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1. 发明授权

US07509995B2 Heat dissipation element for cooling electronic devices 失效
标题翻译：用于冷却电子设备的散热元件
公开(公告)号：US07509995B2
公开(公告)日：2009-03-31
申请号：US10840410
申请日：2004-05-06
申请人： Mohinder Singh Bhatti , Ilya Reyzin , Debashis Ghosh , Shrikant Mukund Joshi
发明人： Mohinder Singh Bhatti , Ilya Reyzin , Debashis Ghosh , Shrikant Mukund Joshi
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： F28F3/04 , F28D15/0233 , F28F13/00
摘要： A heat dissipation element for cooling an electronic device is disclosed. The heat dissipation element has a top surface and a bottom surface for mounting the electronic device to be cooled thereto. The top surface defines a heat dissipation area for dissipating heat from the electronic device and a plurality of heat transfer fins project upwardly from the top surface and are coextensive with the heat dissipation area. Each of the heat transfer fins defines a plurality of steps having a rise and a run and each of the steps extend across the heat dissipation area for maximizing an amount of heat dissipated from the electronic device. The heat dissipation element is particularly useful in either one of a cold plate assembly used with a liquid cooled unit (LCU) or a boiler plate assembly used with a thermosiphon cooling unit (TCU).
摘要翻译：公开了一种用于冷却电子设备的散热元件。散热元件具有用于安装要冷却的电子设备的顶表面和底表面。顶表面限定了用于从电子设备散热的散热区域，并且多个传热翅片从顶表面向上突出并且与散热区域共同延伸。每个传热翅片限定了具有上升和下降的多个台阶，并且每个台阶延伸穿过散热区域以最大化从电子设备散发的热量。散热元件在与液体冷却单元（LCU）一起使用的冷板组件或与热虹吸冷却单元（TCU）一起使用的锅炉板组件中的任一个中特别有用。

2. 发明授权

US06695039B1 Orientation insensitive thermosiphon assembly for cooling electronic components 失效
标题翻译：用于冷却电子部件的方向不敏感的热虹吸组件
公开(公告)号：US06695039B1
公开(公告)日：2004-02-24
申请号：US10374349
申请日：2003-02-25
申请人： Ilya Reyzin , Mohinder Singh Bhatti , Shrikant Mukund Joshi , Debashis Ghosh
发明人： Ilya Reyzin , Mohinder Singh Bhatti , Shrikant Mukund Joshi , Debashis Ghosh
IPC分类号： F28D1500
CPC分类号： F28D15/0266 , F28D15/02 , F28F3/02 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A thermosiphon assembly for dissipating heat generated by an electronic component using a working fluid is disclosed. The assembly includes an evaporator having a front face, a rear face, and a peripheral wall extending between the front face and the rear face and being arcuate. A heat block contacts the front face for transferring generated heat from the electronic component to the working fluid to vaporize the working fluid. A condenser is in fluid communication with the chamber and connected to the rear face for condensing the vaporized working fluid back to a liquid. The assembly further includes an acute angle between the front face and the peripheral wall such that the chamber extends upwardly at an angle from the front face to the rear face to ensure complete coverage of the heat block with the cooling fluid in any position between horizontal and vertical.
摘要翻译：公开了一种用于散发由电子部件使用工作流体产生的热的热虹吸组件。组件包括具有前表面，后表面和在前表面和后表面之间延伸并且呈弧形的周壁的蒸发器。加热块与前表面接触，用于将产生的热量从电子部件转移到工作流体，以蒸发工作流体。冷凝器与室流体连通并连接到后表面，用于将蒸发的工作流体冷凝回液体。组件还包括在前表面和周壁之间的锐角，使得腔室从前表面向后表面以一定角度向上延伸，以确保热块的完全覆盖，其中冷却流体处于水平和垂直。

