ogashiwa , Hiroshi Takahashi , Tetsuro Miyahira , Yoshihiro Kato
发明人： Takaaki Ogashiwa , Hiroshi Takahashi , Tetsuro Miyahira , Yoshihiro Kato
IPC分类号： H05K1/03 , H05K3/00
CPC分类号： H05K3/0061 , B32B5/024 , B32B15/14 , B32B15/20 , B32B2255/02 , B32B2255/26 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2264/102 , B32B2307/51 , B32B2457/00 , C08G73/0655 , C08J5/24 , C08J2379/04 , C08J2379/08 , C08K3/013 , C08K5/29 , C08K5/315 , C08K5/3415 , C08K5/3445 , C08L63/00 , C08L79/04 , C08L79/085 , H05K1/0326 , H05K1/0346 , H05K2201/0209 , H05K2201/0355 , Y10T156/10 , Y10T428/31529 , C08K3/0033
摘要： It is an object of the present invention to provide, without using a halogenated compound or a phosphorus compound, a resin composition for printed wiring boards, a prepreg, a laminate, and a metal foil-clad laminate, each of which has high-degree flame retardance, has a low water absorption ratio and a high glass transition temperature, and has a high elastic modulus at high temperature. A resin composition according to the present invention includes a specific maleimide compound (A); a cyanate ester compound (B); a non-halogen epoxy resin (C); and an inorganic filler (D).
摘要翻译：本发明的目的是提供一种不使用卤化物或磷化合物的印刷电路板用树脂组合物，预浸料坯，层压体和覆盖金属箔的层叠体，其中，高分子量阻燃性，吸水率低，玻璃化转变温度高，高温弹性模量高。根据本发明的树脂组合物包括特定的马来酰亚胺化合物（A）; 氰酸酯化合物（B）; 非卤素环氧树脂（C）; 和无机填料（D）。

8. 发明申请

US20130136930A1 RESIN COMPOSITION, PREPREG, AND LAMINATE 审中-公开
标题翻译：树脂组合物，PREPREG和层压板
公开(公告)号：US20130136930A1
公开(公告)日：2013-05-30
申请号：US13816008
申请日：2011-08-29
申请人： Yoshihiro Kato , Takaaki Ogashiwa , Hiroshi Takahashi , Tetsuro Miyahira
发明人： Yoshihiro Kato , Takaaki Ogashiwa , Hiroshi Takahashi , Tetsuro Miyahira
IPC分类号： C08K3/00
CPC分类号： C08J5/24 , B32B5/26 , B32B15/092 , B32B15/14 , B32B2262/10 , B32B2307/3065 , B32B2307/58 , B32B2307/734 , B32B2457/08 , C08J2363/00 , C08J2363/04 , C08K3/105 , C08K3/26 , C08K2003/267 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , Y10T428/31529 , C08L63/00
摘要： There are provided a resin composition for printed wiring boards that has a low coefficient of thermal expansion in a plane direction, has excellent heat resistance and drilling workability, and, at the same time, can retain a high level of flame retardance, a prepreg prepared using the resin composition, and a laminated sheet and a metal foil-laminated sheet prepared using the prepreg. The resin composition comprises (A) an inorganic filler that is a mixture composed of a hydromagnesite represented by formula (1): xMgCO3.yMg(OH)2.zH2O (1) wherein x:y:z is 4:1:4, 4:1:5, 4:1:6, 4:1:7, 3:1:3, or 3:1:4 and huntite; (B) an epoxy resin; and (C) a curing agent.
摘要翻译：提供了一种在平面方向上具有低热膨胀系数的印刷电路板用树脂组合物，具有优异的耐热性和钻孔加工性，并且同时可以保持高水平的阻燃性，制备预浸料使用该树脂组合物，以及层压片和使用该预浸料制备的金属箔层压片。树脂组合物包含（A）无机填料，其是由式（1）表示的氢化镁石组成的混合物：xMgCO 3 y Mg（OH）2·zH 2 O（1）其中x：y：z为4：1：4， 4：1：5,4：1：6,4：1：7,3：1：3或3：1：4和hiteite; （B）环氧树脂; 和（C）固化剂。

