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1. 发明专利

JP2002372763A Optical window for infrared camera, infrared camera using the same and production method for the optical window 审中-公开
标题翻译：用于红外摄像机的光学窗口，使用其的红外摄像机和用于光学窗口的生产方法
公开(公告)号：JP2002372763A
公开(公告)日：2002-12-26
申请号：JP2001293785
申请日：2001-09-26
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： MINAMI SHINTAROU , HAYASHI OSAMU , NAKANO YOSHITAKA , TAMAGAWA YUKIHISA , KAMOZAWA MAKOTO , KURATA TETSUYUKI
IPC分类号： G03B15/00 , G02B1/10 , G02B1/11 , G02B1/14 , G02B5/22 , G02B7/00 , G03B11/00 , G03B17/02 , G03B41/00
CPC分类号： G02B1/111 , G02B1/105 , G02B1/11 , G02B1/14
摘要： PROBLEM TO BE SOLVED: To provide an optical window for infrared camera equipped with an inexpensive protecting film having satisfactory transmittance and an infrared camera using this optical window. SOLUTION: In the optical window for infrared camera for transmitting infrared rays radiated from an object, this optical window is provided with an infrared transmitting substrate having a first principal face for making infrared rays incident, a second principal farce confronted to the first principal face for emitting infrared rays and a side face, a reflection preventing film covering the first and second principal faces of the infrared transmitting substrate, and the protecting film composed of polymer materials, which covers the reflection preventing film of the first principal face.
摘要翻译：要解决的问题：提供一种用于红外摄像机的光学窗口，其配备有具有令人满意透射率的廉价保护膜和使用该光学窗口的红外摄像机。解决方案：在用于发送从物体辐射的红外线的红外摄像机的光学窗口中，该光学窗口设置有具有用于使红外线入射的第一主面的红外线透射基板，与第一主面对置的第二主要大致面发射红外线和侧面的反射防止膜，覆盖红外线透射基板的第一和第二主面的反射防止膜和覆盖第一主面的防反射膜的由聚合物材料构成的保护膜。

