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    • 4. 发明专利
    • Method for manufacturing semi-electroconducting seamless belt
    • 制造半导体无缝带的方法
    • JP2007168333A
    • 2007-07-05
    • JP2005370865
    • 2005-12-22
    • Kinyosha Co LtdSuzuki Rubber Kk株式会社金陽社鈴木ゴム株式会社
    • KONUKI AKIONISHITANI KOSHI
    • B29C69/02B29D29/00B29L29/00G03G15/16
    • PROBLEM TO BE SOLVED: To provide a method for manufacturing a semi-electroconducting seamless belt which shows excellent production efficiency in the manufacture of a semiconducting seamless belt which is suitable as a transfer belt to be arranged in the periphery of a photosensitive drum of an electrophotographic printing device such as a copying machine, a printer or a facsimile machine, and the semi-electroconducting seamless belt which exhibits a low percentage of non-conforming articles and a low manufacturing cost.
      SOLUTION: This method for manufacturing a semiconducting seamless belt comprises a process to apply thermal vulcanization to a rubber elastic layer and a process to form a thermoplastic resin base layer on the inner surface of the rubber elastic layer.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供一种制造半导体无缝带的方法,其在制造半导体无缝带时具有优异的生产效率,该半导体无缝带适合作为布置在感光鼓周边的转印带 诸如复印机,打印机或传真机的电子照相打印设备,以及展示低百分比的不合格品和低制造成本的半导电无缝带。 解决方案:这种制造半导体无缝带的方法包括将热硫化施加到橡胶弹性层的方法和在橡胶弹性层的内表面上形成热塑性树脂基层的工艺。 版权所有(C)2007,JPO&INPIT