3. 发明授权

US07506682B2 Liquid cooled thermosiphon for electronic components 失效
标题翻译：液体冷却热电偶用于电子部件
公开(公告)号：US07506682B2
公开(公告)日：2009-03-24
申请号：US11040989
申请日：2005-01-21
申请人： Mohinder Singh Bhatti , Debashis Ghosh , Ilya Reyzin
发明人： Mohinder Singh Bhatti , Debashis Ghosh , Ilya Reyzin
IPC分类号： F28D15/00 , F28F7/00 , H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A fluid heat exchanger assembly cools an electronic device with a cooling fluid supplied from a heat extractor (R, F) to an upper portion of a housing. A refrigerant is disposed in a lower portion of the housing for liquid-to-vapor transformation. A partition divides the upper portion of the housing from the lower portion and flow interrupters are disposed in the upper portion for interrupting thermal boundary layer to enhance thermal heat transfer to the flow of liquid coolant through the coolant passage of the upper portion in response to heat transferred by an electronic device to the lower portion of the housing.
摘要翻译：流体热交换器组件将电子设备与从散热器（R，F）供应到壳体的上部的冷却流体冷却。制冷剂设置在壳体的下部以进行液体 - 蒸汽转化。分隔件将壳体的上部与下部分隔开，并且流动断流器设置在上部中，用于中断热边界层，以增强热传递到通过上部的冷却剂通道的液体冷却剂流的响应于热量通过电子设备传送到壳体的下部。

4. 发明授权

US06918431B2 Cooling assembly 失效
公开(公告)号：US06918431B2
公开(公告)日：2005-07-19
申请号：US10646505
申请日：2003-08-22
申请人： Ilya Reyzin , Mohinder Singh Bhatti , Debashis Ghosh
发明人： Ilya Reyzin , Mohinder Singh Bhatti , Debashis Ghosh
IPC分类号： F28D15/02 , H01L23/427 , H05K7/20
CPC分类号： H01L23/427 , F28D15/02 , H01L2924/0002 , H01L2924/00
摘要： A cooling assembly having a base plate and a condenser plate. An outer wall interconnects the base plate to the condenser plate to define a sealed chamber with a working fluid being disposed within the sealed chamber. Intersecting partition walls are mounted to the condenser plate and are angled downwardly toward the base plate for directing working fluid on the condenser plate down a corner of the walls toward a portion of the base plate. Preferably, the base plate defines a first circumference and the condenser plate defines a second circumference larger than the first circumference such that the outer wall has an angled configuration extending between the base plate and the condenser plate to provide a larger area within the sealed chamber for a vapor phase of the working fluid than a liquid phase of the working fluid.

5. 发明授权

US06834713B2 Thermosiphon for electronics cooling with nonuniform airflow 失效
标题翻译： Thermosiphon用于不均匀气流的电子冷却
公开(公告)号：US06834713B2
公开(公告)日：2004-12-28
申请号：US10198322
申请日：2002-07-18
申请人： Debashis Ghosh , Shrikant Mukund Joshi , Ilya Reyzin , Mohinder Singh Bhatti
发明人： Debashis Ghosh , Shrikant Mukund Joshi , Ilya Reyzin , Mohinder Singh Bhatti
IPC分类号： F28D1500
CPC分类号： F28D15/0266 , F28F1/126 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises an evaporator defining an evaporating chamber containing a working fluid therein and further including a condenser mounted thereabove. The thermosiphon is positioned at one end of the shroud such that the fan is aligned with the condenser for directing the axial airflow therethrough. The condenser includes a plurality of tubes forming a tube grouping. Each tube having an opening in fluid communication with the evaporator and for receiving and condensing vapor of the working fluid received from the evaporator. The tubes are axially aligned with the airflow and are laterally positioned such that a lateral width of the tube grouping is approximately equal to a width of the hub and substantially in lateral alignment therewith.
摘要翻译：用于冷却电子设备的散热器组件包括容纳在护罩中的风扇，风扇包括轮毂和从其延伸的风扇叶片，用于当风扇叶片旋转时使轴向引导的气流穿过护罩。热虹吸管包括限定在其中容纳工作流体的蒸发室的蒸发器，并且还包括安装在其上方的冷凝器。热虹吸管位于护罩的一端，使得风扇与冷凝器对准，以引导轴向气流通过。冷凝器包括形成管组的多个管。每个管具有与蒸发器流体连通并且用于接收和冷凝从蒸发器接收的工作流体的蒸气的开口。管与气流轴向对齐并且被横向定位成使得管组的横向宽度大致等于毂的宽度并且基本上与其侧向对准。

