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    • 1. 发明授权
    • Bonding method of base materials, and manufacturing method of image display apparatus
    • 基材的接合方法,图像显示装置的制造方法
    • US08429935B2
    • 2013-04-30
    • US12879652
    • 2010-09-10
    • Mitsutoshi HasegawaMamo MatsumotoTomohiro Saito
    • Mitsutoshi HasegawaMamo MatsumotoTomohiro Saito
    • C03B23/203
    • H01J9/261H01J29/86H01J31/127
    • It arranges a bonding material between a pair of base materials having different heat capacities and in which a difference between thermal expansion coefficients thereof is within 10×10−7/° C.; and bonds the pair of the base materials by the bonding material, by irradiating electromagnetic wave to the bonding material to melt and then harden it, wherein a thermal expansion coefficient at part of the bonding material facing one of the pair of the base materials of which the heat capacity is smaller is smaller than a thermal expansion coefficient at part of the bonding material facing the other of the pair of the base materials of which the heat capacity is larger by a difference within 10×10−7/° C., thereby bonding the base materials of which a difference of thermal expansion coefficients is relatively small, as preventing breakage and crack from occurring and further suppressing a degree of warp.
    • 在具有不同热容的一对基材之间布置粘结材料,其热膨胀系数之差在10×10-7 /℃以内。 并且通过所述接合材料将所述一对基材接合,通过向所述接合材料照射电磁波来熔化,然后使其硬化,其中所述接合材料部分的面对所述一对基材中的一个的热膨胀系数 热容量小于接合材料的一部分的热膨胀系数,所述接合材料的一部分热容容差大于10×10-7 /℃的基材中的另一个,从而 粘合热膨胀系数差相对较小的基材,防止破裂和裂纹发生,并进一步抑制翘曲度。
    • 2. 发明申请
    • MANUFACTURING METHOD OF IMAGE DISPLAY APPARATUS, AND BONDING METHOD OF BASE MATERIALS
    • 图像显示装置的制造方法和基材的粘合方法
    • US20110061806A1
    • 2011-03-17
    • US12875980
    • 2010-09-03
    • Mitsutoshi HasegawaMamo MatsumotoTomohiro Saito
    • Mitsutoshi HasegawaMamo MatsumotoTomohiro Saito
    • B29C65/14
    • H01J9/261H01J29/862H01J31/127H01J2329/8675
    • A method comprises: arranging a bonding material between a pair of base materials; and bonding, as mutually pressing the pair of the base materials, the pair of the base materials by the bonding material, by irradiating an electromagnetic wave while moving an irradiation position along the bonding material to melt and then harden the bonding material, wherein the arranging includes arranging the bonding material on one of faces of the pair of the base materials so as to have a convex portion which continuously extends in a direction along which the bonding material extends and in which its central region in a width direction protrudes toward the other of the faces of the pair of the base materials. Thus, a stress according to heating and cooling of the base material is reduced and crack does not occur easily in a bonding portion.
    • 一种方法包括:在一对基材之间布置接合材料; 以及通过所述接合材料将所述一对基材接合,通过在沿着所述接合材料移动照射位置的同时照射电磁波而熔化所述接合材料并使所述接合材料硬化而进行接合,其中所述布置 包括将所述接合材料布置在所述一对基材的一个表面上,以具有在所述接合材料延伸的方向上连续延伸的凸部,并且所述接合材料的中心区域在宽度方向上朝向另一方突出 一对基材的面。 因此,根据基材的加热和冷却的应力减小,并且在接合部分中不容易发生裂纹。
    • 5. 发明申请
    • BONDING METHOD OF BASE MATERIALS, AND MANUFACTURING METHOD OF IMAGE DISPLAY APPARATUS
    • 基材的粘合方法及图像显示装置的制造方法
    • US20110061804A1
    • 2011-03-17
    • US12879652
    • 2010-09-10
    • Mitsutoshi HasegawaMamo MatsumotoTomohiro Saito
    • Mitsutoshi HasegawaMamo MatsumotoTomohiro Saito
    • B32B37/06
    • H01J9/261H01J29/86H01J31/127
    • It arranges a bonding material between a pair of base materials having different heat capacities and in which a difference between thermal expansion coefficients thereof is within 10×10−7/° C.; and bonds the pair of the base materials by the bonding material, by irradiating electromagnetic wave to the bonding material to melt and then harden it, wherein a thermal expansion coefficient at part of the bonding material facing one of the pair of the base materials of which the heat capacity is smaller is smaller than a thermal expansion coefficient at part of the bonding material facing the other of the pair of the base materials of which the heat capacity is larger by a difference within 10×10−7/° C., thereby bonding the base materials of which a difference of thermal expansion coefficients is relatively small, as preventing breakage and crack from occurring and further suppressing a degree of warp.
