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    • 5. 发明授权
    • Pattern forming method
    • 图案形成方法
    • US06434730B1
    • 2002-08-13
    • US09484022
    • 2000-01-18
    • Mitsumi ItoHiroyuki TsujikawaSeijiro KojimaMasatoshi Sawada
    • Mitsumi ItoHiroyuki TsujikawaSeijiro KojimaMasatoshi Sawada
    • G06F1750
    • H01L23/5223G06F17/5068H01L23/5286H01L2924/0002H01L2924/3011H01L2924/00
    • After a layout for a semiconductor device including power and ground lines has been defined, patterns for bypass capacitors, which will be located under the power lines, are created. In this case, a pattern for a semiconductor device, where a bypass capacitor array is inlaid and substrate contacts are located under ground lines, is defined based on design rules input. Next, power lines are extracted and resized. Thereafter, logical operations are performed to place the bypass capacitors and the bypass capacitors are resized. Subsequently, logical operations are performed to define interconnecting diffused layers and the diffused layers are resized. Since the patterns for the power lines have already been defined before the patterns for the bypass capacitors are created, the patterns for the bypass capacitors to be placed under the power lines can be defined automatically. Thus, a pattern for a miniaturized semiconductor device with reduced power supply noise can be created automatically.
    • 在定义了包括电源和接地线的半导体器件的布局之后,创建将位于电力线下方的用于旁路电容器的图案。 在这种情况下,基于设计规则输入来定义用于嵌入旁路电容器阵列并且衬底接触的半导体器件的图案位于地线下方。 接下来,提取电源线并调整大小。 此后,进行逻辑运算以放置旁路电容器和旁路电容器大小。 随后,执行逻辑操作以定义互连扩散层,并且扩散层被调整大小。 由于在创建旁路电容器的图案之前已经定义了电源线的图案,因此可以自动定义用于放置在电力线下方的旁路电容器的图案。 因此,可以自动地产生具有降低的电源噪声的小型化半导体器件的图案。