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1. 发明授权

US07553400B2 Plating apparatus and plating method 失效
标题翻译：电镀装置及电镀方法
公开(公告)号：US07553400B2
公开(公告)日：2009-06-30
申请号：US11016924
申请日：2004-12-21
申请人： Mizuki Nagai , Hiroyuki Kanda , Keiichi Kurashina , Satoru Yamamoto , Ryoichi Kimizuka , Hariklia Deligianni , Brett Baker , Keith Kwietniak , Panayotis Andricacos , Phillipe Vereecken
发明人： Mizuki Nagai , Hiroyuki Kanda , Keiichi Kurashina , Satoru Yamamoto , Ryoichi Kimizuka , Hariklia Deligianni , Brett Baker , Keith Kwietniak , Panayotis Andricacos , Phillipe Vereecken
IPC分类号： C25D5/22
CPC分类号： C25D3/38 , C25D5/02 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/007 , C25D17/008 , H01L21/2885 , H01L21/76877
摘要： A plating method is capable of mechanically and electrochemically preferentially depositing a plated film in fine interconnect recesses such as trenches and via holes, and depositing the plated film to a flatter surface. The plating method including: disposing a substrate having fine interconnect recesses such that a conductive layer faces an anode; disposing a porous member between the substrate and the anode; filling a plating solution between the substrate and the anode; and repeating a process of holding the conductive layer and the porous member in contact with each other and moving the conductive layer and the porous member relatively to each other, a process of passing an electric current between the conductive layer and the anode while keeping the conductive layer still with respect to the porous member, and a process of stopping the supply of the electric current between the conductive layer and the anode.
摘要翻译：电镀方法能够机械地和电化学地优先在诸如沟槽和通孔的精细互连凹槽中沉积镀膜，并将镀膜沉积到更平坦的表面上。电镀方法包括：设置具有导电层面向阳极的细微互连凹槽的衬底; 在基板和阳极之间设置多孔构件; 在基板和阳极之间填充电镀液; 并且重复保持导电层和多孔构件彼此接触并相对于彼此移动导电层和多孔构件的过程，使导电层和阳极之间的电流通过，同时保持导电相对于多孔构件的静止层，以及停止在导电层和阳极之间的电流的供给的处理。

2. 发明申请

US20050241946A1 Plating apparatus and plating method 失效
标题翻译：电镀装置及电镀方法
公开(公告)号：US20050241946A1
公开(公告)日：2005-11-03
申请号：US11016924
申请日：2004-12-21
申请人： Mizuki Nagai , Hiroyuki Kanda , Keiichi Kurashina , Satoru Yamamoto , Ryoichi Kimizuka , Hariklia Deligianni , Brett Baker , Keith Kwietniak , Panayotis Andricacos , Philippe Vereecken
发明人： Mizuki Nagai , Hiroyuki Kanda , Keiichi Kurashina , Satoru Yamamoto , Ryoichi Kimizuka , Hariklia Deligianni , Brett Baker , Keith Kwietniak , Panayotis Andricacos , Philippe Vereecken
IPC分类号： C25D3/38 , C25D5/00 , C25D5/02 , C25D5/08 , C25D5/18 , C25D7/12 , C25D17/00 , H01L21/288 , H01L21/768
CPC分类号： C25D3/38 , C25D5/02 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/007 , C25D17/008 , H01L21/2885 , H01L21/76877
摘要： A plating method is capable of mechanically and electrochemically preferentially depositing a plated film in fine interconnect recesses such as trenches and via holes, and depositing the plated film to a flatter surface. The plating method including: disposing a substrate having fine interconnect recesses such that a conductive layer faces an anode; disposing a porous member between the substrate and the anode; filling a plating solution between the substrate and the anode; and repeating a process of holding the conductive layer and the porous member in contact with each other and moving the conductive layer and the porous member relatively to each other, a process of passing an electric current between the conductive layer and the anode while keeping the conductive layer still with respect to the porous member, and a process of stopping the supply of the electric current between the conductive layer and the anode.
摘要翻译：电镀方法能够机械地和电化学地优先在诸如沟槽和通孔的精细互连凹槽中沉积镀膜，并将镀膜沉积到更平坦的表面上。电镀方法包括：设置具有导电层面向阳极的细微互连凹槽的衬底; 在基板和阳极之间设置多孔构件; 在基板和阳极之间填充电镀液; 并且重复保持导电层和多孔构件彼此接触并相对于彼此移动导电层和多孔构件的过程，使导电层和阳极之间的电流通过，同时保持导电相对于多孔构件的静止层，以及停止在导电层和阳极之间的电流的供给的处理。

