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1. 发明专利

JP2014116404A Cooling apparatus 有权
标题翻译：冷却装置
公开(公告)号：JP2014116404A
公开(公告)日：2014-06-26
申请号：JP2012268346
申请日：2012-12-07
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TOCHIYAMA SHIGENOBU , HASHIMO SEIJI , TAMURA MASAYOSHI , ISHIBASHI SEIJI , IDENOUE SHINSUKE
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： H05K7/20281 , H01L23/3677 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To obtain a cooling apparatus capable of suppressing variation in cooling performance for heating elements even when the number of heating elements to be mounted is increased.SOLUTION: Upper and lower heat sinks 10 and 11 are mounted so as to close upper and lower openings of a main body part 2, and a partition plate 3 is disposed so as to vertically bisect the inside of the main body part. A cooling liquid supply header is provided in the center in the width direction between the upper heat sink 10 and the partition plate 3 and a cooling liquid discharge header is provided, in parallel with the cooling liquid supply header, in the center in the width direction between the lower heat sink 11 and the partition plate 3. At both sides in the width direction, a vertical flow passage 9 is provided in parallel with the cooling liquid supply header while vertically penetrating the partition plate 3. A cooling liquid distribution structure body 8 is disposed within the cooling liquid supply header, and formed in such an outer shape that a flow passage sectional area of the cooling liquid supply header becomes gradually small from an upstream side to a downstream side.
摘要翻译：要解决的问题：即使当要安装的加热元件的数量增加时，也可获得能够抑制加热元件的冷却性能的变化的冷却装置。解决方案：安装上下散热片10和11以使上部和主体部分2的下部开口，并且分隔板3设置成使主体部分的内部垂直平分。在上散热片10和分隔板3之间沿宽度方向的中心设置有冷却液供给头，并且与冷却液供给头并列设置在宽度方向中央的冷却液排出集管在下部散热器11和隔板3之间。在宽度方向的两侧，在垂直贯通隔板3的同时，与冷却液供给头并列设置有垂直流路9。设置在冷却液供给头部内，形成为使冷却液供给头的流路截面积从上游侧向下游侧逐渐变小的外形。

