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1. 发明专利

JP2015047685A マルチワイヤ加工装置及びマルチワイヤ加工方法有权
标题翻译：多线程处理设备和多线程处理方法
公开(公告)号：JP2015047685A
公开(公告)日：2015-03-16
申请号：JP2013183145
申请日：2013-09-04
申请人：三菱電機株式会社 , Mitsubishi Electric Corp
发明人： ITOKAZU ATSUSHI , HASHIMOTO TAKASHI , MIYAKE HIDETAKA
IPC分类号： B23H7/02 , B23H7/28
摘要：【課題】加工速度の低下を抑制したマルチワイヤ加工装置及びマルチワイヤ加工方法を得ること。【解決手段】第1〜第4のガイドローラ3a〜3dにワイヤ2を複数回巻回してワイヤ2を並列に配置した切断ワイヤ部2aを備え、ワイヤ2を軸方向に移動させつつ第1及び第2の被加工物8a,8bを切断ワイヤ部2aの側に送って第1及び第2の被加工物8a,8bを切断するマルチワイヤ加工装置であって、第1及び第2の被加工物8a,8bの各々と切断ワイヤ部2aとの距離を個別に制御する位置制御装置4と、第1及び第2の被加工物8a,8b間にパルス電圧を印加する加工電源6とを備え、位置制御装置4は、第2の被加工物8bを切断ワイヤ部2aに接触させて切削加工により切断するとともに、第1の被加工物8aと切断ワイヤ部2aとの間隔を一定に保って、第1の被加工物8aを放電加工により切断する。【選択図】図1
摘要翻译：要解决的问题：提供能够抑制处理速度降低的多线处理装置和多线处理方法。解决方案：多线处理装置具有通过绕第一至第四导辊多次缠绕线2而获得的切割线部分2a 3a-3d并且平行地布置线材2的部分，并且在沿着轴向移动线材2的同时将第一和第二工件8a，8b朝着切割线部分2a供给，以切割第一和第二工件8a，8b。多线处理装置还包括：位置控制器4，用于分别控制切割线部分2a与第一和第二工件8a，8b中的相应的距离; 以及用于在第一和第二工件8a，8b之间施加脉冲电压的处理电源6。位置控制器4使第二工件8b与切割线部分2a接触，通过切割加工切割第二工件，并且通过放电加工切割第一工件8a，第一工件8a与切割部之间的间隔线部分2a保持恒定。