3. 发明授权

US07311809B2 Plating apparatus for substrate 有权
标题翻译：基板电镀装置
公开(公告)号：US07311809B2
公开(公告)日：2007-12-25
申请号：US10930823
申请日：2004-09-01
申请人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Brett Baker , Hariklia Deligianni , Phillipe Vereecken
发明人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Brett Baker , Hariklia Deligianni , Phillipe Vereecken
IPC分类号： C25D17/00
CPC分类号： C25D7/123 , C25D17/001 , C25D17/004 , C25D17/008 , H01L21/2885
摘要： The present invention provides a plating apparatus for a substrate which can plate a substrate under uniform pressure without increasing a load to be applied while holding the entire surface of a porous member in contact with the surface, to be plated, of the substrate. The plating apparatus for a substrate, includes: a substrate holder for holding a substrate; a cathode unit having a seal member for abutting against and sealing, in a water-tight manner, a peripheral portion of a surface, to be plated, of the substrate held by the substrate holder, and a cathode electrode which is brought into contact with the substrate to supply current to the substrate. An anode which is vertically moveable is disposed in confronting relation to the surface, to be plated, of the substrate; a plating solution impregnated material is disposed between the anode and the surface, to be plated, of the substrate, the plating solution impregnated material being made of a water-retentive material; and a porous member is disposed between the plating solution impregnated material and the surface, to be plated, of the substrate. The plating solution impregnated material is constructed of a plurality of separate members.
摘要翻译：本发明提供了一种用于基板的电镀装置，其能够在保持多孔构件的整个表面与基板的被镀表面接触的同时，在均匀的压力下对基板进行平板化，而不增加要施加的载荷。用于基板的电镀装置包括：用于保持基板的基板保持器; 阴极单元，具有密封构件，该密封构件以水密方式邻接并密封被基板保持件保持的基板的待镀表面的周边部分，以及与基板保持件接触的阴极电极该基板向基板提供电流。可垂直移动的阳极以与基板的待镀表面相对的方式设置; 电镀溶液浸渍材料设置在阳极和待镀覆的表面之间，电镀液浸渍材料由保水材料制成; 并且多孔构件设置在电镀溶液浸渍材料和要被电镀的表面之间。电镀溶液浸渍材料由多个分开的构件构成。

4. 发明申请

US20050077173A1 Plating apparatus for substrate 有权
标题翻译：基板电镀装置
公开(公告)号：US20050077173A1
公开(公告)日：2005-04-14
申请号：US10930823
申请日：2004-09-01
申请人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Brett Baker , Hariklia Deligianni , Phillipe Vereecken
发明人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Brett Baker , Hariklia Deligianni , Phillipe Vereecken
IPC分类号： C25D17/14 , C25D7/12 , C25D17/00 , H01L21/288
CPC分类号： C25D7/123 , C25D17/001 , C25D17/004 , C25D17/008 , H01L21/2885
摘要： The present invention provides a plating apparatus for a substrate which can plate a substrate under uniform pressure without increasing a load to be applied while holding the entire surface of a porous member in contact with the surface, to be plated, of the substrate. The plating apparatus for a substrate, including: a substrate holder for holding a substrate; a cathode unit having a seal member for abutting against and sealing, in a water-tight manner, a peripheral portion of a surface, to be plated, of the substrate held by the substrate holder, and a cathode electrode which is brought into contact with the substrate to supply current to the substrate; an anode vertically moveable disposed in confronting relation to the surface, to be plated, of the substrate; a plating solution impregnated material disposed between the anode and the surface, to be plated, of the substrate, the plating solution impregnated material being made of a water-retentive material; and a porous member disposed between the plating solution impregnated material and the surface, to be plated, of the substrate; wherein the plating solution impregnated material is constructed of a plurality of separate members.
摘要翻译：本发明提供了一种用于基板的电镀装置，其能够在保持多孔构件的整个表面与基板的被镀表面接触的同时，在均匀的压力下对基板进行平板化，而不增加要施加的载荷。一种基板电镀装置，包括：用于保持基板的基板支架; 阴极单元，具有密封构件，该密封构件以水密方式邻接并密封被基板保持件保持的基板的待镀表面的周边部分，以及与基板保持件接触的阴极电极所述基板向所述基板提供电流; 可垂直移动的阳极，其被布置成与所述基板的要被电镀的表面相对; 电镀溶液浸渍材料，其设置在阳极和要被电镀的表面之间，所述电镀液浸渍材料由保水材料制成; 以及设置在所述电镀溶液浸渍材料和要被电镀的所述表面的多孔构件之间; 其中所述电镀溶液浸渍材料由多个分开的构件构成。

