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1. 发明授权

US4374876A Process for the immersion deposition of gold 失效
标题翻译：金浸入沉积工艺
公开(公告)号：US4374876A
公开(公告)日：1983-02-22
申请号：US269445
申请日：1981-06-02
申请人： Mohamed F. El-Shazly , Kenneth D. Baker , Yvonne Rymwid
发明人： Mohamed F. El-Shazly , Kenneth D. Baker , Yvonne Rymwid
IPC分类号： C23C18/42 , C23C3/02
CPC分类号： C23C18/42
摘要： An electroless plating process for depositing gold on substrates, such as metal and metallized substrates, which involves immersing the substrates in an electroless plating bath composed of a trivalent gold complex, an organic carboxylic acid, and/or a mineral acid sufficient in amount so that the pH of the bath will range from about 0.1 to 6.0. The process of utilizing said electroless bath to deposit gold on the aforementioned substrates is also disclosed and claimed.
摘要翻译：一种用于在诸如金属和金属化基底的基底上沉积金的无电镀方法，其包括将基底浸入由三价金络合物，有机羧酸和/或无机酸组成的化学镀浴中，其量足以使得浴的pH范围为约0.1至6.0。还公开并要求保护利用所述无电镀浴将金沉积在上述基板上的工艺。

2. 发明授权

US4337091A Electroless gold plating 失效
标题翻译：无电镀金
公开(公告)号：US4337091A
公开(公告)日：1982-06-29
申请号：US246472
申请日：1981-03-23
申请人： Mohamed F. El-Shazly , Kenneth D. Baker
发明人： Mohamed F. El-Shazly , Kenneth D. Baker
IPC分类号： C23C18/44 , C23C3/02
CPC分类号： C23C18/44
摘要： Improved electroless or autocatalytic gold plating baths wherein the gold ingredient is a water soluble trivalent gold component selected from an alkali metal auricyanide, an alkali metal aurihydroxide, and an alkali metal aurate. The bath contains an amino borane, an alkali metal borohydride, or an alkali metal cyanoborohydride as the reducing agent; an alkaline agent such as an alkali metal hydroxide; and an alkaline buffering agent. Optionally, the bath may contain added alkali metal cyanide. The method of utilizing such electroless or autocatalytic plating bath for depositing gold on metallic substrates such as gold, copper, copper alloys, electroless copper, electroless nickel, nickel, nickel alloys, etc. and on a non-metallic substrates is also described and claimed.
摘要翻译：改进的无电解或自催化金电镀浴，其中金成分是选自碱金属阿仑尼高，碱金属氢氧化物和碱金属钴酸盐的水溶性三价金组分。该浴液含有氨基硼烷，碱金属硼氢化物或作为还原剂的碱金属氰基硼氢化物; 碱金属氢氧化物等碱剂; 和碱性缓冲剂。任选地，浴可以含有添加的碱金属氰化物。还描述并要求使用这种无电镀或自催化电镀浴在诸如金，铜，铜合金，化学镀铜，无电镍，镍，镍合金等的金属基底上沉积金的方法。

3. 发明授权

US06517424B2 Protective coatings for CMP conditioning disk 失效
标题翻译： CMP调理盘保护涂层
公开(公告)号：US06517424B2
公开(公告)日：2003-02-11
申请号：US09790461
申请日：2001-02-22
申请人： Roy F. Wielonski , Mohamed F. El-Shazly
发明人： Roy F. Wielonski , Mohamed F. El-Shazly
IPC分类号： B24B5300
CPC分类号： B24B53/017 , B24B53/12 , B24D7/02 , B24D18/00
摘要： A conditioning element for trueing and dressing a polishing pad used in a chemical mechanical polishing process (CMP) in connection with the manufacture of semi-conductors is provided with a relatively thin protective coating comprising a material resistant to corrosive attack by CMP slurry compositions, including those particularly well-suited to resist the harsher highly acidic slurry compositions. The CMP conditioning disk comprises a substrate having a surface carrying a monolayer of superabrasive particles braze bonded to the disk and a relatively thin liquid impermeable protective coating which is applied over the surface of the braze bond material and abrasive particles. For use in highly corrosive slurry compositions such as ferric nitrate, CMP braze bonded disk carrying coatings applied by vapor deposition methods comprising chromium and multilayered coatings comprising layers of chromium and amorphous diamond or chromium nitride, for example, are particularly effective to preserve the bond strength of the braze bond material holding the abrasive particles on the CMP conditioning disks.
摘要翻译：用于在与半导体制造有关的化学机械抛光工艺（CMP）中使用的抛光垫的修整和修整的调节元件设置有相对薄的保护涂层，其包括耐受CMP浆料组合物的腐蚀性侵蚀的材料，包括那些特别适合于抵抗更苛刻的高酸性浆料组合物的那些。 CMP调节盘包括具有表面的基底，该表面承载着与盘接合的钎焊的超级磨料颗粒单层，以及涂覆在钎焊接合材料和磨料颗粒表面上的相对薄的液体不可渗透的保护涂层。为了用于高度腐蚀性的浆料组合物如硝酸铁，例如通过包括铬和包含铬层和非晶金刚石或氮化铬的多层涂层的气相沉积方法施加的CMP钎焊粘结盘载体涂层对于保持粘合强度特别有效将磨料颗粒保持在CMP调节盘上的钎焊接合材料。

4. 发明授权

US4474838A Electroless direct deposition of gold on metallized ceramics 失效
标题翻译：金在金属化陶瓷上的无电镀直接沉积
公开(公告)号：US4474838A
公开(公告)日：1984-10-02
申请号：US445126
申请日：1982-12-01
申请人： Alan A. Halecky , Mohamed F. El-Shazly
发明人： Alan A. Halecky , Mohamed F. El-Shazly
IPC分类号： C04B41/88 , C23C18/42 , C23C18/44 , H05K1/03 , H05K3/24 , C23C3/02
CPC分类号： C23C18/42 , H05K1/0306 , H05K3/244 , H05K3/245
摘要： Electroless gold plating baths for plating metallized ceramics wherein the bath comprises (a) alkali metal gold cyanide, (b) alkali metal fluoride, and (c) alkali metal hydroxide. The baths may optionally contain a buffering agent and/or ammonium hydroxide and/or an organic chelating agent. The metallized ceramics contain tungsten, molybdenum, electroless nickel, copper and the like. The gold constituent in the alkali metal gold cyanide may be monovalent, trivalent or mixtures thereof. The method of utilizing such electroless or autocatalytic plating baths is also described and claimed.
摘要翻译：用于电镀金属化陶瓷的无电镀金浴，其中浴包含（a）碱金属氰化金，（b）碱金属氟化物和（c）碱金属氢氧化物。浴可以任选地含有缓冲剂和/或氢氧化铵和/或有机螯合剂。金属化陶瓷含有钨，钼，无电镍，铜等。碱金属氰化金中的金成分可以是一价，三价或其混合物。还描述和要求保护使用这种无电镀或自催化电镀浴的方法。

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