6. 发明授权

US07119434B1 Efficiency CPU cooling arrangement 有权
标题翻译：效率CPU散热设置
公开(公告)号：US07119434B1
公开(公告)日：2006-10-10
申请号：US11174903
申请日：2005-07-05
申请人： Debashis Ghosh , Mohinder Singh Bhatti , Ilya Reyzin
发明人： Debashis Ghosh , Mohinder Singh Bhatti , Ilya Reyzin
IPC分类号： H01L23/10
CPC分类号： H01L23/36 , G06F1/20 , H01L23/3737 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： A CPU cooling assembly having a first, covering layer of conductive material above the upper surface of an enclosed, heat producing chip and a third, upper layer of conductive material (a heat sink base plate) thermally bonded to the first by an intermediate, second layer of thin, conforming material (thermal grease) that is far less thermally conductive, and more resistive, than the other two layers. The relative thickness relationship of the first and third, more conductive, layers is essentially reversed from the prior art, with first layer being relatively thicker than the third. This creates an overall lower resistance for the three layer sandwich.
摘要翻译： CPU冷却组件，其具有在封闭的发热芯片的上表面上方的导电材料的第一覆盖层，以及第三导电材料上层（散热器基板），其通过中间的第二薄的，一致的材料（导热油脂），其导热性更差，并且比其他两层更具阻性。第一和第三更导电的层的相对厚度关系与现有技术基本相反，其中第一层比第三层相对更厚。这为三层夹心产生了整体较低的阻力。

7. 发明授权

US06714413B1 Compact thermosiphon with enhanced condenser for electronics cooling 有权
标题翻译：紧凑型热虹吸与增强冷凝器电子冷却
公开(公告)号：US06714413B1
公开(公告)日：2004-03-30
申请号：US10271630
申请日：2002-10-15
申请人： Debashis Ghosh , Mohinder Singh Bhatti , Ilya Reyzin
发明人： Debashis Ghosh , Mohinder Singh Bhatti , Ilya Reyzin
IPC分类号： H05K720
CPC分类号： F28F3/02 , F28D15/0266 , F28F1/126 , F28F3/12 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises an evaporator defining an evaporating chamber containing a working fluid therein and further including a condenser mounted thereabove. The thermosiphon is positioned at one end of the shroud such that the fan is aligned with the condenser for directing the axial airflow therethrough. The condenser includes a base having an upper surface and a plurality of fins extending substantially upwardly from the upper surface. The condenser also includes a plurality of tubes forming a tube grouping. Each tube having an opening in fluid communication with the evaporator and for receiving and condensing vapor of the working fluid received from the evaporator. The tubes are axially aligned with the airflow and are laterally positioned such that a lateral width of the tube grouping is approximately equal to a width of the hub and substantially in lateral alignment therewith.
摘要翻译：用于冷却电子设备的散热器组件包括容纳在护罩中的风扇，风扇包括轮毂和从其延伸的风扇叶片，用于当风扇叶片旋转时使轴向引导的气流穿过护罩。热虹吸管包括限定在其中容纳工作流体的蒸发室的蒸发器，并且还包括安装在其上方的冷凝器。热虹吸管位于护罩的一端，使得风扇与冷凝器对准，以引导轴向气流通过。冷凝器包括具有上表面的基座和从上表面大致向上延伸的多个翅片。冷凝器还包括形成管组的多个管。每个管具有与蒸发器流体连通并且用于接收和冷凝从蒸发器接收的工作流体的蒸气的开口。管与气流轴向对齐并且被横向定位成使得管组的横向宽度大致等于毂的宽度并且基本上与其侧向对准。