5. 发明申请

US20050061659A1 Plating apparatus and plating method 审中-公开
标题翻译：电镀装置及电镀方法
公开(公告)号：US20050061659A1
公开(公告)日：2005-03-24
申请号：US10886716
申请日：2004-07-09
申请人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Brett Baker , Keith Kwietniak , Hariklia Deligianni , Panos Andricacos
发明人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Brett Baker , Keith Kwietniak , Hariklia Deligianni , Panos Andricacos
IPC分类号： C25D7/12 , C25D5/06 , C25D5/08 , C25D5/18 , C25D5/22 , C25D17/00 , C25D17/14 , C25D21/00 , C25D21/12 , H01L21/00 , H01L21/02 , H01L21/288 , H01L21/677 , H01L21/768
CPC分类号： H01L21/288 , C25D5/06 , C25D5/08 , C25D7/123 , C25D17/001 , H01L21/02068 , H01L21/02074 , H01L21/02087 , H01L21/0209 , H01L21/2885 , H01L21/67028 , H01L21/6708 , H01L21/67109 , H01L21/6723 , H01L21/67751 , H01L21/7684 , H01L21/76849 , H01L21/76877
摘要： A plating apparatus is used for filling a fine interconnect pattern formed in a substrate with metal to form interconnects. The plating apparatus includes a cathode unit having a seal member for hermetically sealing a peripheral portion of a surface, to be plated, of the substrate and a cathode electrode which is brought into contact with the substrate to supply current to the substrate; an electrode head disposed so as to be movable toward and away from the surface to be plated and having an anode and a porous member with water retentivity at upper and lower parts of the electrode head; a pressing mechanism for pressing the porous member against the surface, to be plated, of the substrate under a desired pressure; and a driving mechanism for making a relative motion between the porous member and the substrate while the porous member and the surface, to be plated, of the substrate are brought into contact with each other.
摘要翻译：电镀装置用于用金属填充形成在衬底中的精细互连图案以形成互连。电镀装置包括：阴极单元，具有密封部件，用于密封要被电镀的基板的周边部分和与基板接触的阴极电极，以向基板提供电流; 电极头，其设置成能够朝向和远离待镀表面移动，并且在电极头的上部和下部具有阳极和具有保水性的多孔构件; 用于在所需压力下将所述多孔构件按压在所述基板的要被电镀的表面上的按压机构; 以及用于在多孔构件和被电镀的表面彼此接触的同时在多孔构件和基底之间进行相对运动的驱动机构。

6. 发明授权

US07725883B1 Program interpreter 有权
标题翻译：程序口译员
公开(公告)号：US07725883B1
公开(公告)日：2010-05-25
申请号：US11295223
申请日：2005-12-05
申请人： Charles G. Nylander , William M. McKeeman , Brett Baker , William Nell
发明人： Charles G. Nylander , William M. McKeeman , Brett Baker , William Nell
IPC分类号： G06F9/45 , G06F9/44
CPC分类号： G06F8/41 , G06F9/45504
摘要： A method and system is provided that allows a well-behaved program to execute more quickly than dynamically typed programming languages did in the past, thereby allowing a the dynamically typed language to be competitive with static declarative programming languages. A method includes converting lines of source code representing functions to byte-codes representing functions, selecting a subsequence of the byte-codes based on the byte-codes and the dynamic run-time properties of program variables, generating processor instructions in a compiler for the subsequence, and interpreting the byte-codes not contained in the subsequence.
摘要翻译：提供了一种方法和系统，其允许行为良好的程序比过去执行的动态类型编程语言更快地执行，从而允许动态类型语言与静态声明式编程语言竞争。一种方法包括将表示功能的源代码行转换为表示功能的字节代码，基于字节码和程序变量的动态运行时属性来选择字节码的子序列，在编译器中生成处理器指令，子序列，并解释子包中不包含的字节码。

7. 发明申请

US20090044196A1 METHOD OF USING PARALLEL PROCESSING CONSTRUCTS 有权
标题翻译：使用并行处理结构的方法
公开(公告)号：US20090044196A1
公开(公告)日：2009-02-12
申请号：US12254572
申请日：2008-10-20
申请人： Halldor N. Stefansson , Penelope L. Anderson , Brett Baker , Edric Ellis , Joseph F. Hicklin , John N. Little , Jocelyn Luke Martin , Piotr R. Luszczek , Nausheen B. Moulana
发明人： Halldor N. Stefansson , Penelope L. Anderson , Brett Baker , Edric Ellis , Joseph F. Hicklin , John N. Little , Jocelyn Luke Martin , Piotr R. Luszczek , Nausheen B. Moulana
IPC分类号： G06F9/46
CPC分类号： G06F9/5027 , G06F8/314
摘要： A computing device-implemented method includes receiving a program, analyzing and transforming the program, determining an inner context and an outer context of the program based on the analysis of the program, and allocating one or more portions of the inner context of the program to two or more labs for parallel execution. The method also includes receiving one or more results associated with the parallel execution of the one or more portions from the two or more labs, and providing the one or more results to the outer context of the program.
摘要翻译：计算设备实现的方法包括接收程序，分析和转换程序，基于程序的分析确定程序的内部上下文和外部上下文，以及将程序的内部上下文的一个或多个部分分配到两个或多个实验室用于并行执行。该方法还包括从两个或多个实验室接收与一个或多个部分的并行执行相关联的一个或多个结果，以及将一个或多个结果提供给程序的外部上下文。