2. 发明专利

JP2012166289A Method for cutting semiconductor wafer 审中-公开
标题翻译：切割半导体波长的方法
公开(公告)号：JP2012166289A
公开(公告)日：2012-09-06
申请号：JP2011028162
申请日：2011-02-14
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SUEHIRO YOSHIYUKI , SAWADA TAKAO , MIYAKE HIDETAKA
IPC分类号： B23H7/02
摘要： PROBLEM TO BE SOLVED: To provide a method for cutting a semiconductor wafer in which a burr is prevented from being generated at an edge of a cut surface.SOLUTION: When the semiconductor wafer 3 is cut by wire electric discharge machining, a discharge energy per unit area applied to the semiconductor wafer 3 from a wire 2 is gradually decreased while a discharge gap G is increased through a process of inserting the wire 2 into the semiconductor wafer 3, and discharge energy per unit area applied to the semiconductor wafer 3 from the wire 2 is gradually increased while the discharge gap G is gradually decreased through a process of removing the wire 2 from the semiconductor wafer 3. This allows an edge of a cut surface of the semiconductor wafer 3 to be shaped into a round shape.
摘要翻译：要解决的问题：提供一种切割半导体晶片的方法，其中防止在切割表面的边缘处产生毛刺。解决方案：当通过电线放电加工切割半导体晶片3时，从导线2施加到半导体晶片3的每单位面积的放电能量逐渐减小，而放电间隙G通过插入导线2进入半导体晶片3，并且通过从半导体晶片3去除线2的过程，放电间隙G逐渐减小，逐渐增加从线2施加到半导体晶片3的每单位面积的放电能量。允许半导体晶片3的切割面的边缘成形为圆形。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2005224943A Electric discharging device 有权
标题翻译：电动放电装置
公开(公告)号：JP2005224943A
公开(公告)日：2005-08-25
申请号：JP2005140469
申请日：2005-05-13
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SENDAI TOMOKO , IMAI YOSHIHITO , SATO TATSUSHI , MIYAKE HIDETAKA , MAGARA TAKUJI , GOTO AKIHIRO , MITANI YUKA
IPC分类号： B23H7/26
摘要： PROBLEM TO BE SOLVED: To supply an electric discharging device that carries out machining rapidly and precisely. SOLUTION: The electric discharging device that machines a 3D-shaped workpiece using a simple electrode splits the machining area of a workpiece into a predetermined machining depth in a machining direction for multilayer machining. The multilayer machining is carried out by an ideal machining speed storage means 40 that presets and stores the ideal machining speed corresponding to a machining condition, a machining speed detection means 36 that detects the actual machining speed being done per predetermined machining section, and an electrode path correction means 43 that compares the actual machining speed with the ideal machining speed and corrects the electrode path in the next layer according to the difference between both speeds. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供快速精确地进行加工的放电装置。解决方案：使用简单电极加工3D形工件的放电装置将工件的加工区域在多层加工的加工方向上分割成预定的加工深度。多层加工由预定和存储对应于加工条件的理想加工速度的理想加工速度存储装置40进行，加工速度检测装置36检测根据预定加工部分进行的实际加工速度，以及电极路径校正装置43，其将实际加工速度与理想加工速度进行比较，并且根据两个速度之间的差异校正下一层中的电极路径。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2015030659A 単結晶の製造方法审中-公开
标题翻译：单晶生产方法
公开(公告)号：JP2015030659A
公开(公告)日：2015-02-16
申请号：JP2013163989
申请日：2013-08-07
申请人：三菱電機株式会社 , Mitsubishi Electric Corp
发明人： SUZUKI HIROYOSHI , KOSHO TOMOAKI , NAKANISHI YOSUKE , MIYAKE HIDETAKA
IPC分类号： C30B29/36
摘要：【課題】本発明は、高品質な単結晶を再現性よく得ることができる単結晶の製造方法を提供することを目的とする。【解決手段】本発明に関する単結晶の製造方法は、(a)種結晶1の接着面において放電加工を行い、加工変質層3を形成する工程と、(b)接着剤5を用いて、接着面に形成された加工変質層3を台座としてのグラファイト台座6に貼り付ける工程と、(c)工程(b)の後、接着面の反対側の面である成長面において単結晶を成長させる工程とを備える。【選択図】図7
摘要翻译：要解决的问题：提供能够以优异的再现性制造高质量的单晶的单晶制造方法。解决方案：制造单晶的方法包括：（a）在粘合剂表面上进行放电的步骤的晶种1以形成受影响层3; （b）通过使用粘合剂5将形成在粘合剂表面上的受影响层3粘附到作为基座的石墨基座6上的步骤; 和（c）在步骤（b）之后，在生长表面或与粘合剂表面相对的一侧生长单晶的步骤。

