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1. 发明授权

US08598719B2 Semiconductor element mounting board 有权
标题翻译：半导体元件安装板
公开(公告)号：US08598719B2
公开(公告)日：2013-12-03
申请号：US12997376
申请日：2009-06-03
申请人： Mitsuo Sugino , Hideki Hara , Toru Meura
发明人： Mitsuo Sugino , Hideki Hara , Toru Meura
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/5389 , H01L21/56 , H01L23/3121 , H01L23/3135 , H01L23/562 , H01L24/29 , H01L24/83 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29366 , H01L2224/29386 , H01L2224/8385 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01059 , H01L2924/01072 , H01L2924/01073 , H01L2924/01078 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/1301 , H01L2924/14 , H01L2924/19041 , H01L2924/3511 , H05K1/0271 , H05K3/284 , H05K3/305 , H05K2201/068 , H05K2201/10674 , H05K2203/1322 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2924/00014 , H01L2924/05341 , H01L2924/05442 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A semiconductor element mounting board includes: a board having surfaces; a semiconductor element provided at a side of one of the surfaces of the board; a bonding agent layer through which the board and the semiconductor element are bonded together, the bonding agent layer having a storage modulus at 25° C. of 5 to 1,000 MPa; a first layer into which the semiconductor element is embedded, the first layer provided on the one surface of the board; a second layer provided on the other surface of the board, the second layer being constituted from the same material as that of the first layer, the constituent material of the second layer having the same composition ratio as that of the constituent material of the first layer; and surface layers provided on the first and second layers, respectively, each of the surface layers being formed from at least a single layer. In the semiconductor element mounting board, a coefficient of thermal expansion of each surface layer in an inplane direction thereof measured based on JIS C 6481 at a temperature of 20° C. to a glass-transition temperature Tga° C., which is measured based on JIS C 6481, is 40 ppm/° C. or lower.
摘要翻译：半导体元件安装板包括：具有表面的板; 设置在所述板的一个表面的一侧的半导体元件; 将基板和半导体元件结合在一起的接合剂层，25℃下的储能模量为5〜1000MPa的接合剂层; 第一层，半导体元件被嵌入其中，第一层设置在板的一个表面上; 设置在所述板的另一个表面上的第二层，所述第二层由与所述第一层相同的材料构成，所述第二层的构成材料具有与所述第一层的构成材料相同的组成比 ; 以及分别设置在第一和第二层上的表面层，每个表面层由至少单层形成。在半导体元件安装基板中，基于JIS C 6481在20℃的温度下测定各面层的面内方向的热膨胀系数至玻璃化转变温度Tga°C 在JIS C 6481中为40ppm /℃以下。

2. 发明授权

US08269332B2 Semiconductor element mounting board 失效
标题翻译：半导体元件安装板
公开(公告)号：US08269332B2
公开(公告)日：2012-09-18
申请号：US12682649
申请日：2008-10-15
申请人： Mitsuo Sugino , Hideki Hara , Toru Meura
发明人： Mitsuo Sugino , Hideki Hara , Toru Meura
IPC分类号： H01L23/48
CPC分类号： H01L23/3735 , H01L23/49833 , H01L23/5389 , H01L2924/0002 , H05K1/0271 , H05K3/284 , H05K2203/1322 , H01L2924/00
摘要： A semiconductor element mounting board includes: aboard having surfaces; a semiconductor element mounted on one of the surfaces of the board; a first layer into which the semiconductor element is embedded, the first layer being provided on the one surface of the board; a second layer provided on the other surface of the board, the second layer being constituted from the same material as that of the first layer, the constituent material of the second layer having the same composition ratio as that of the constituent material of the first layer; and surface layers provided on the first and second layers, respectively, each of the surface layers being formed from at least a single layer. In such a semiconductor element mounting board, each of the surface layers has rigidity higher than that of each of the first and second layers. It is preferred that in the case where a Young's modulus of each surface layer at 25° C. is defined as X GPa and a Young's modulus of the first layer at 25° C. is defined as Y GPa, the X and the Y satisfy a relation of 0.5≦X−Y≦13.
摘要翻译：半导体元件安装板包括：具有表面; 安装在所述板的一个表面上的半导体元件; 第一层，半导体元件被嵌入其中，第一层设置在板的一个表面上; 设置在所述板的另一个表面上的第二层，所述第二层由与所述第一层相同的材料构成，所述第二层的构成材料具有与所述第一层的构成材料相同的组成比 ; 以及分别设置在第一和第二层上的表面层，每个表面层由至少单层形成。在这样的半导体元件安装基板中，每个表面层的刚性比第一和第二层的刚性要高。优选的是，将25℃下的各表面层的杨氏模量定义为X GPa，在25℃下将第一层的杨氏模量定义为YGPa的情况下，X和Y满足关系为0.5＆nlE; X-Y＆nlE; 13。