2. 发明专利

JP2006187835A Power feeding mechanism and power feeding element of wire electric discharge device 审中-公开
标题翻译：电力放电装置的功率馈送机构和功率馈电元件
公开(公告)号：JP2006187835A
公开(公告)日：2006-07-20
申请号：JP2005001360
申请日：2005-01-06
申请人： Mitsubishi Electric Corp , Ryoden Koki Engineering Kk , 三菱電機株式会社 , 菱電工機エンジニアリング株式会社
发明人： ICHIMURA HIDEO , HAYASHI OSAMU , SUYAMA KEIICHIRO , KAJIMA SHUJI
IPC分类号： B23H7/10
摘要： PROBLEM TO BE SOLVED: To provide a power feeding mechanism of a wire electric discharge device, which facilitates exchange of power feeding elements that are consumable articles, at a low cost, without adversely affecting the power feeding performance thereof, and to provide the power feeding elements of the wire electric discharge device.
SOLUTION: The power feeding mechanism of the wire electric discharge device is arranged on upper and lower portions of a workpiece, guides a traveling wire electrode, and includes upper and lower power feeding sections each having the power feeding element housed therein, for making sliding contact with the wire electrode to feed power to the same. According to the power feeding mechanism, at least in one of the upper and lower power feeding sections, the power feeding element has a hollow cylindrical shape, and axial shapes thereof form power feeding surfaces on both inner and outer peripheral surfaces of the power feeding element, so as to make sliding contact with the wire electrode. Further each power feeding surface is positioned so as to generate predetermined pressing force to the wire electrode.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种有助于以低成本交换作为消耗品的供电元件而不会不利地影响其供电性能的电线放电装置的馈电机构，并且提供电线放电装置的馈电元件。解决方案：电线放电装置的馈电机构布置在工件的上部和下部，引导行进的电线电极，并且包括各自具有容纳在其中的供电元件的上部和下部供电部分，用于与线电极滑动接触以向其供电。根据供电机构，至少在上供电部和下供电部中的至少一个中，供电元件具有中空圆筒形，其轴向形状形成供电元件的内周面和外周面上的供电面，以便与线电极滑动接触。此外，每个供电表面被定位成对线电极产生预定的按压力。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2006187824A Wire electric discharge device and power feeding element of wire electric discharge device 审中-公开
标题翻译：电力放电装置的电力放电装置和功率馈送元件
公开(公告)号：JP2006187824A
公开(公告)日：2006-07-20
申请号：JP2005000672
申请日：2005-01-05
申请人： Mitsubishi Electric Corp , Ryoden Koki Engineering Kk , 三菱電機株式会社 , 菱電工機エンジニアリング株式会社
发明人： HAYASHI OSAMU , MORIYASU MASAHARU , ICHIMURA HIDEO , SUYAMA KEIICHIRO , KAJIMA SHUJI
IPC分类号： B23H7/10 , C22C27/04
摘要： PROBLEM TO BE SOLVED: To provide a wire electric discharge device which is equipped with a power feeding element that is small in wearing, undergoes only a small corrosion phenomenon at a binding phase of a cemented carbide, and exerts drastically improved workability, and to provide the power feeding element of the wire electric discharge device. SOLUTION: The wire electric discharge device is set up by arranging a wire electrode through a workpiece so as to continuously move with a gap therebetween, feeding a machining liquid into the gap, arranging the power feeding elements so as to make contact with the wire electrode, and feeding pulse voltage via the power feeding elements, whereby the workpiece is subjected to intermittent discharging across the gap. The power feeding element is formed of one sintered metal selected from the group consisting of W-Ti (tungsten-titanium), W-Ni-Fe-Mo (tungsten-nickel-iron-molybdenum), and W-Ti-Ni-Mo (tungsten-titanium-nickel-molybdenum). COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决问题的方案为了提供一种配备有磨损小的供电元件的电线放电装置，在硬质合金的结合阶段仅发生小的腐蚀现象，并且显着提高了可加工性，并提供电线放电装置的馈电元件。解决方案：电线放电装置通过将线电极布置在工件上而间隙连续移动而设置，将加工液供给到间隙中，将供电元件布置成与线电极，以及通过供电元件供给脉冲电压，由此工件在间隙上经受间歇放电。供电元件由选自W-Ti（钨 - 钛），W-Ni-Fe-Mo（钨 - 镍 - 铁 - 钼）和W-Ti-Ni-Mo组成的组中的一种烧结金属形成（钨 - 钛 - 镍 - 钼）。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2012024818A Multi-layer heat insulation material, and method for embossing thin titanium sheet material 有权
标题翻译：多层热绝缘材料及其制造方法
公开(公告)号：JP2012024818A
公开(公告)日：2012-02-09
申请号：JP2010166646
申请日：2010-07-26
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： HAYASHI OSAMU , OKA KOHEI , TANAKA YOSHIKAZU , MITSUI KOICHI , MATSUDA TOMONORI
IPC分类号： B21D33/00 , B21D22/02 , B21D22/10 , B64G1/58
摘要： PROBLEM TO BE SOLVED: To obtain a multi-layer insulation material (MLI) that can control heat in a stable manner under a high temperature condition of 500°C or more, and to obtain a processing method that is superior for mass production and can inexpensively perform heat-resistance processing of a thin titanium sheet material used for the multi-layer insulation material.SOLUTION: As a heat-resistant thin sheet material for forming multi layers, a titanium film 1 with a thickness of 10-30 μm which has protrusions 2 forming a plurality of concave and convex parts. Furthermore, after the thin titanium sheet material is annealed in a range of 700-740°C under a hydrogen gas atmosphere or an inert gas atmosphere, a plurality of concave and convex parts are formed by embosses so that the heat conduction as a result of composing a MLI by the lamination of the plurality of thin titanium sheet materials is reduced, thus improving the heat-resistance.
摘要翻译：要解决的问题：为了获得能够在500℃以上的高温条件下稳定地控制热量的多层绝缘材料（MLI），并且获得优于质量的加工方法并且可以廉价地进行用于多层绝缘材料的薄钛片材的耐热处理。解决方案：作为形成多层的耐热薄片材料，具有厚度为10-30μm的钛膜1，其具有形成多个凹凸部的突起2。此外，在薄钛板材料在氢气气氛或惰性气体气氛下在700-740℃的范围内退火之后，通过浮雕形成多个凹凸部分，使得由于通过层叠多个薄的钛片材构成MLI，从而提高耐热性。版权所有（C）2012，JPO＆INPIT

5. 发明专利

GB2287123B Semiconductor device and production method 未知
公开(公告)号：GB2287123B
公开(公告)日：1997-03-12
申请号：GB9503419
申请日：1995-02-21
申请人： MITSUBISHI ELECTRIC CORP
发明人： HAMAGUCHI TSUNEO , KAGATA KENJI , IZUTA GORO , ISHIZAKI MITSUNORI , HAYASHI OSAMU , HOSHINOUCHI SUSUMU
IPC分类号： H01L21/66 , G01R1/04 , G01R31/28 , H01L21/60 , H01L23/367 , H01L23/538 , H01L23/544 , H01L25/04 , H01L25/065 , H01L25/07 , H01L25/18 , H01L23/58 , H01L25/10
摘要： A high-speed, high-density, small-sized, low-cost semiconductor device wherein the feeder substrate 2 for supplying power to the semiconductor elements 3 as a bare chip has the containers 2a for containing the semiconductor elements 3, the semiconductor elements 3 are bonded to the wiring layer 1b of the signal transmission substrate 1 for transmitting signals to the semiconductor elements 3 and contained in the containers 2a, the containers 2a are covered with the signal transmission substrate 1, and the signal transmission substrate 1 is superposed upon and bonded to the feeder substrate 2.

