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    • 6. 发明申请
    • System and method for 2D partial beamforming arrays with configurable sub-array elements
    • 具有可配置子阵列元素的2D局部波束成形阵列的系统和方法
    • US20050228277A1
    • 2005-10-13
    • US10818923
    • 2004-04-05
    • Stephen BarnesMirsaid BolorforoshRobert Phelps
    • Stephen BarnesMirsaid BolorforoshRobert Phelps
    • A61B8/00G01S15/89
    • G01S15/8925A61B8/4494G01S7/5208G01S15/8927G01S15/8993
    • Methods and systems for electronically scanning within a three dimensional volume while minimizing the number of system channels and associated cables connecting a two-dimensional array of elements to an ultrasound system are provided. Larger apertures can be utilized with existing 2D transducer electronics, whose purpose is to reduce the number of conductors in the transducer cable, by having the partially beam formed sub-arrays consist of a sub-array(s) of configurable elements. Exemplary 2D transducer electronics include electronics for the entire beam forming process, partial beam forming, e.g. delaying in time and summing of signals, walking aperture multiplexing, e.g. sequential sub-array actuation, sub-aperture mixing, e.g. delaying in phase and summing, time division multiplexing, e.g. sub-dividing and allocating available bandwidth as a function of time, and frequency division multiplexing, e.g. sub-dividing and allocating available bandwidth as a function of frequency.
    • 提供了在三维体积内电子扫描的方法和系统,同时最小化将二维阵列元素连接到超声系统的系统通道和相关电缆的数量最小化。 现有的2D传感器电子器件可以使用较大的孔径,其目的是通过使部分波束形成的子阵列由可配置元件的子阵列组成,来减少换能器电缆中的导体数量。 示例性2D传感器电子器件包括用于整个波束形成过程的电子器件,例如部分波束形成。 时间的延迟和信号的相加,步行孔径复用,例如。 顺序子阵列致动,子孔径混合,例如。 延迟相位和求和,时分复用,例如。 作为时间的函数分割和分配可用带宽,以及频分复用,例如, 将可用带宽划分和分配为频率的函数。
    • 7. 发明申请
    • Synthetic elevation aperture for ultrasound systems and methods
    • 超声系统和方法的合成仰角孔径
    • US20050215893A1
    • 2005-09-29
    • US10807681
    • 2004-03-24
    • Stephen BarnesMirsaid BolorforoshD-L Liu
    • Stephen BarnesMirsaid BolorforoshD-L Liu
    • A61B8/00A61B8/12A61B8/14G01S15/89
    • G01S15/8925A61B8/483G01S15/8927G01S15/894G01S15/8993G01S15/8997
    • Using configurable arrays, synthetic aperture processes may be used along an elevation dimension for increasing resolution. The increased resolution is used for two-dimensional or three-dimensional imaging. Alternatively or additionally, wide band synthetic elevation aperture focusing processes, such as beamformation, are provided along the elevation dimension to increase resolution. In yet another alternative or additional embodiment, a transducer is rotated about a center of the transducer within the elevation and azimuth plane. An aperture associated with the transducer is mechanically or electronically rotated, and ultrasound data acquired associated with a plurality of different positions. The ultrasound data is then used for synthetic elevation aperture processing. In yet another alternative or additional embodiment, multiple scanning modes are provided. In a survey mode, imaging is provided without synthetic elevation aperture processing. For greater detailed imaging, imaging is responsive to synthetic elevation aperture processes with different elevation focusing and scanning.