3. 发明申请

US20110084409A1 SEMICONDUCTOR ELEMENT MOUNTING BOARD 有权
标题翻译：半导体元件安装板
公开(公告)号：US20110084409A1
公开(公告)日：2011-04-14
申请号：US12997376
申请日：2009-06-03
申请人： Mitsuo Sugino , Hideki Hara , Toru Meura
发明人： Mitsuo Sugino , Hideki Hara , Toru Meura
IPC分类号： H01L23/488
CPC分类号： H01L23/5389 , H01L21/56 , H01L23/3121 , H01L23/3135 , H01L23/562 , H01L24/29 , H01L24/83 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29366 , H01L2224/29386 , H01L2224/8385 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01059 , H01L2924/01072 , H01L2924/01073 , H01L2924/01078 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/1301 , H01L2924/14 , H01L2924/19041 , H01L2924/3511 , H05K1/0271 , H05K3/284 , H05K3/305 , H05K2201/068 , H05K2201/10674 , H05K2203/1322 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2924/00014 , H01L2924/05341 , H01L2924/05442 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A semiconductor element mounting board includes: a board having surfaces; a semiconductor element provided at a side of one of the surfaces of the board; a bonding agent layer through which the board and the semiconductor element are bonded together, the bonding agent layer having a storage modulus at 25° C. of 5 to 1,000 MPa; a first layer into which the semiconductor element is embedded, the first layer provided on the one surface of the board; a second layer provided on the other surface of the board, the second layer being constituted from the same material as that of the first layer, the constituent material of the second layer having the same composition ratio as that of the constituent material of the first layer; and surface layers provided on the first and second layers, respectively, each of the surface layers being formed from at least a single layer. In the semiconductor element mounting board, a coefficient of thermal expansion of each surface layer in an inplane direction thereof measured based on JIS C 6481 at a temperature of 20° C. to a glass-transition temperature Tga° C., which is measured based on JIS C 6481, is 40 ppm/° C. or lower.
摘要翻译：半导体元件安装板包括：具有表面的板; 设置在所述板的一个表面的一侧的半导体元件; 将基板和半导体元件结合在一起的接合剂层，25℃下的储能模量为5〜1000MPa的接合剂层; 第一层，半导体元件被嵌入其中，第一层设置在板的一个表面上; 设置在所述板的另一个表面上的第二层，所述第二层由与所述第一层相同的材料构成，所述第二层的构成材料具有与所述第一层的构成材料相同的组成比 ; 以及分别设置在第一和第二层上的表面层，每个表面层由至少单层形成。在半导体元件安装基板中，基于JIS C 6481在20℃的温度下测定各面层的面内方向的热膨胀系数至玻璃化转变温度Tga°C 在JIS C 6481中为40ppm /℃以下。