    • 在具有不同热容的一对基材之间布置粘结材料,其热膨胀系数之差在10×10-7 /℃以内。 并且通过所述接合材料将所述一对基材接合,通过向所述接合材料照射电磁波来熔化,然后使其硬化,其中所述接合材料部分的面对所述一对基材中的一个的热膨胀系数 热容量小于接合材料的一部分的热膨胀系数,所述接合材料的一部分热容容差大于10×10-7 /℃的基材中的另一个,从而 粘合热膨胀系数差相对较小的基材,防止破裂和裂纹发生,并进一步抑制翘曲度。
    • 6. 发明授权
    • Manufacturing method of hermetic container
    • 密封容器的制造方法
    • US08475618B2
    • 2013-07-02
    • US13198867
    • 2011-08-05
    • Mamo MatsumotoTomohiro SaitoNobuhiro Ito
    • Mamo MatsumotoTomohiro SaitoNobuhiro Ito
    • B32B37/16
    • H01L51/5246H01J9/241H01L51/525
    • A manufacturing method of a hermetic container includes an assembling step of assembling the hermetic container and a sealing step of sealing by first and second sealing materials. Thus, in a case where local heating light is scanned toward an already-sealed portion of the second sealing material, since a separation portion of an unsealed state is located between the already-sealed portion and a downstream end of scanning, a load due to expansion/contraction of a frame body is applied to the first sealing material which is present in the separation portion of the unsealed state. After then, since the local heating light is irradiated to the first sealing material to which the load has been applied so as to heat and melt it, the load is relieved, whereby it is possible to suppress deterioration of joining strength and airtightness of the hermetic container.
    • 密封容器的制造方法包括组装密封容器的组装步骤和通过第一和第二密封材料密封的密封步骤。 因此,在向第二密封材料的已经密封的部分扫描局部加热光的情况下,由于未密封状态的分离部位于已经密封的部分和扫描的下游端之间,所以由于 将框体的伸缩进行施加到存在于未密封状态的分离部中的第一密封材料。 然后,由于局部加热光被照射到已经施加负载的第一密封材料上以加热和熔化,所以负载被释放,从而可以抑制密封件的接合强度和气密性的劣化 容器。
    • 9. 发明申请
    • MANUFACTURING METHOD OF HERMETIC CONTAINER
    • 渗透容器的制造方法
    • US20120055196A1
    • 2012-03-08
    • US13198867
    • 2011-08-05
    • Mamo MatsumotoTomohiro SaitoNobuhiro Ito
    • Mamo MatsumotoTomohiro SaitoNobuhiro Ito
    • C03B23/20
    • H01L51/5246H01J9/241H01L51/525
    • A manufacturing method of a hermetic container includes an assembling step of assembling the hermetic container and a sealing step of sealing by first and second sealing materials. Thus, in a case where local heating light is scanned toward an already-sealed portion of the second sealing material, since a separation portion of an unsealed state is located between the already-sealed portion and a downstream end of scanning, a load due to expansion/contraction of a frame body is applied to the first sealing material which is present in the separation portion of the unsealed state. After then, since the local heating light is irradiated to the first sealing material to which the load has been applied so as to heat and melt it, the load is relieved, whereby it is possible to suppress deterioration of joining strength and airtightness of the hermetic container.
    • 密封容器的制造方法包括组装密封容器的组装步骤和通过第一和第二密封材料密封的密封步骤。 因此,在向第二密封材料的已经密封的部分扫描局部加热光的情况下,由于未密封状态的分离部位于已经密封的部分和扫描的下游端之间,所以由于 将框体的伸缩进行施加到存在于未密封状态的分离部中的第一密封材料。 然后,由于局部加热光被照射到已经施加负载的第一密封材料上以加热和熔化,所以负载被释放,从而可以抑制密封件的接合强度和气密性的劣化 容器。