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    • 5. 发明专利
    • Printing plate material and its manufacturing method
    • 印刷板材及其制造方法
    • JP2006248035A
    • 2006-09-21
    • JP2005067556
    • 2005-03-10
    • Mitsubishi Heavy Ind Ltd三菱重工業株式会社
    • MORITA SHOJISUDA YASUHARUTSURU YASUHIKO
    • B41N1/12
    • PROBLEM TO BE SOLVED: To provide a printing plate material which has a light-absorbing layer having sufficient strength as a component and excels in plate wear resistance, and a manufacturing method thereof.
      SOLUTION: The printing plate material is manufactured by a method having a process that a layer containing a light-absorbing material and silicon oxide is formed on a base and sintered at a firing temperature of 500-1,000°C, preferably 600-800°C, in the atmosphere of partial pressure of oxygen of 10
      -3 Torr or below, preferably 10
      -4 Torr or below, and thereby the light-absorbing layer absorbing at least part of incident light and converting it into heat is formed, and a process that a photocatalyst layer is formed on the light-absorbing layer.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供一种具有作为组分具有足够强度的光吸收层并且具有优异的耐板磨损性的印版材料及其制造方法。 解决方案:印版材料是通过一种方法制造的,该方法包括在基底上形成含有光吸收材料和氧化硅的层,并在烧制温度为500-1,000℃,优选600℃烧结, 800℃,在10分钟-3氧乇或更低的氧分压气氛中,优选10分钟-4乇或更低,由此吸光层吸收 形成入射光的至少一部分并将其转换为热,并且在光吸收层上形成光催化剂层的工艺。 版权所有(C)2006,JPO&NCIPI
    • 7. 发明专利
    • Method of manufacturing protective film, and protective film
    • 制造保护膜的方法和保护膜
    • JP2005232496A
    • 2005-09-02
    • JP2004040244
    • 2004-02-17
    • Mitsubishi Heavy Ind Ltd三菱重工業株式会社
    • MORITA SHOJIAKIYAMA KATSUNORIGOTO TAKAYUKI
    • C23C24/04
    • PROBLEM TO BE SOLVED: To provide a method of manufacturing a protective film by which the protective film having excellent wear resistance and corrosion resistance can be manufactured without heating a substrate to a high temperature, and to provide the protective film.
      SOLUTION: In this manufacturing method, a protective film is deposited on the substrate by an aerosol deposition method in which powder containing silicon compound (SiC or SiN) is sprayed to the substrate together with carrier gas such as helium at the spraying particle speed of ≥ 800 m/s from very small nozzles. According to the manufacturing method, the protective film having excellent adhesiveness to the substrate can be obtained without exposing the substrate to high temperature. The thickness of the protective film is preferably 0.5-40 μm. The Vickers hardness of the protective film is preferably ≥ 500.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种制造保护膜的方法,通过该方法可以在不将基板加热到高温的情况下制造具有优异的耐磨性和耐腐蚀性的保护膜,并提供保护膜。 解决方案:在该制造方法中,通过气溶胶沉积法将保护膜沉积在基板上,其中含有硅化合物(SiC或SiN)的粉末与载体如氦在喷涂颗粒上喷射到基板 从非常小的喷嘴的速度≥800米/秒。 根据该制造方法,可以在不将基板暴露于高温的情况下获得与基板的粘合性优异的保护膜。 保护膜的厚度优选为0.5〜40μm。 保护膜的维氏硬度优选≥500。版权所有(C)2005,JPO&NCIPI