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1. 发明授权

US07214548B2 Apparatus and method for flattening a warped substrate 失效
标题翻译：使翘曲基材变平的装置和方法
公开(公告)号：US07214548B2
公开(公告)日：2007-05-08
申请号：US10929179
申请日：2004-08-30
申请人： Mohammed F. Fayaz , Steffen K. Kaldor , Conal E. Murray , Ismail C. Noyan , Anne L. Petrosky
发明人： Mohammed F. Fayaz , Steffen K. Kaldor , Conal E. Murray , Ismail C. Noyan , Anne L. Petrosky
IPC分类号： H01L21/00
CPC分类号： H01L21/67288 , H01L21/6838
摘要： A method, apparatus, and computer program product for flattening a warped substrate. The substrate is placed on a planar surface of a clamping apparatus in direct mechanical contact with the planar surface. The substrate comprises surface regions S1, S2, . . . , SN having an average warpage of W1, W2, . . . , WN, respectively, wherein W1≦W2≦ . . . ≦WN and W1≦WN. Zones Z1, Z2, . . . , ZN of the planar surface respectively comprise vacuum port groups G1, G2, . . . , GN. Each group comprises at least one vacuum port. N is at least 2. A vacuum pressure PV1, PV2, . . . , PVN is generated at each vacuum port within group G1, G2, . . . , GN, at a time of T1, T2, . . . , TN to clamp surface region S1, S2, . . . , SN to zone Z1, Z2, . . . , ZN, respectively. The vacuum pressure PV1, PV2, . . . , PVN is maintained at the vacuum ports of group G1, G2, . . . , GN, respectively, until time TN+1. T1
摘要翻译：一种用于使翘曲的基底平坦化的方法，装置和计算机程序产品。基板被放置在与平面表面直接机械接触的夹紧装置的平面表面上。衬底包括表面区域S 1，S 2，...。。。具有W 1，W 2 2的平均翘曲的S N N N。。。，其中W 1分别为W 1，其中W 1为= W 2 N。。。＆lt; N＆gt;和＆lt; 1＆lt; 1＆gt;＆lt; N＆lt; N＆gt; Z区Z 1，Z 2 2，。。。平面的Z N N分别包括真空端口组G 1，G 2，...。。。，G N N。每个组包括至少一个真空端口。 N至少为2.真空压力P V1，P2 S2。。。在组G 1，G 2 2中的每个真空端口处产生P 。。。在T 1时，T 2时，G N，N N 3。。。，T N N夹紧表面区域S 1，S 2，N 2。。。，Z N 1，Z 2，...，Z N 2。。。，Z N N 3。真空压力P ，P ，。。，P N 2保持在组G 1，G 2 2的真空端口。。。，分别为N N + 1，直到时间T N + 1。 T 1 。。。 N + 1 N + 1。

2. 发明授权

US5205461A Method and apparatus for fluxless solder bonding 失效
标题翻译：无焊剂焊接方法和装置
公开(公告)号：US5205461A
公开(公告)日：1993-04-27
申请号：US524408
申请日：1990-05-16
申请人： Harry R. Bickford , Raymond R. Horton , Ismail C. Noyan , Michael J. Palmer , John C. Zyzo
发明人： Harry R. Bickford , Raymond R. Horton , Ismail C. Noyan , Michael J. Palmer , John C. Zyzo
IPC分类号： B23K1/012 , H01L21/00 , H05K3/34
CPC分类号： H01L21/67144 , B23K1/012 , H05K3/3494
摘要： Method and apparatus for fluxlessly solder bonding a solder mound to a solder wettable surface. A heated gas, preferably a reducing or non-reactive gas, is directed at a solid solder mound. Gas is heated to a temperature sufficient to melt solder mound. The heated gas is directed at the molten solder mound at a momentum sufficient to disperse an oxide layer at the surface of the molten solder mound. Dispersing the oxide layer permits the molten solder to wet the solder wettable surface. The molten solder is cooled to form a solder bond.
摘要翻译：将焊锡焊料无焊焊接到焊料可润湿表面的方法和装置。加热气体，优选还原性或非反应性气体，被引导到固体焊料堆。将气体加热到足以熔化焊料堆的温度。加热的气体以足以将氧化物层分散在熔融焊料堆的表面的动量指向熔融焊料堆。分散氧化物层允许熔融焊料润湿焊料可润湿表面。将熔融的焊料冷却以形成焊料接合。

3. 发明授权

US5038195A Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate 失效
标题翻译：组合和涂层以防止电介质基底上的导体之间的电流引起的电化学枝晶形成
公开(公告)号：US5038195A
公开(公告)日：1991-08-06
申请号：US477705
申请日：1990-02-09
申请人： William D. Brewer , Kurt R. Grebe , Raymond R. Horton , Linda C. Matthew , Ismail C. Noyan , Michael J. Palmer , Sampath Purushothaman , David L. Rath
发明人： William D. Brewer , Kurt R. Grebe , Raymond R. Horton , Linda C. Matthew , Ismail C. Noyan , Michael J. Palmer , Sampath Purushothaman , David L. Rath
IPC分类号： H01L21/60 , H01L21/48 , H01L23/498 , H01L23/50 , H05K1/00 , H05K1/09 , H05K3/24
CPC分类号： H05K3/244 , H01L21/4846 , H01L23/49866 , H05K1/09 , H01L2924/0002 , H01L2924/09701 , H05K1/0393 , Y10T428/1291
摘要： The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.