4. 发明申请

US20100213597A1 SEMICONDUCTOR ELEMENT MOUNTING BOARD 失效
标题翻译：半导体元件安装板
公开(公告)号：US20100213597A1
公开(公告)日：2010-08-26
申请号：US12682649
申请日：2008-10-15
申请人： Mitsuo Sugino , Hideki Hara , Toru Meura
发明人： Mitsuo Sugino , Hideki Hara , Toru Meura
IPC分类号： H01L23/48 , H01L23/31
CPC分类号： H01L23/3735 , H01L23/49833 , H01L23/5389 , H01L2924/0002 , H05K1/0271 , H05K3/284 , H05K2203/1322 , H01L2924/00
摘要： A semiconductor element mounting board includes: aboard having surfaces; a semiconductor element mounted on one of the surfaces of the board; a first layer into which the semiconductor element is embedded, the first layer being provided on the one surface of the board; a second layer provided on the other surface of the board, the second layer being constituted from the same material as that of the first layer, the constituent material of the second layer having the same composition ratio as that of the constituent material of the first layer; and surface layers provided on the first and second layers, respectively, each of the surface layers being formed from at least a single layer. In such a semiconductor element mounting board, each of the surface layers has rigidity higher than that of each of the first and second layers. It is preferred that in the case where a Young's modulus of each surface layer at 25° C. is defined as X GPa and a Young's modulus of the first layer at 25° C. is defined as Y GPa, the X and the Y satisfy a relation of 0.5≦X−Y≦13.
摘要翻译：半导体元件安装板包括：具有表面; 安装在所述板的一个表面上的半导体元件; 第一层，半导体元件被嵌入其中，第一层设置在板的一个表面上; 设置在所述板的另一个表面上的第二层，所述第二层由与所述第一层相同的材料构成，所述第二层的构成材料具有与所述第一层的构成材料相同的组成比 ; 以及分别设置在第一和第二层上的表面层，每个表面层由至少单层形成。在这样的半导体元件安装基板中，每个表面层的刚性比第一和第二层的刚性要高。优选的是，将25℃下的各表面层的杨氏模量定义为X GPa，在25℃下将第一层的杨氏模量定义为YGPa的情况下，X和Y满足关系为0.5＆nlE; X-Y＆nlE; 13。

5. 发明申请

US20140183758A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, BLOCK STACKED BODY, AND SEQUENTIAL STACKED BODY 有权
标题翻译：制造半导体器件，块状堆叠体和顺序堆叠体的方法
公开(公告)号：US20140183758A1
公开(公告)日：2014-07-03
申请号：US14239960
申请日：2012-08-24
申请人： Kensuke Nakamura , Toru Meura , Yoji Ishimura
发明人： Kensuke Nakamura , Toru Meura , Yoji Ishimura
IPC分类号： H01L25/00 , H01L25/065
CPC分类号： H01L25/50 , H01L23/3121 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L2224/0401 , H01L2224/05025 , H01L2224/05568 , H01L2224/05655 , H01L2224/06181 , H01L2224/13007 , H01L2224/13023 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/13139 , H01L2224/13147 , H01L2224/16145 , H01L2224/16146 , H01L2224/16238 , H01L2224/2919 , H01L2224/32145 , H01L2224/73104 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/7598 , H01L2224/81191 , H01L2224/81203 , H01L2224/81209 , H01L2224/81815 , H01L2224/83191 , H01L2224/83193 , H01L2224/83203 , H01L2224/83209 , H01L2224/83862 , H01L2224/9211 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/00014 , H01L2924/01029 , H01L2924/10253 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2224/81 , H01L2924/00 , H01L2924/014 , H01L2224/83 , H01L2924/0665 , H01L2224/05552
摘要： A method of manufacturing a semiconductor device is provided which is capable of improving productivity and reliability. The method of manufacturing a semiconductor device (1) of the invention includes a sequential stacking process, an individual stacked body-obtaining process, and a base material bonding process. In the sequential stacking process, a block stacked body is obtained. The block stacked body is a block stacked body (2B) in which semiconductor blocks (10B, 12B, 14B, and 16B) are stacked in a state of not being solder-bonded. In the semiconductor blocks (10B, 12B, 14B, and 16B), a plurality of semiconductor components are arranged. In the individual stacked body obtaining process, an individual stacked body (2) is obtained in which terminals of the stacked semiconductor components are solder-bonded and which is cut from the block stacked body (2B) in a stacked semiconductor component unit.
摘要翻译：提供一种制造半导体器件的方法，其能够提高生产率和可靠性。制造本发明的半导体器件（1）的方法包括顺序堆叠工艺，单独的层叠体获得工艺和基材粘合工艺。在顺序堆叠处理中，获得块堆叠体。块状堆叠体是在未焊接的状态下层叠有半导体块（10B，12B，14B，16B）的块状堆叠体（2B）。在半导体块（10B，12B，14B，16B）中，配置有多个半导体元件。在各个层叠体取得工序中，获得堆叠的半导体部件的端子被焊接并且从堆叠的半导体部件单元中的块状堆叠体（2B）切断的单个层叠体（2）。