    • 使用可配置阵列,可以沿着高度维度使用合成孔径过程以提高分辨率。 增加的分辨率用于二维或三维成像。 或者或另外,沿着高度尺寸提供宽带合成高程孔径聚焦过程,例如波束形成,以增加分辨率。 在另一替代或附加实施例中,换能器围绕换能器的中心在高程和方位平面内旋转。 与换能器相关联的孔机械地或电子地旋转,并且获取与多个不同位置相关联的超声数据。 然后将超声数据用于合成高程孔径处理。 在又一替代或附加实施例中,提供了多种扫描模式。 在调查模式中,无需合成高程孔径处理即可提供成像。 为了更详细的成像,成像对具有不同高程聚焦和扫描的合成高程孔径过程有反应。
    • 8. 发明申请
    • Synthetic elevation aperture for ultrasound systems and methods
    • 超声系统和方法的合成仰角孔径
    • US20070161899A1
    • 2007-07-12
    • US11716371
    • 2007-03-09
    • Stephen BarnesMirsaid BolorforoshD-L Liu
    • Stephen BarnesMirsaid BolorforoshD-L Liu
    • A61B8/00
    • G01S15/8925A61B8/483G01S15/8927G01S15/894G01S15/8993G01S15/8997
    • Using configurable arrays, synthetic aperture processes may be used along an elevation dimension for increasing resolution. The increased resolution is used for two-dimensional or three-dimensional imaging. Alternatively or additionally, wide band synthetic elevation aperture focusing processes, such as beamformation, are provided along the elevation dimension to increase resolution. In yet another alternative or additional embodiment, a transducer is rotated about a center of the transducer within the elevation and azimuth plane. An aperture associated with the transducer is mechanically or electronically rotated, and ultrasound data acquired associated with a plurality of different positions. The ultrasound data is then used for synthetic elevation aperture processing. In yet another alternative or additional embodiment, multiple scanning modes are provided. In a survey mode, imaging is provided without synthetic elevation aperture processing. For greater detailed imaging, imaging is responsive to synthetic elevation aperture processes with different elevation focusing and scanning.
    • 使用可配置阵列,可以沿着高度维度使用合成孔径过程以提高分辨率。 增加的分辨率用于二维或三维成像。 或者或另外,沿着高度尺寸提供宽带合成高程孔径聚焦过程,例如波束形成,以增加分辨率。 在另一替代或另外的实施例中,换能器绕升降和方位平面内的换能器的中心旋转。 与换能器相关联的孔机械地或电子地旋转,并且获取与多个不同位置相关联的超声数据。 然后将超声数据用于合成高程孔径处理。 在又一替代或附加实施例中,提供了多种扫描模式。 在调查模式中,无需合成高程孔径处理即可提供成像。 为了更详细的成像,成像对具有不同高程聚焦和扫描的合成高程孔径过程有反应。
    • 9. 发明申请
    • Electrical interconnections and methods for membrane ultrasound transducers
    • 用于膜超声换能器的电气互连和方法
    • US20050203409A1
    • 2005-09-15
    • US10799973
    • 2004-03-12
    • Gregg FreyGrazyna PalczewskaStephen BarnesMirsaid Bolorforosh
    • Gregg FreyGrazyna PalczewskaStephen BarnesMirsaid Bolorforosh
    • A61B8/14B06B1/02
    • B06B1/0292
    • Electrical interconnects are provided for CMUTs. For example, electrodes within the silicon substrate, such as the electrodes at the bottom of the void below membranes, are interconnected together within the substrate. The interconnected electrode may then be used as the grounding electrode. By providing interconnection within the substrate and below the membranes, space for vias and the associated connection between the electrodes on an exposed surface of the substrate is minimized. As another example, an electrical conductor is formed on the side of the silicon substrate rather than the top of the substrate. Conductors on the side may allow routing signals from a top surface to a bottom surface without large wire bonding pads. Alternatively, conductors on the edge provide additional space for wire bonding pads. As yet another example, polymer material used as a matching or protection layer is formed on the top surface of the CMUT with electrical traces routed within the polymer. By using multiple layers of polymer, multiple layers of electrical conductors may be routed without interference.
    • 为CMUT提供电气互连。 例如,硅衬底内的电极,例如在膜下面的空隙底部的电极在衬底内互连在一起。 然后可以将互连的电极用作接地电极。 通过在衬底内和薄膜之下提供互连,通孔的空隙和衬底的暴露表面上的电极之间的相关连接最小化。 作为另一示例,电导体形成在硅衬底的侧面而不是衬底的顶部上。 侧面的导体可以允许从顶表面到底面的路由信号,而不需要大的引线接合焊盘。 或者,边缘上的导体为引线焊盘提供额外的空间。 作为另一个实例,用作匹配或保护层的聚合物材料形成在CMUT的顶表面上,其电导迹线在聚合物内布置。 通过使用多层聚合物,多层电导体可以无干扰地布线。