8. 发明授权

US07406999B2 Capillary-assisted compact thermosiphon 有权
标题翻译：毛细管辅助紧凑型热虹吸管
公开(公告)号：US07406999B2
公开(公告)日：2008-08-05
申请号：US11412287
申请日：2006-04-27
申请人： Mohinder Singh Bhatti , Ilya Reyzin , Debashis Ghosh
发明人： Mohinder Singh Bhatti , Ilya Reyzin , Debashis Ghosh
IPC分类号： F28D15/02
CPC分类号： F28D15/0233 , F28D15/0266 , F28D15/04 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A thermosiphon cooling assembly cools an electronic device with a conical condensing tube disposed about a curved central axis curving upwardly from a top of the evaporating unit to an upper distal end and a shroud disposed outward of an exterior surface of the condensing tube at the upper distal end extending axially along the central axis from the upper distal end to a lower edge spaced from the top defining an air opening. An air moving device moves air about the central axis within the shroud to the air opening. A plurality of condensing fins are disposed in the condensing tube and each condensing fin forms a pair of corners with an interior surface of the condensing tube and a wick material is disposed in each of the corners to return condensed vapor to the evaporating unit.
摘要翻译：热虹吸冷却组件用电子装置冷却电子装置，该锥形冷凝管围绕弯曲的中心轴线设置，该中心轴线从蒸发单元的顶部向上弯曲到上部远端，并且在上部远端处设置在冷凝管外表面外侧的护罩所述端部沿所述中心轴线从所述上远端轴向延伸到与限定空气开口的顶部间隔开的下边缘。空气移动装置将围绕护罩的中心轴线的空气移动到空气开口。多个冷凝翅片设置在冷凝管中，并且每个冷凝翅片与冷凝管的内表面形成一对角部，并且每个角部设置芯材以将冷凝的蒸气返回到蒸发单元。

9. 发明授权

US07331380B2 Radial flow micro-channel heat sink with impingement cooling 失效
标题翻译：径流微通道散热器，具有冲击冷却功能
公开(公告)号：US07331380B2
公开(公告)日：2008-02-19
申请号：US11205338
申请日：2005-08-17
申请人： Debashis Ghosh , Mohinder Singh Bhatti , Ilya Reyzin , Mark Joseph Parisi
发明人： Debashis Ghosh , Mohinder Singh Bhatti , Ilya Reyzin , Mark Joseph Parisi
IPC分类号： F28F13/06
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat sink removes heat from an electronic device and comprises a base, a lid. An inner ring of first fins extend radially outwardly first length from an inner circle and extend axially a first height from the top surface of the base, and an outer ring of second fins extend radially inwardly a second length from an outer periphery and extend axially a second height from the top surface of the base. A confining plate extends radially above the fins and is spaced below the bottom surface of the lid whereby coolant fluid flows from an inlet opening of the lid through the center opening of the confining plate and radially outwardly through the fins and upward around the outer edge of the confining plate and into the space above the confining plate to an outlet opening. A nozzle having a throat is disposed above the lid and extends below the lid to the confining plate. A flow diverter extends upwardly from the top surface of the base and into and through the throat of the nozzle.
摘要翻译：散热器从电子设备移除热量，并且包括底座，盖子。第一翅片的内环从内圆周径向向外延伸第一长度，并从基座的顶表面轴向延伸第一高度，第二翅片的外环从外周向径向向内延伸第二长度，并且轴向延伸从基座顶面的第二高度。限制板径向延伸在翅片的上方并且在盖的底部表面下方间隔开，从而冷却剂流体从盖的入口开口流过约束板的中心开口并径向向外通过翅片并且向上绕着限制板并进入限制板上方的空间到出口。具有喉部的喷嘴设置在盖的上方并在盖的下方延伸到限制板。分流器从基座的顶表面向上延伸并且穿过喷嘴的喉部。

10. 发明申请

US20070289313A1 Thermosiphon with thermoelectrically enhanced spreader plate 审中-公开
标题翻译：热虹吸与热电增强吊具板
公开(公告)号：US20070289313A1
公开(公告)日：2007-12-20
申请号：US11453717
申请日：2006-06-15
申请人： Mohinder Singh Bhatti , Ilya Reyzin , Debashis Ghosh
发明人： Mohinder Singh Bhatti , Ilya Reyzin , Debashis Ghosh
IPC分类号： F25B21/02 , F25D23/12
CPC分类号： F25B21/02 , F25B2321/023 , F25B2321/0251 , H01L23/38 , H01L2924/0002 , H01L2924/00
摘要： A cooling assembly includes a plate having a center portion for engaging and transferring heat from the electronic device and a peripheral portion surrounding the center portion. A heat sink overlies the plate and receives heat from the plate. A thermoelectric module is disposed between the peripheral portion of the plate and the heat sink for pumping heat laterally from the center portion of the plate to the peripheral portion of the plate and then to the heat sink.
摘要翻译：冷却组件包括具有用于接合和传递来自电子设备的热量的中心部分和围绕中心部分的周边部分的板。散热片覆盖在板上并从板上接收热量。热电模块设置在板的周边部分和散热器之间，用于从板的中心部分向板的周边部分横向泵送热量，然后到散热器。

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