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    • 4. 发明授权
    • Flow-control methods and systems for multibus systems
    • 多轴系统的流量控制方法和系统
    • US08391717B2
    • 2013-03-05
    • US12785962
    • 2010-05-24
    • Moray McLarenNathan Lorenzo BinkertAlan Lynn DavisNorman Paul Jouppi
    • Moray McLarenNathan Lorenzo BinkertAlan Lynn DavisNorman Paul Jouppi
    • H04J14/00
    • H04B10/278H04J14/028H04L47/13
    • Methods and systems are provided that prevent buffer overflow in multibus systems. In one aspect, a method for controlling the flow of data in a multibus system includes, for each node having an associated broadcast bus in the multibus system, generating status information regarding available data storage space of each receive buffer of the node. The method includes broadcasting the status information to the other nodes connected to the broadcast bus and collecting status information regarding the available storage space of receive buffers of the other nodes connected to the broadcast bus. The method also includes determining whether or not to send data from the node to at least one of the other nodes over the broadcast bus based on the collected status information.
    • 提供了防止多总线系统中的缓冲区溢出的方法和系统。 在一个方面,一种用于控制多巴系统中的数据流的方法包括:对于在所述多总线系统中具有相关联的广播总线的每个节点,生成关于所述节点的每个接收缓冲器的可用数据存储空间的状态信息。 该方法包括将状态信息广播到连接到广播总线的其他节点,并且收集与连接到广播总线的其他节点的接收缓冲器的可用存储空间有关的状态信息。 该方法还包括基于收集的状态信息来确定是否通过广播总线从节点向至少一个其他节点发送数据。
    • 10. 发明申请
    • COMPOSITE PROCESSORS
    • 复合处理器
    • US20130318325A1
    • 2013-11-28
    • US13978039
    • 2011-01-20
    • Raymond G. BeausoleilMarco FiorentinoMoray McLarenGreg AstfalkNathan Lorenzo BinkertDavid A. Fattal
    • Raymond G. BeausoleilMarco FiorentinoMoray McLarenGreg AstfalkNathan Lorenzo BinkertDavid A. Fattal
    • G06F15/80
    • G06F15/80G06E3/00G06F3/00G06F13/4063
    • In one example, a composite processor (100) includes a circuit board (1200), a first processor element package (1230), and a second processor element package (1240). The circuit board has an optical link (1211) and an electrical link (1221). The first processor element package (1230) includes a substrate (1231) with an integrated circuit (240), a sub-wavelength grating optical coupler (1232), and an electrical coupler (1233) coupled to the electrical link (1221) of the circuit board (1200). The second processor element package (1240) includes a substrate (1241) with an integrated circuit (240), a sub-wavelength grating optical coupler (1242), and an electrical coupler (1243) coupled to the electrical link (1221) of the circuit board (1220). The sub-wavelength grating optical coupler (1232) of the first processor element package (1230), the optical link (1211) of the circuit board (1220), and the sub-wavelength grating optical coupler (1242) of the second processor element package (1240) collectively define an optical communications path (1270) between the substrate (1231) of the first processor element package (1230) and the substrate (1241) of the second processor element package (1240).
    • 在一个示例中,复合处理器(100)包括电路板(1200),第一处理器元件封装(1230)和第二处理器元件封装(1240)。 电路板具有光学链路(1211)和电连接(1221)。 第一处理器元件封装(1230)包括具有集成电路(240)的基板(1231),子波长光栅光耦合器(1232)和耦合到所述电连接器(1221)的电耦合器(1233) 电路板(1200)。 第二处理器元件封装(1240)包括具有集成电路(240)的基板(1241),子波长光栅光耦合器(1242)和耦合到所述电连接器(1221)的电耦合器(1243) 电路板(1220)。 第一处理器元件封装(1230)的子波长光栅光耦合器(1232),电路板(1220)的光链路(1211)以及第二处理器元件的子波长光栅光耦合器(1242) 封装(1240)共同地限定了第一处理器元件封装(1230)的衬底(1231)与第二处理器元件封装(1240)的衬底(1241)之间的光通信路径(1270)。