4. 发明授权

US5233221A Electronic substrate multiple location conductor attachment technology 失效
标题翻译：电子基板多位导体附着技术
公开(公告)号：US5233221A
公开(公告)日：1993-08-03
申请号：US736090
申请日：1991-07-26
申请人： Mark F. Bregman , Raymond R. Horton , Alphonso P. Lanzetta , Ismail C. Noyan , Michael J. Palmer , Ho-Ming Tong
发明人： Mark F. Bregman , Raymond R. Horton , Alphonso P. Lanzetta , Ismail C. Noyan , Michael J. Palmer , Ho-Ming Tong
IPC分类号： H01L21/48 , H01L21/60 , H01L23/498 , H05K3/40
CPC分类号： H01L24/86 , H01L21/4842 , H01L23/49811 , H01L23/49861 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/4084
摘要： A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.
摘要翻译：一种导体附件，其中每个导体安装在介质带上，并且具有由带支撑到邻近位置的附接部分，距离接合位置具有均匀的距离，并且与带的下侧平面接触。一个导体支撑带具有延伸到中心接触区域中的带的部分，以接触位于远离边缘的行中的接触垫处的位置。另一个支撑带在接触位置处具有窗口。导体端部通过弹性体表面辊和固体背衬辊之间的制造滚动操作而进入带的下侧的水平面。

5. 发明授权

US5117275A Electronic substrate multiple location conductor attachment technology 失效
标题翻译：电子基板多位置导线器附件技术
公开(公告)号：US5117275A
公开(公告)日：1992-05-26
申请号：US602837
申请日：1990-10-24
申请人： Mark F. Bregman , Raymond R. Horton , Alphonso P. Lanzetta , Ismail C. Noyan , Michael J. Palmer , Ho-Ming Tong
发明人： Mark F. Bregman , Raymond R. Horton , Alphonso P. Lanzetta , Ismail C. Noyan , Michael J. Palmer , Ho-Ming Tong
IPC分类号： H01L21/48 , H01L21/60 , H01L23/498 , H01L23/50 , H05K3/40
CPC分类号： H01L24/86 , H01L21/4842 , H01L23/49811 , H01L23/49861 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/4084 , Y10T29/49142 , Y10T29/49153 , Y10T29/53235
摘要： A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

6. 发明授权

US5263620A Wirebond removal apparatus using alternating fluid stream 失效
标题翻译：使用交替流体流的导线粘合去除装置
公开(公告)号：US5263620A
公开(公告)日：1993-11-23
申请号：US843693
申请日：1992-02-28
申请人： Bernardo Hernandez , Raymond R. Horton , Ismail C. Noyan , Michael J. Palmer , Mark B. Ritter
发明人： Bernardo Hernandez , Raymond R. Horton , Ismail C. Noyan , Michael J. Palmer , Mark B. Ritter
IPC分类号： H01L21/60 , B08B3/02 , B23K1/018 , B26F3/00 , H05K13/04
CPC分类号： H05K13/0486 , B23K1/018 , H01L24/98 , H01L2224/05554 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48011 , H01L2224/48091 , H01L2224/48227 , H01L2224/85201 , H01L24/45 , H01L24/48 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/20752 , Y10T225/10 , Y10T225/30 , Y10T225/329 , Y10T29/49821 , Y10T29/53274
摘要： A method and apparatus for removing wires bonded between chip contact pads and substrate contact pads using an alternating fluid flow is described. The fluid flow is preferably air. A nozzle having a plurality of air jets within a chip accommodating cavity is disposed over the chip to enclose the chip contact pads, the substrate contact pads and the wires bonded therebetween. Air is forced through the plurality of jets to cause an alternating clockwise and counter clockwise air flow which bends the plurality of wires back and forth until they fatigue at the contact points to the chip contact pads in a substrate contact pads which results in the wires being substantially simultaneously severed therefrom. The nozzle has an aperture out through which the air escapes carrying the severed wires therewith for collection in a filter.