6. 发明专利

GB2301938A Testing semiconductor elements 未知
公开(公告)号：GB2301938A
公开(公告)日：1996-12-18
申请号：GB9614327
申请日：1995-02-21
申请人： MITSUBISHI ELECTRIC CORP
发明人： HAMAGUCHI TSUNEO , KAGATA KENJI , IZUTA GORO , ISHIZAKI MITSUNORI , HAYASHI OSAMU , HOSHINOUCHI SUSUMU
IPC分类号： G01R1/04 , G01R31/28 , H01L21/60 , H01L23/544 , H01L25/065 , H01L21/66
摘要： Protruding electrodes 12 are formed on a test substrate 10 having test wires 10a. Electrical connection electrodes 3a of an unpackaged semiconductor element 3 are bonded to the protruding electrodes 12. After the element 3 has been tested in a heated atmosphere, the element 3 is removed from the test substrate 10, taking with it the electrodes 12, which are more strongly bonded to the electrodes 3a than to the test substrate 10.

7. 发明专利

CA2056218A1 METHOD OF PREPARING A PRINTED SUBSTRATE 未知
公开(公告)号：CA2056218A1
公开(公告)日：1992-05-28
申请号：CA2056218
申请日：1991-11-26
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJITA MINORU , KAWASAKI NAOSHIGE , SUNAMOTO MASATOSHI , MORITA TAKESHI , TAKAHAMA TAKASHI , HAYASHI OSAMU , UZAKI SYUNSUKE , SUDOU TOSHIHIDE
IPC分类号： C23C18/48 , H05K3/00 , H05K3/24 , H05K3/34 , C23C18/54 , C23C2/02
摘要： A method of preparing a printed substrate comprises forming a wiring pattern on a substrate and a coating a solder alloy including tin and lead as major components on the wiring pattern by means of electroless plating.

8. 发明专利

DE19549705B4 High-density packaging multi-chip semiconductor module - includes signal transmission substrate with wiring layer for transmitting signals and feeder substrate with containers for accommodating semiconductor bare chips which are bonded to wiring layer 未知
公开(公告)号：DE19549705B4
公开(公告)日：2008-07-10
申请号：DE19549705
申请日：1995-02-27
申请人： MITSUBISHI ELECTRIC CORP
发明人： HAMAGUCHI TSUNEO , KAGATA KENJI , IZUTA GORO , ISHIZAKI MITSUNORI , HAYASHI OSAMU , HOSHINOUCHI SUSUMU
IPC分类号： H01L25/065 , H01L23/50
摘要： The module has a feeder substrate (2) supplying power to the semiconductor elements (3) as a 'bare chip'.It also includes containers (2a) for accommodating the semiconductor elements which are bonded to the wiring layer (1b) of the signal transmission substrate (1) for transmitting signals to the semiconductor elements. The signal transmission substrate which covers the containers is also bonded to the feeder substrate. The wiring layer is a multi-layer formed by repeated formation of the insulator and conductive pattern on the base (1a) by thin film technology. The element electrode (1d), feeder electrodes (1e) and inter-substrate input/output electrodes (1f) are located on the front of the wiring layer.

9. 发明专利

CA2010030C METHOD FOR TRANSFERRING PATTERNS ON SILICONE LADDER TYPE RESIN AND ETCHING SOLUTION USED IN SUCH METHOD 未知
公开(公告)号：CA2010030C
公开(公告)日：1997-01-21
申请号：CA2010030
申请日：1990-02-14
申请人： MITSUBISHI ELECTRIC CORP
发明人： ADACHI HIROSHI , ADACHI ETSUSHI , AIBA YOSHIKO , HAYASHI OSAMU
IPC分类号： B05D3/06 , B05D7/24 , C09K13/06 , G03F7/075 , G03F7/26 , G03F7/40 , H01L21/308 , G03F7/038 , G03F7/32
摘要： A method for transferring patterns on a silicone ladder type resin, which comprises: applying onto a substrate a silicone ladder type resin to be represented by the following general formula (I) (I) (where: R1 denotes a phenyl group or a lower alkyl group, and two R1's may be the same or different kinds; R2 denotes hydrogen atom or a lower alkyl group, and four R2's may be the same or different kinds; and n represents an integer of from 5 to 1,000); drying the thus applied resin layer; thereafter applying onto the resin layer a cresol novolac type positive photo-resist; forming a predetermined pattern in the photo-resist layer; subjecting the photo-resist layer to pretreatment; and finally etching the silicone ladder type resin. An etching liquid for etching a silicone ladder type resin, which comprises an aromatic type solvent.

10. 发明专利

DE69202625D1 未知
公开(公告)号：DE69202625D1
公开(公告)日：1995-06-29
申请号：DE69202625
申请日：1992-06-17
申请人： MITSUBISHI ELECTRIC CORP
发明人： MORITA TAKESHI , HAYASHI OSAMU
IPC分类号： H05K1/18 , B29C33/14 , B29C45/14 , B29C70/68 , H05K3/00 , H05K3/28 , H05K7/14 , B29C70/00

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