8. 发明授权

US07454746B2 Function call translation 有权
标题翻译：函数调用转换
公开(公告)号：US07454746B2
公开(公告)日：2008-11-18
申请号：US09911819
申请日：2001-07-24
申请人： John T. Micco , William M. McKeeman , Brett Baker , Michael Karr
发明人： John T. Micco , William M. McKeeman , Brett Baker , Michael Karr
IPC分类号： G06F9/45
CPC分类号： G06F8/447
摘要： Methods and apparatus for using description information about a function to translate a call to the function in a first language into a call to a corresponding function in a second language. The methods include create description information from a definition of a function associated with a first language that enables translation of a call to the function in the first language into a call to a corresponding function in a second language without requiring processing of the definition of the function. In one aspect, the methods include providing a description file of items, each item including description information about a function associated with a first language, and using the file of description items to translate a first program file from the first language into a second language.
摘要翻译：使用关于功能的描述信息的方法和装置，用于将对第一语言的功能的调用转换为对第二语言的对应功能的调用。所述方法包括从与第一语言相关联的功能的定义创建描述信息，所述功能使得能够将对第一语言的功能的调用转换为对第二语言的对应功能的调用，而不需要处理功能的定义。在一个方面，所述方法包括提供项目的描述文件，每个项目包括关于与第一语言相关联的功能的描述信息，以及使用描述项目的文件将第一程序文件从第一语言翻译成第二语言。

9. 发明授权

US08799871B2 Computation of elementwise expression in parallel 有权
标题翻译：并行计算元素表达式
公开(公告)号：US08799871B2
公开(公告)日：2014-08-05
申请号：US11651119
申请日：2007-01-08
申请人： Brett Baker
发明人： Brett Baker
IPC分类号： G06F9/44 , G06F9/45
CPC分类号： G06F8/45
摘要： An exemplary embodiment provides methods, systems and mediums for executing arithmetic expressions that represent elementwise operations. An exemplary embodiment provides a computing environment in which elementwise expressions may be executed in parallel by multiple execution units. In an exemplary embodiment, multiple execution units may reside on a network.
摘要翻译：示例性实施例提供用于执行表示元素操作的算术表达式的方法，系统和介质。一个示例性实施例提供一种计算环境，其中可以由多个执行单元并行执行元素表达式。在示例性实施例中，多个执行单元可驻留在网络上。

10. 发明授权

US08255889B2 Method of using parallel processing constructs and dynamically allocating program portions 有权
标题翻译：使用并行处理结构并动态分配程序部分的方法
公开(公告)号：US08255889B2
公开(公告)日：2012-08-28
申请号：US12254578
申请日：2008-10-20
申请人： Halldor N. Stefansson , Brett Baker , Edric Ellis , Joseph F. Hicklin , John N. Little , Jocelyn Luke Martin , Piotr R. Luszczek , Nausheen B. Moulana , Loren Dean , Roy E. Lurie
发明人： Halldor N. Stefansson , Brett Baker , Edric Ellis , Joseph F. Hicklin , John N. Little , Jocelyn Luke Martin , Piotr R. Luszczek , Nausheen B. Moulana , Loren Dean , Roy E. Lurie
IPC分类号： G06F9/45 , G06F9/44
CPC分类号： G06F9/5027 , G06F8/314
摘要： A device, for performing parallel processing, includes a processor to receive one or more portions of an inner context of a program created for a technical computing environment, and allocate one or more portions of the inner context of the program to two or more labs for parallel execution. The processor is also configured to receive one or more results associated with the parallel execution of the one or more portions from the two or more labs, and provide the one or more results to an outer context of the program.
摘要翻译：用于执行并行处理的设备包括处理器，用于接收为技术计算环境创建的程序的内部上下文的一个或多个部分，并且将程序的内部上下文的一个或多个部分分配给两个或更多个实验室，以用于并行执行。处理器还被配置为从两个或更多个实验室接收与一个或多个部分的并行执行相关联的一个或多个结果，并且将一个或多个结果提供给程序的外部上下文。

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