7. 发明授权

US5186632A Electronic device elastomeric mounting and interconnection technology 失效
标题翻译：电子器件弹性体安装和互连技术
公开(公告)号：US5186632A
公开(公告)日：1993-02-16
申请号：US762977
申请日：1991-09-20
申请人： Raymond R. Horton , Ismail C. Noyan , Michael J. Palmer , Mark B. Ritter
发明人： Raymond R. Horton , Ismail C. Noyan , Michael J. Palmer , Mark B. Ritter
IPC分类号： H01R24/00 , H01R12/62 , H01R12/72 , H05K3/36 , H05K7/02
CPC分类号： H01R12/62 , H01R12/721 , H05K3/365 , H05K7/023
摘要： An interconnecting and mounting technology involving the use of elastomeric properties. A mounting member grips, in a notch, the edge of a device supporting planar member with the device conductors brought to that edge. Conductors are provided at the surface of the mounting member, contacting the device conductors in the notch, and connecting with external wiring conductors on an external wiring planar member. The external wiring to device conductor interconnecting conductors can be on flex tape including elastomeric contact adaptation. Retention force for mounting member compression and mounting member to external wiring planar member retention is provided.

8. 发明申请

US20090302474A1 Atomic laminates for diffucion barrier applications 审中-公开
标题翻译：用于扩散阻挡层的原子层压板
公开(公告)号：US20090302474A1
公开(公告)日：2009-12-10
申请号：US12583108
申请日：2009-08-13
申请人： Katayun Barmak , Hyungjun Kim , Ismail C. Noyan , Stephen M. Rossnagel
发明人： Katayun Barmak , Hyungjun Kim , Ismail C. Noyan , Stephen M. Rossnagel
IPC分类号： H01L23/532
CPC分类号： H01L21/76846 , H01L23/53238
摘要： The present invention relates to a very thin multilayer diffusion barrier for a semiconductor device and fabrication method thereof. The multilayer diffusion barrier according to the present invention is fabricated by forming a very thin, multilayer diffusion barrier composed of even thinner sub-layers, where the sub-layers are only a few atoms thick. The present invention provides a diffusion barrier layer for a semiconductor device which is in a substantially amorphous state and thermodynamically stable, even at high temperatures.
摘要翻译：本发明涉及一种用于半导体器件的非常薄的多层扩散阻挡层及其制造方法。根据本发明的多层扩散阻挡层通过形成由更薄的子层组成的非常薄的多层扩散阻挡层来制造，其中子层仅为几个原子厚。本发明提供一种用于半导体器件的扩散阻挡层，该扩散阻挡层处于基本非晶态并且在高温下具有热力学稳定性。

9. 发明授权

US5229328A Method for bonding dielectric mounted conductors to semiconductor chip contact pads 失效
标题翻译：将电介质安装的导体接合到半导体芯片接触焊盘的方法
公开(公告)号：US5229328A
公开(公告)日：1993-07-20
申请号：US908429
申请日：1992-06-30
申请人： Mark F. Bregman , Raymond R. Horton , Alphonso P. Lanzetta , Ismail C. Noyan , Michael J. Palmer , Ho-Ming Tong
发明人： Mark F. Bregman , Raymond R. Horton , Alphonso P. Lanzetta , Ismail C. Noyan , Michael J. Palmer , Ho-Ming Tong
IPC分类号： H01L21/48 , H01L21/60 , H01L23/498 , H05K3/40
CPC分类号： H01L24/86 , H01L21/4842 , H01L23/49811 , H01L23/49861 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/4084 , Y10T29/49121
摘要： A method for bonding conductors to semiconductor chip contact pads wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.
摘要翻译：一种用于将导体接合到半导体芯片接触焊盘的方法，其中每个导体安装在电介质带上，并且具有由带支撑到相邻位置的附接部分，距离接合位置具有均匀的距离，并且与平面接触的磁带下面。一个导体支撑带具有延伸到中心接触区域中的带的部分，以接触位于远离边缘的行中的接触垫处的位置。另一个支撑带在接触位置处具有窗口。导体端部通过弹性体表面辊和固体背衬辊之间的制造滚动操作而进入带的下侧的水平面。

10. 发明授权

US5093890A Optical bus for computer systems 失效
标题翻译：计算机系统的光总线
公开(公告)号：US5093890A
公开(公告)日：1992-03-03
申请号：US618768
申请日：1990-11-27
申请人： Mark F. Bregman , Ismail C. Noyan , Mark B. Ritter , Harold S. Stone
发明人： Mark F. Bregman , Ismail C. Noyan , Mark B. Ritter , Harold S. Stone
IPC分类号： G02B6/24 , G02B6/28 , G02B6/42 , G02B6/43 , G06E3/00 , H01L27/15 , H04B10/213
CPC分类号： G02B6/43 , G02B6/2817
摘要： An optical bus for interconnecting electronic devices. The bus has a substrate with through-holes therein. An optically conductive material is disposed on one side of the substrate. The material fills the through-holes and forms a layer of predetermined thickness on this side of the substrate. In the outer surface of this layer there are facets or angled regions. The surface and facets are optically reflective. Cards or modules are optically connected by means of optical connectors to the through-holes on the opposite side of the substrate. Light emitted by the connector travels to the associated faceted surface from which it reflects towards other faceted surfaces from which it is partially transmitted and partially reflected to another connector. The arrangement permits optical communication between a plurality of electronic devices.

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