6. 发明授权

US08531028B2 Method for manufacturing electronic component, and electronic component 有权
标题翻译：电子部件的制造方法以及电子部件
公开(公告)号：US08531028B2
公开(公告)日：2013-09-10
申请号：US13319531
申请日：2010-07-09
申请人： Kenzou Maejima , Satoru Katsurayama , Toru Meura
发明人： Kenzou Maejima , Satoru Katsurayama , Toru Meura
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： C09D163/00 , H01L21/563 , H01L24/13 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81091 , H01L2224/81093 , H01L2224/81097 , H01L2224/81121 , H01L2224/81191 , H01L2224/81193 , H01L2224/81204 , H01L2224/81209 , H01L2224/81211 , H01L2224/81815 , H01L2224/83192 , H01L2224/83193 , H01L2224/8349 , H01L2224/83862 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/00014 , H01L2924/01014 , H01L2924/00 , H01L2924/3512
摘要： Provided is a method for manufacturing an electronic component by using a solder joining method for bonding a first electronic component having a metal electrode with a second electronic component having a solder electrode, the method comprising; (i) forming a resin layer containing a thermosetting resin on at least one of the solder joint surfaces of said first electronic component and said second electronic component; (ii) positioning said metal electrode of said first electronic component and said solder electrode of said second electronic component to face each other, heating said positioned electrodes and applying pressure, and thereby bringing said metal electrode and said solder electrode into contact; (iii) heating electronic components while applying pressure thereby fusion bonding said solder to said metal electrode; and (iv) heating said resin layer.
摘要翻译：本发明提供一种电子部件的制造方法，其特征在于，使用焊料接合方法，该焊接方法用于将具有金属电极的第一电子部件与具有焊料电极的第二电子部件接合。（i）在所述第一电子部件和所述第二电子部件的至少一个焊接面上形成含有热硬化性树脂的树脂层; （ii）将所述第一电子部件的所述金属电极和所述第二电子部件的所述焊料电极相对配置，加热所述定位电极并施加压力，从而使所述金属电极和所述焊料电极接触; （iii）在施加压力的同时加热电子部件，从而将所述焊料熔合到所述金属电极上; 和（iv）加热所述树脂层。

7. 发明授权

US08389328B2 Method of manufacturing electronic device and electronic device 有权
标题翻译：制造电子装置和电子装置的方法
公开(公告)号：US08389328B2
公开(公告)日：2013-03-05
申请号：US13127770
申请日：2009-10-30
申请人： Toru Meura , Kenzou Maejima , Yoji Ishimura , Mina Nikaido
发明人： Toru Meura , Hiroki Nikaido , Kenzou Maejima , Yoji Ishimura
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H05K3/305 , B23K1/0016 , B23K35/3613 , B23K35/362 , B23K2101/40 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/13111 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/75101 , H01L2224/7511 , H01L2224/75251 , H01L2224/75252 , H01L2224/75272 , H01L2224/75305 , H01L2224/75312 , H01L2224/75985 , H01L2224/81024 , H01L2224/81075 , H01L2224/81093 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2224/81906 , H01L2224/83192 , H01L2224/834 , H01L2224/9211 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01059 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/15787 , H01L2924/181 , H05K3/3436 , H05K2201/10674 , H05K2201/10977 , H05K2203/074 , H05K2203/1189 , Y02P70/613 , Y10T428/24116 , Y10T428/24198 , Y10T428/2424 , Y10T428/31902 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2924/00014
摘要： Provided is a method of manufacturing an electronic device having a first electronic component having a first terminal and a second electronic component having a second terminal, wherein the first electric component is electrically connected to the second electronic component by connecting the first terminal to the second terminal with solder, the method including: providing a resin layer having a flux action between the first terminal and the second terminal to obtain a laminate including the first electronic component, the second electronic component, and the resin layer, wherein a solder is provided on the first terminal or the second terminal; soldering the first terminal and the second terminal; and curing the resin layer while pressing the laminate with a pressurized fluid.
摘要翻译：提供一种制造具有第一电子部件的电子设备的方法，所述第一电子部件具有第一端子和具有第二端子的第二电子部件，其中通过将所述第一端子连接到所述第二端子而将所述第一电气部件电连接到所述第二电子部件该方法包括：提供在第一端子和第二端子之间具有磁通作用的树脂层，以获得包括第一电子部件，第二电子部件和树脂层的层压体，其中焊料设置在第一终端或第二终端; 焊接第一端子和第二端子; 并在用加压流体压制层压体的同时固化树脂层。