2. 发明专利

JP2012164697A Power module for electric power, and semiconductor device for electric power 审中-公开
标题翻译：电力用电源模块及电力半导体装置
公开(公告)号：JP2012164697A
公开(公告)日：2012-08-30
申请号：JP2011021679
申请日：2011-02-03
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： NAKAJIMA YASUSHI , BETSUSHIBA NORIYUKI , MAEKAWA HIROTOSHI , ISHIBASHI SEIJI
IPC分类号： H01L23/34 , H01L23/29 , H01L23/31 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49111 , H01L2224/83951 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To resolve a problem that, since a semiconductor element for electric power is broken if large thermal stress is generated in the semiconductor element for electric power in a process of performing resin encapsulation of a semiconductor module for electric power and a process of bonding the semiconductor module for electric power to a heat sink by solder, and electrical characteristics become abnormal, which causes incompatibility in shipment, thereby, it is required to reduce the thermal stress of the semiconductor element for electric power.SOLUTION: A power module for electric power has: a heat spreader having conductivity and heat radiation property; a semiconductor element for electric power fixed to the heat spreader; and an electrode terminal connected to the semiconductor element for electric power via the heat spreader. A lateral face region of the semiconductor element for electric power is covered with a protection resin. The heat sink cooling the power module for electric power is unified by a fixed layer.
摘要翻译：解决的问题：为了解决如下问题：由于在用于电力的半导体模块的树脂封装的过程中，在用于电力的半导体元件中产生大的热应力的情况下，电力用半导体元件被破坏以及通过焊料将电力用半导体模块接合到散热器的工序，电气特性变得异常，这在出货时不兼容，因此需要降低用于电力的半导体元件的热应力。解决方案：用于电力的功率模块具有：具有导电性和散热性的散热器; 用于固定到散热器的电力用半导体元件; 以及通过散热器连接到用于电力的半导体元件的电极端子。用于电力的半导体元件的侧面区域被保护树脂覆盖。冷却电力电源模块的散热片由固定层统一。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2009232656A Power module, on-vehicle power conversion device, and vehicle control unit 有权
标题翻译：电源模块，车载电源转换装置和车辆控制单元
公开(公告)号：JP2009232656A
公开(公告)日：2009-10-08
申请号：JP2008078417
申请日：2008-03-25
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： FUKU MASARU , KURAMOTO YUJI , ISHIBASHI SEIJI
IPC分类号： H02K11/00 , B60L3/00
CPC分类号： Y02T10/641
摘要： PROBLEM TO BE SOLVED: To provide a power module, an on-vehicle power conversion device, and a vehicle control unit, for improving the fuel consumption of a vehicle by using a semiconductor device effectively to the rated temperature. SOLUTION: The unit includes the power module containing the semiconductor device in the package, and the on-vehicle power conversion device controlling the switching operation of the semiconductor device. The unit includes a recording section to record an individual loss characteristics information usable for calculating the temperature of the semiconductor device, in at least either of any entities comprising the power module and the on-vehicle power conversion device. The on-vehicle power conversion device includes a function of computing the temperature of the semiconductor device, by using the individual loss characteristics information read from the recording section. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种功率模块，车载电力转换装置和车辆控制单元，用于通过使用半导体装置有效地达到额定温度来改善车辆的燃料消耗。解决方案：该单元包括包含封装中的半导体器件的电源模块和控制半导体器件的开关操作的车载电源转换装置。该单元包括记录部分，用于在包括电源模块和车载电源转换装置的任何实体中的至少任一个中记录可用于计算半导体装置的温度的各个损耗特性信息。车载电力转换装置包括通过使用从记录部读取的各个损失特性信息来计算半导体装置的温度的功能。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2009124082A Semiconductor device for power 有权
标题翻译：电力半导体器件
公开(公告)号：JP2009124082A
公开(公告)日：2009-06-04
申请号：JP2007299425
申请日：2007-11-19
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KOBAYASHI MASARU , ISHIBASHI SEIJI , MAEKAWA HIROTOSHI
IPC分类号： H01L23/48 , H01L23/29
CPC分类号： H01L23/49822 , H01L23/3735 , H01L2224/37 , H01L2224/371 , H01L2224/40 , H01L2224/40095 , H01L2224/40247 , H01L2224/48247 , H01L2224/73221 , H01L2224/83801 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device for power which can efficiently dissipate the heat generated in a semiconductor element for power, by a simple configuration. SOLUTION: As heat dissipation paths for the semiconductor element 2, two paths are provided: a path by which the heat generated in the semiconductor element 2 is transferred to a cooling surface 9b of a heat conduction layer 9 via a first metal body 3 to which the bottom face 2b side of the semiconductor element 2 is joined, and a path by which the heat is transferred to the cooling surface 9b of the heat conduction layer 9 via a heat conduction frame 12 to which the top face 2a side of the semiconductor element 2 is joined and a second metal body 4. The heat conduction frame 12 is a frame for exclusive use for heat dissipation and can provide a high heat transfer capability. Since the heat conduction layer 9 is electrically insulated from the semiconductor element 2, the cooling surface 9b is a single plane, and the first metal body 3 and the second metal body 4 give and receive heat with each other, the temperature distribution on the cooling surface 9b is hardly biased and thereby the semiconductor device 1 for power which has a high heat dissipation capability while being compact and low-cost can be obtained. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：通过简单的结构，提供能够有效地散发用于电力的半导体元件中产生的热的功率的半导体器件。解决方案：作为半导体元件2的散热路径，设置有两条路径：将半导体元件2中产生的热量经由第一金属体转移到导热层9的冷却面9b的路径 3，半导体元件2的底面2b侧接合，并且热量经由导热框架12传递到导热层9的冷却表面9b的路径，顶面2a侧半导体元件2与第二金属体4接合。导热框架12是用于散热专用的框架，并且可以提供高的传热能力。由于导热层9与半导体元件2电绝缘，所以冷却面9b为单面，第一金属体3和第二金属体4相互发热，冷却时的温度分布表面9b几乎不被偏压，因此可以获得具有高散热能力的功率的半导体器件1，而且紧凑且成本低廉。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2006191765A Power conversion device 有权