9. 发明申请

US20130014984A1 ELECTROMAGNETIC WAVE ABSORBER, METHOD OF PRODUCING THE SAME, FLEXIBLE PRINTED WIRING BOARD AND ELECTRONIC DEVICE 审中-公开
标题翻译：电磁波吸收器，其制造方法，柔性印刷线路板和电子设备
公开(公告)号：US20130014984A1
公开(公告)日：2013-01-17
申请号：US13536560
申请日：2012-06-28
申请人： Hironori Iida , Shun Yamanoi , Machiko Minatoya , Seiichiro Tabata , Shinichiro Yamada , Masayoshi Kanno , Masakazu Mitsugi , Yoshihiro Kato
发明人： Hironori Iida , Shun Yamanoi , Machiko Minatoya , Seiichiro Tabata , Shinichiro Yamada , Masayoshi Kanno , Masakazu Mitsugi , Yoshihiro Kato
IPC分类号： H05K9/00 , C09K3/00
CPC分类号： H05K1/0218 , C01B32/00 , H01Q17/002 , H05K9/0083 , H05K2201/0116 , H05K2201/0323 , H05K2201/0715
摘要： Provided is an electromagnetic wave absorber, including a base material and a porous carbon material containing, as a raw material, a plant-based material having a silicon content of 5% by mass or more, in which the porous carbon material has a specific surface area value as measured by the nitrogen BET method of 400 m2/g or more, a silicon content of 1% by mass or less, a pore volume as measured by the BJH method of 0.2 cm3/g or more, and a pore volume as measured by the MP method of 0.2 cm3/g or more, or a total pore volume of pores each having a diameter in the range from 1×10−9 m to 5×10−7 m as measured by the Non Localized Density Functional Theory of 1.0 cm3/g or more.
摘要翻译：本发明提供一种电磁波吸收体，其特征在于，包括基材和多孔碳材料，所述多孔碳材料含有硅含量为5质量％以上的植物性材料作为原料，其中所述多孔碳材料具有比表面积通过氮BET法测定的面积值为400m 2 / g以上，硅含量为1质量％以下，通过BJH法测定的孔体积为0.2cm 3 / g以上，孔体积为通过MP法测量为0.2cm 3 / g以上，或通过非局部密度泛函理论测量的孔径的总孔体积为1×10 -9 m至5×10 -7 m 为1.0cm 3 / g以上。

10. 发明申请

US20120009836A1 PREPREG AND LAMINATE 有权
标题翻译： PREPREG和LAMINATE
公开(公告)号：US20120009836A1
公开(公告)日：2012-01-12
申请号：US13202829
申请日：2010-02-16
申请人： Masayoshi Ueno , Yoshihiro Kato , Takeshi Nobukuni
发明人： Masayoshi Ueno , Yoshihiro Kato , Takeshi Nobukuni
IPC分类号： B32B5/02
CPC分类号： C08J5/24 , B32B15/08 , B32B15/14 , B32B15/20 , B32B17/04 , B32B27/04 , B32B27/38 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2264/10 , B32B2264/101 , B32B2264/102 , B32B2307/3065 , B32B2307/546 , B32B2307/72 , B32B2307/732 , B32B2457/08 , C08J2363/00 , D03D13/008 , D03D15/0011 , D10B2505/02 , H05K1/0366 , H05K2201/029 , Y10T442/20
摘要： This invention relates to a prepreg having a low thermal expansion coefficient in plane direction and a high rigidity, and more particularly to a prepreg comprising a glass cloth (A), and a resin composition including a cyanate ester resin (B), a non-halogen based epoxy resin (C) and an inorganic filler (D), wherein the glass cloth (A) is characterized that when the weight per 1 m2 is W (g/m2), the thickness is t (μm), the number of warp threads per inch is X (thread/inch), and the number of weft threads per inch is Y (thread/inch), the total of X and Y is 150 to 240, t is 17 to 35, and the value of W/t as the apparent density is 1.1 to 1.5, and that the volume fraction of the glass cloth (A) in the prepreg is 32% to 42%.
摘要翻译：本发明涉及一种在平面方向上具有低热膨胀系数和高刚性的预浸料，更具体地涉及包含玻璃布（A）的预浸料，以及包含氰酸酯树脂（B），非水性树脂卤素系环氧树脂（C）和无机填料（D），其中，玻璃布（A）的特征在于，当1m 2的重量为W（g / m 2）时，厚度为t（μm）每英寸经纱为X（螺纹/英寸），每英寸纬纱数为Y（螺纹/英寸），X和Y的总和为150〜240，t为17〜35，W / t，表观密度为1.1〜1.5，玻璃布（A）在预浸料中的体积分数为32〜42％。

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