8. 发明申请

US20120199988A1 METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE 审中-公开
标题翻译：制造电子设备的方法，电子设备和制造电子设备的装置
公开(公告)号：US20120199988A1
公开(公告)日：2012-08-09
申请号：US13501005
申请日：2010-10-13
申请人： Toru Meura , Hiroki Nikaido , Kenzou Maejima , Yoji Ishimura , Kenji Yoshida
发明人： Toru Meura , Hiroki Nikaido , Kenzou Maejima , Yoji Ishimura , Kenji Yoshida
IPC分类号： H01L23/52 , H01L21/50
CPC分类号： H01L24/81 , C08L63/00 , C09D163/00 , H01L24/75 , H01L24/83 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/13023 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/16145 , H01L2224/16225 , H01L2224/29191 , H01L2224/73104 , H01L2224/73204 , H01L2224/7511 , H01L2224/75283 , H01L2224/7531 , H01L2224/7598 , H01L2224/81193 , H01L2224/81209 , H01L2224/8121 , H01L2224/81801 , H01L2224/83192 , H01L2224/83209 , H01L2224/83801 , H01L2224/83855 , H01L2224/97 , H01L2225/06513 , H01L2225/06565 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01055 , H01L2924/01059 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/15787 , H01L2924/181 , H01L2224/81 , H01L2924/00012 , H01L2924/0665 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/3512 , H01L2924/00 , H01L2224/05552
摘要： Disclosed is a method of manufacturing an electronic device, that includes obtaining a stack of the first electronic component and the second electronic component, while placing a resin layer which contains a flux-active compound and a thermosetting resin, between the first terminals and the second terminals; bonding the first terminals and the second terminals with solder, by heating the stack at a temperature not lower than the melting point of solder layers on the first terminals, while pressurizing the stack using a fluid; and curing the resin layer. The duration from the point of time immediately after the start of heating of the stack, up to the point of time when the temperature of the stack reaches the melting point of the solder layers, is set to 5 seconds or longer, and 15 minutes or shorter.
摘要翻译：公开了一种制造电子器件的方法，包括：在第一端子和第二端子之间放置包含助焊剂活性化合物和热固性树脂的树脂层，获得第一电子部件和第二电子部件的堆叠终端; 通过在不低于第一端子处的焊料层的熔点的温度下加热堆叠，同时使用流体对堆叠进行加压，将焊料接合在第一端子和第二端子上; 并固化树脂层。从堆叠的开始加热之后的时间点直到堆叠的温度达到焊料层的熔点的时间长度设定为5秒以上15分钟或较短