5. 发明专利

JP2009184071A Wire electric discharge processing device and wire breakage detecting method 有权
标题翻译：电线放电加工设备和电线断路检测方法
公开(公告)号：JP2009184071A
公开(公告)日：2009-08-20
申请号：JP2008026678
申请日：2008-02-06
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： MIYAKE HIDETAKA , SATO TATSUSHI , NAKAGAWA TAKAYUKI , ONODERA YASUO , SENDAI TOMOKO , IWATA TAKAAKI
IPC分类号： B23H7/02 , B23H7/10
摘要： PROBLEM TO BE SOLVED: To rapidly detect breakage of an electrode wire; and to rapidly stop a wire electric discharge processing device.
SOLUTION: The wire electric discharge processing device includes the electrode wire 2 for generating electric discharge between a workpiece 8 and it, a processing power source 6 for applying a pulsating processing voltage between the electrode wire 2 and the workpiece 8, a breakage detecting power source 11 for applying a voltage for detecting breakage on both ends of the electrode wire 2, and a breakage detecting power source control means 12 for controlling timing of application by the breakage detecting power source 11, and detects breakage based on a conduction state of the electrode wire 2 when the voltage for detecting the breakage is applied. The voltage for detecting the breakage is applied only in a period when the voltage by the processing power source 6 is not applied. Thus, the breakage is detected, and the wire electric discharge processing device is rapidly stopped, and thereby, entanglement of the electric wire 2 with surroundings caused by the breakage can be prevented.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：快速检测电极丝的断裂; 并快速停止电线放电处理装置。线放电处理装置包括用于在工件8之间产生放电的电极线2，用于在电极线2和工件8之间施加脉动处理电压的处理电源6，断开检测用于在电极线2的两端施加用于检测断裂的电压的电源11，以及用于控制断线检测电源11的施加定时的断线检测电源控制装置12，并且基于导通状态检测断线当施加用于检测断裂的电压时。仅在不施加处理电源6的电压的期间施加用于检测断线的电压。因此，检测到破损，并且电线放电处理装置快速停止，从而可以防止电线2与破损引起的环境的缠结。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2009166190A Wire electric discharge machining apparatus 审中-公开
标题翻译：电线放电加工设备
公开(公告)号：JP2009166190A
公开(公告)日：2009-07-30
申请号：JP2008008044
申请日：2008-01-17
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SENDAI TOMOKO , SATO TATSUSHI , MIYAKE HIDETAKA , ONODERA YASUO , IWATA TAKAAKI , NAKAGAWA TAKAYUKI
IPC分类号： B23H7/02
摘要： PROBLEM TO BE SOLVED: To enable a worker to easily confirm an electric discharge state, and to judge whether there is a problem in machining, in a wire electric discharge machining apparatus realizing a simultaneous parallel discharging.
SOLUTION: In the wire electric discharge machining apparatus, a plurality of wire electrodes provided mutually separately in parallel are disposed in a material to be machined at prescribed intervals, to thereby generate electric discharge in parallel at a plurality of places by applying voltage between the material and the wire electrodes, so that machining of the material is performed by this electric discharge. The apparatus includes: a characteristic value calculating means 1 for detecting machining voltage values, being state values of a plurality of wire electrodes that perform electric discharge in parallel, and calculating an average voltage value, a maximum voltage value and a minimum voltage value, being characteristic values showing a machining state, based on the detected machining voltage values; and a display 2 for displaying these calculated characteristic values on an NC screen 3. When an area is selected by a worker, the machining state of a machined place included in this area is displayed.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了使工作人员能够容易地确认放电状态，并且在实现同时并联放电的线材放电加工装置中判断是否存在加工问题。解决方案：在线材放电加工装置中，以规定的间隔将彼此分开设置的多个线电极配置在要加工的材料中，从而通过施加电压在多个位置并联产生放电在材料和线电极之间，通过该放电进行材料的加工。该装置包括：特性值计算装置1，用于检测加工电压值，作为并行进行放电的多个线电极的状态值，并计算平均电压值，最大电压值和最小电压值，为基于检测到的加工电压值，显示加工状态的特征值; 以及用于在NC画面3上显示这些计算出的特征值的显示器2.当工作人员选择区域时，显示包括在该区域中的加工场所的加工状态。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2008091230A Device and method for surface treatment with electron beam 审中-公开
标题翻译：用电子束表面处理的装置和方法
公开(公告)号：JP2008091230A
公开(公告)日：2008-04-17
申请号：JP2006271482
申请日：2006-10-03
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： MIYAKE HIDETAKA , IMAI YOSHIHITO , YAMAMOTO YOSHIHIRO
IPC分类号： H01J37/30
摘要： PROBLEM TO BE SOLVED: To provide a device and method for surface treatment with electron beams capable of obtaining a superb treatment face by controlling treatment temperature of even an object for treatment of a three-dimensional shape.
SOLUTION: The device includes an electron beam generating means for generating electron beams, an electron beam focusing means for focusing electron beams, an electron beam deflecting means deflecting the focused electron beams and scanning it on the object for treatment, a control means connected to the electron beam generating means, the electron beam focusing means, and the electron beam deflecting means for controlling these means, a simulator connected with the control means, and a storage means storing information of the object for treatment. The simulator calculates a temperature distribution of the object for treatment under the surface treatment with the use of information of the object for treatment stored in the storage means, and the control means controls the electron beam generating means, the electron beam focusing means, and the electron beam deflecting means with the use of electron beam irradiation conditions selected based on the temperature distribution.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够通过控制即使是用于处理三维形状的物体的处理温度来获得优异处理面的电子束进行表面处理的装置和方法。解决方案：该装置包括用于产生电子束的电子束产生装置，用于聚焦电子束的电子束聚焦装置，使聚焦的电子束偏转并将其扫描在待处理物体上的电子束偏转装置，控制装置连接到电子束产生装置，电子束聚焦装置和用于控制这些装置的电子束偏转装置，与控制装置连接的模拟器以及存储对象进行处理的信息的存储装置。模拟器使用存储在存储装置中的处理对象的信息来计算表面处理对象的温度分布，并且控制装置控制电子束发生装置，电子束聚焦装置和使用基于温度分布选择的电子束照射条件的电子束偏转装置。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2006123108A Electric discharging device 审中-公开
标题翻译：电动放电装置
公开(公告)号：JP2006123108A
公开(公告)日：2006-05-18
申请号：JP2004316019
申请日：2004-10-29
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： IMAI YOSHIHITO , MIYAKE HIDETAKA , NAKAGAWA TAKAYUKI , SUZUKI SATOSHI
IPC分类号： B23H7/26
摘要： PROBLEM TO BE SOLVED: To provide an electric discharging device which is simple in structure, and improved in machining speed and accuracy of electric discharging by exciting an electrode at a desired frequency, a desired amplitude and in a desired pattern.
SOLUTION: The electric discharging device is comprised of an electrode mounting means for mounting therein a rod electrode or a pipe electrode, an electrode driving means for driving the electrode mounting means at least in a thrusting direction by magnetism on a non-contact basis, and a minute operation target value setting means for issuing a command to the electrode driving means and triggering repeated minute actions of the electrode during the electric discharging.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种结构简单的放电装置，并且通过以期望的频率，期望的振幅和期望的图案激发电极来提高加工速度和放电精度。解决方案：放电装置包括用于安装棒状电极或管状电极的电极安装装置，用于通过非接触式的磁性至少在推动方向上驱动电极安装装置的电极驱动装置基准和分钟操作目标值设定装置，用于向电极驱动装置发出命令并且在放电期间触发电极的重复微小动作。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2005125492A Electric discharge machine 有权
标题翻译：电动排料机
公开(公告)号：JP2005125492A
公开(公告)日：2005-05-19
申请号：JP2005035385
申请日：2005-02-14
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SENDAI TOMOKO , IMAI YOSHIHITO , SATO TATSUSHI , MIYAKE HIDETAKA , MAGARA TAKUJI , GOTO AKIHIRO , MITANI YUKA
IPC分类号： B23H1/04 , B23H7/26
摘要： PROBLEM TO BE SOLVED: To provide an electric discharge machine for providing a uniform machining surface by making a machining state always constant, in the electric discharge machine for manufacturing a metal mold and machining a part, by three-dimensionally controlling an electrode of a simple shape.
SOLUTION: This electric discharge machine machines a three-dimensional shape by using the electrode 6 of a rotating simple shape. The electric discharge machine predicts a discharge state of machining powder to an electrode passage of adding a correction of a consumption quantity of the electrode 6 to a machining passage; and controls the electrode 6 in rightward rotation when a machining margin exists on the left side in the machining advancing direction, and the electrode 6 in leftward rotation when the machining margin exists on the right side. The rotational direction of the electrode 5 is controlled in a switching system with every preset frequency in a place of being difficult to discharge the machining powder.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种通过使加工状态始终恒定来提供均匀的加工表面的放电加工机，在用于制造金属模具的放电加工机中加工零件，通过三维地控制电极一个简单的形状。解决方案：该放电机通过使用旋转简单形状的电极6来加工三维形状。放电机将加工粉末的放电状态预测为将电极6的消耗量校正添加到加工通道的电极通路; 并且当加工前进方向左侧存在加工余量时，电极6向右旋转，并且当加工余量存在于右侧时电极6向左旋转。电极5的旋转方向在切换系统中以每个预设频率被控制在难以排出机械粉末的位置。版权所有（C）2005，JPO＆NCIPI