标题翻译：电源转换器件
公开(公告)号：JP2006191765A
公开(公告)日：2006-07-20
申请号：JP2005002369
申请日：2005-01-07
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YAMABUCHI HIROSHI , KURAMOTO YUJI , ISHIBASHI SEIJI , IWAKIRI TAISUKE
IPC分类号： B60L9/18 , H02M7/48 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To obtain a power conversion device that makes it possible to enhance the vibration resistance of a power supply board through simple construction in the vibration range in a use environment. SOLUTION: An inverter device includes: a case 1; power semiconductor modules 11 placed in the case 1 and having power semiconductor devices that convey and interrupt power; a control board 4 that is secured in the case 1 with fastening tools 5b for control board, and controls the gates of the power semiconductor devices; and the power supply board 2 that is secured in the case 1 with fastening tools 5a for power supply board, is mounted with a transformer 6, and supplies power to the control board 4. The spacing between adjoining fastening tools 5a for power supply board is smaller than the spacing between adjoining fastening tools 5b for control board. The resonance frequency of the power supply board 2 is shifted to a higher range than the resonance frequency of the control board 4. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：获得能够通过在使用环境中的振动范围内的简单结构来提高供电板的抗振性的电力转换装置。
解决方案：逆变器装置包括：壳体1; 功率半导体模块11放置在壳体1中并具有输送和中断功率的功率半导体器件; 控制板4，其用紧固工具5b固定在壳体1中，用于控制板，并控制功率半导体器件的栅极; 并且用电源板用紧固工具5a固定在壳体1中的电源板2安装有变压器6，并且向控制板4供电。供电板的相邻紧固工具5a之间的间隔是小于用于控制板的相邻紧固工具5b之间的间隔。电源板2的谐振频率偏移到比控制板4的谐振频率更高的范围。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005101414A Capacitor 审中-公开
标题翻译：电容器
公开(公告)号：JP2005101414A
公开(公告)日：2005-04-14
申请号：JP2003334937
申请日：2003-09-26
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KIMURA TORU , ISHIBASHI SEIJI , ISHII RYUICHI , KURAMOTO YUJI , KAMIGAI YASUMI
IPC分类号： H01G2/06 , H01G4/228 , H01G4/236
摘要： PROBLEM TO BE SOLVED: To provide a capacitor having a structure with soldering reliability improved without an increase in the space it occupies when mounted on an apparatus. SOLUTION: The capacitor comprises a capacitive element, leads provided at the two ends of the capacitive element, and a resin case which accommodates the capacitive element and parts of the leads and into which a filler is injected for fixing them. At least two bend sections are provided in the parts of the leads exposed out of the filler for the formation of parts which are virtually parallel with the surface of the filler. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供具有焊接可靠性提高的结构的电容器，而不会在安装在设备上时占用的空间增加。电容器包括电容元件，设置在电容元件的两端的引线以及容纳电容元件和引线部分的树脂壳体，并注入填充物以固定它们。在从填料中露出的引线部分中至少设置两个弯曲部分，用于形成实质上与填料表面平行的部件。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2012157161A Power conversion device 有权
标题翻译：电源转换器件
公开(公告)号：JP2012157161A
公开(公告)日：2012-08-16
申请号：JP2011013990
申请日：2011-01-26
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ISHIBASHI SEIJI , WATANABE TOSHIO , IDENOUE SHINSUKE
IPC分类号： H02M7/48
CPC分类号： H02M7/003 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To achieve excellent connection between control boards and low-inductance connection between a smoothing capacitor and semiconductor modules, in a power conversion device in which the semiconductor modules are disposed on both sides of a cooler for downsizing.SOLUTION: Semiconductor modules 2 are disposed on both sides of a cooler 1, and control boards 3 for controlling the semiconductor modules 2 are disposed so as to face each of the semiconductor modules 2. The semiconductor modules 2 and the cooler 1 are held by the control boards 3. A current detector 30 or a terminal block 4 is disposed at a location perpendicular to the surface on which the cooler 1 and the semiconductor modules 2 are contacted, and facing the cooler 1. The control boards 3 disposed on both the sides of the cooler 1 are electrically connected to each other by using wiring provided on the current detector 30 or the terminal block 4.
摘要翻译：要解决的问题：为了实现在控制板之间的良好连接和平滑电容器和半导体模块之间的低电感连接，在半导体模块设置在用于小型化的冷却器的两侧的电力转换装置中。解决方案：半导体模块2设置在冷却器1的两侧，并且用于控制半导体模块2的控制板3设置成面对每个半导体模块2.半导体模块2和冷却器1是电流检测器30或端子排4设置在与冷却器1和半导体模块2接触的表面垂直的位置处，并面对冷却器1.控制板3设置在冷却器1的两侧通过使用设置在电流检测器30或端子排4上的布线电连接。（C）2012，JPO＆INPIT