9. 发明申请

US20120061820A1 METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT 有权
标题翻译：电子元件制造方法和电子元件
公开(公告)号：US20120061820A1
公开(公告)日：2012-03-15
申请号：US13319531
申请日：2010-07-09
申请人： Kenzou Maejima , Satoru Katsurayama , Toru Meura
发明人： Kenzou Maejima , Satoru Katsurayama , Toru Meura
IPC分类号： H01L23/52 , B23K1/20 , B23K31/02
CPC分类号： C09D163/00 , H01L21/563 , H01L24/13 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81091 , H01L2224/81093 , H01L2224/81097 , H01L2224/81121 , H01L2224/81191 , H01L2224/81193 , H01L2224/81204 , H01L2224/81209 , H01L2224/81211 , H01L2224/81815 , H01L2224/83192 , H01L2224/83193 , H01L2224/8349 , H01L2224/83862 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/00014 , H01L2924/01014 , H01L2924/00 , H01L2924/3512
摘要： Provided is a method for manufacturing an electronic component by using a solder joining method for bonding a first electronic component having a metal electrode with a second electronic component having a solder electrode, the method comprising; (i) forming a resin layer containing a thermosetting resin on at least one of the solder joint surfaces of said first electronic component and said second electronic component; (ii) positioning said metal electrode of said first electronic component and said solder electrode of said second electronic component to face each other, heating said positioned electrodes and applying pressure, and thereby bringing said metal electrode and said solder electrode into contact; (iii) heating electronic components while applying pressure thereby fusion bonding said solder to said metal electrode; and (iv) heating said resin layer.
摘要翻译：本发明提供一种电子部件的制造方法，其特征在于，使用焊料接合方法，该焊接方法用于将具有金属电极的第一电子部件与具有焊料电极的第二电子部件接合。（i）在所述第一电子部件和所述第二电子部件的至少一个焊接面上形成含有热硬化性树脂的树脂层; （ii）将所述第一电子部件的所述金属电极和所述第二电子部件的所述焊料电极相对配置，加热所述定位电极并施加压力，从而使所述金属电极和所述焊料电极接触; （iii）在施加压力的同时加热电子部件，从而将所述焊料熔合到所述金属电极上; 和（iv）加热所述树脂层。

10. 发明授权

US08079141B2 Electrical connection and method of manufacturing the same 失效
标题翻译：电气连接及其制造方法
公开(公告)号：US08079141B2
公开(公告)日：2011-12-20
申请号：US12866457
申请日：2009-02-24
申请人： Toru Meura
发明人： Toru Meura
IPC分类号： H01R9/00 , B23K31/00
CPC分类号： H05K3/3436 , H01L24/13 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/92 , H01L2224/0554 , H01L2224/05567 , H01L2224/05573 , H01L2224/13022 , H01L2224/73104 , H01L2224/81193 , H01L2224/81204 , H01L2224/81801 , H01L2224/83191 , H01L2224/83855 , H01L2224/92 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01059 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/15787 , H05K3/305 , H05K3/3489 , H05K2201/0382 , H05K2201/10977 , H05K2203/0485 , Y02P70/613 , Y10T29/49144 , Y10T29/49149 , Y10T29/49151 , Y10T29/49204 , H01L2224/81 , H01L2224/83 , H01L2924/3512 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The method for providing the solder connection of the present invention is a method for providing a solder connection, which electrically connects a first electronic component having a solder bump to a second electronic component having a protruded electrode to provide electrical connection between the first solder bump and the protruded electrode, wherein a relation of: A+B>C is satisfied, where a height of the first solder bump from one surface of the first electronic component is presented as A [μm], a height of the protruded electrode before the compressive deformation from one surface of the second electronic component is presented as B [μm], and a thickness of the adhesive agent layer is presented as C [μm], and further comprising: disposing the adhesive agent layer in the first electronic component; and deforming the first solder bump and the protruded electrode and providing a contact of the above-described protruded electrode with the above-described first solder bump, so that the sum of the height A [μm] of the first the solder bump and the height B [μm] of the above-described protruded electrode is substantially equivalent to the thickness C [μm] of the above-described adhesive agent layer.
摘要翻译：提供本发明的焊料连接的方法是一种提供焊接连接的方法，该焊接连接将具有焊料凸块的第一电子部件与具有突出电极的第二电子部件电连接，以提供第一焊料凸块和突出电极，其中满足以下关系：A + B> C，其中第一焊料凸块从第一电子部件的一个表面的高度呈现为A [μm]，突出电极在压缩之前的高度第二电子部件的一个表面的变形为B [μm]，粘合剂层的厚度为C [μm]，进一步包括：将粘合剂层设置在第一电子部件中; 并且使第一焊料凸块和突出电极变形，并且提供上述突出电极与上述第一焊料凸块的接触，使得第一焊料凸块的高度A [μm]与高度上述突出电极的B [μm]基本上等于上述粘合剂层的厚度C [μm]。

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