10. 发明专利

JP2004107799A Electrical discharge surface treatment equipment, and electrical discharge surface treatment method using the same 有权
公开(公告)号：JP2004107799A
公开(公告)日：2004-04-08
申请号：JP2004002959
申请日：2004-01-08
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： IMAI YOSHIHITO , MIYAKE HIDETAKA , GOTO AKIHIRO
IPC分类号： C23C26/00
摘要： PROBLEM TO BE SOLVED: To obtain electrical discharge surface treatment equipment by which a high-hardness surface treated layer film can be formed and also its peeling can be suppressed and a surface treated layer satisfying requested specifications can be formed on a work to be treated.
SOLUTION: The equipment has an electric discharge treatment means, a requested specification storage part, an electrode feature storage part and an electric discharge treatment condition control part. The electrode is constituted in such a way that it is composed of powder of a relatively soft metal on the work side and is composed of powder containing a relatively hard metal on the other side. The treatment conditions of the electric discharge treatment means are controlled by the outputted results from the electrode feature storage part and the requested specifications (to provide the surface treated layer having a smooth hardness change to the work) of the requested specification storage part. The amount of Ni is increased in the contact part between the work 6 and the surface treated layer 7, and the amount of Ni is decreased with the approach to the top surface of the layer 7 and therewith the amount of TiC is increased. As a result, the hardness change can be made smoother than in the case of TiC alone. By this method, the high-hardness surface treated layer film can be formed, and also its peeling can be suppressed.
COPYRIGHT: (C)2004,JPO

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