8. 发明专利

JP2012142521A Power semiconductor device 审中-公开
标题翻译：功率半导体器件
公开(公告)号：JP2012142521A
公开(公告)日：2012-07-26
申请号：JP2011001195
申请日：2011-01-06
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： BETSUSHIBA NORIYUKI , NAKAJIMA YASUSHI , MAEKAWA HIROTOSHI , ISHIBASHI SEIJI
IPC分类号： H01L23/40 , H01L23/29 , H01L25/07 , H01L25/18
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To solve such problems that there is a risk of the molten solder to flow out to the outside when a power module and a heat sink are soldered, and since outflow of solder causes deficiency in the essential amount of solder, heat dissipation performance degrades due to lack of the wetted area.SOLUTION: The power semiconductor device comprises a power module 10 where a power semiconductor element 1 is encapsulated with a mold resin 2, and a heat sink 11 bonded to the power module by soldering. On the power module mounting surface of the heat sink, a protrusion 14 consisting of a positioning part 12 and a solder outflow stop part 13 is provided. In a space surrounded by the protrusion, the power module and the heat sink, a molten solder volume expansion absorbing part 15 composed of a material having the surface not wetting the solder material and having a volume equal to or larger than the volume expanding when the solder melts is formed on the periphery of the solder.
摘要翻译：要解决的问题：为了解决当焊接电源模块和散热器时熔融焊料有可能流出到外部的问题，并且由于焊料的流出导致基本量的不足焊料，散热性能由于缺少润湿面积而降低。解决方案：功率半导体器件包括功率模块10，其中功率半导体元件1被模制树脂2封装，散热器11通过焊接结合到功率模块。在散热器的功率模块安装面上，设置有由定位部12和焊料流出停止部13构成的突起14。在由突起，功率模块和散热器围绕的空间中，熔融焊料体积膨胀吸收部15由具有不润湿焊料材料的表面的材料构成，并且具有等于或大于当在焊料的周围形成焊料熔融。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2011151981A Onboard power converter 有权
标题翻译： ONBOARD电源转换器
公开(公告)号：JP2011151981A
公开(公告)日：2011-08-04
申请号：JP2010011836
申请日：2010-01-22
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： MICHINAKA TAKUYA , ISHIBASHI SEIJI , KOBAYASHI MASARU , MATSUO HARUYUKI , KURAMOTO YUJI
IPC分类号： H02M7/48 , H02M1/00 , H02M7/5387
CPC分类号： H01L25/162 , H01L2924/0002 , H02M7/003 , H05K7/1432 , H05K7/20927 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an onboard power converter of small size with less weight. SOLUTION: The onboard power converter includes a plurality of semiconductor modules 1 in which a semiconductor element is sealed in resin, and which contain a module body 1a, an input terminal 4a, and an output terminal 4b, a box-like heatsink 2 which has cooling main surfaces on both facing surfaces respectively, to cool the semiconductor module 1, and a plurality of control boards 3 for controlling driving of the semiconductor module 1. In each semiconductor module 1, the main surface of the module body 1a contacts by surface to the cooling main surface of the heatsink 2, and each control board 3 faces a surface on a side opposite to the main surface of the module body 1a. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供体积小，重量轻的车载电源转换器。解决方案：车载功率转换器包括多个半导体模块1，其中半导体元件被密封在树脂中，并且包含模块体1a，输入端子4a和输出端子4b，盒状散热器 2，其分别在两个相对表面上具有冷却主表面，以冷却半导体模块1;以及多个控制板3，用于控制半导体模块1的驱动。在每个半导体模块1中，模块体1a的主表面接触并且每个控制板3面对与模块主体1a的主表面相对的一侧的表面。版权所有（C）2011，JPO＆INPIT

10. 发明专利

JP2009100514A Power conversion equipment 有权
标题翻译：电力转换设备
公开(公告)号：JP2009100514A
公开(公告)日：2009-05-07
申请号：JP2007268021
申请日：2007-10-15
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ISHIBASHI SEIJI , KOBAYASHI MASARU
IPC分类号： H02M7/48 , H02M1/00
摘要： PROBLEM TO BE SOLVED: To obtain power conversion equipment which can downsize itself, thanks to its small arrangement area, and also can effectively cool main circuit wiring. SOLUTION: Power modules 10a and 10b are fastened to the topside of a cooler 11 by screws thereby being cooled. Moreover, a main circuit wiring module 12, where the main circuit wiring for letting a current into or letting it out of the power modules 10a and 10b is sealed with resin, is fastened to a face which adjoins the face, where the power modules 10a and 10b are arranged, of the cooler 11 by screws. The cooler 11 is made rectangular, and it is fixed to the casing of the power conversion equipment, utilizing the face, where the power modules 10a and 10b or the main circuit wiring module 12 is not arranged, of the cooler 11. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了获得能够自身小型化的电力转换设备，由于其布置面积小，并且还可以有效地冷却主电路布线。解决方案：电源模块10a和10b通过螺钉紧固到冷却器11的顶部，从而被冷却。此外，主电路布线模块12，其中用于使电流进入电源模块10a和10b的电流线路用树脂密封的主电路布线被紧固到与面相邻的面上，其中功率模块10a 和10b通过螺钉布置在冷却器11中。冷却器11被制成矩形，利用冷却器11的未配置电源模块10a，10b或主电路配线模块12的面固定在电力转换装置的壳体上。版权所有（C）2009，JPO＆INPIT

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