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1. 发明授权

US11518673B2 MEMS device and method for manufacturing the same 有权
公开(公告)号：US11518673B2
公开(公告)日：2022-12-06
申请号：US16711139
申请日：2019-12-11
申请人： MIRAMEMS SENSING TECHNOLOGY CO., LTD
发明人： Yu-Hao Chien , Li-Tien Tseng , Chih-Liang Kuo
IPC分类号： B81C1/00 , B81B7/02
摘要： A method for manufacturing a MEMS device includes disposing at least one bonding portion having a smaller bonding area in a region where an airtight chamber will be formed, and disposing a metal getter on a bonding surface of the bonding portion. According to this structure, when substrates are bonded to define the airtight chamber, the metal getter is squeezed out of the bonding position due to the larger bonding pressure of the bonding portion with a smaller bonding area. Then, the metal getter is activated to absorb the moisture in the airtight chamber. According to the above process, no additional procedure is needed to remove the moisture in the airtight chamber. A MEMS device manufactured by the above manufacturing method is also disclosed.

2. 发明授权

US09598275B2 Pressure sensor and manufacture method thereof 有权
公开(公告)号：US09598275B2
公开(公告)日：2017-03-21
申请号：US14596967
申请日：2015-01-14
申请人： MiraMEMS Sensing Technology Co., Ltd.
发明人： Yu-Hao Chien , Li-Tien Tseng
IPC分类号： B81B7/02 , B81C1/00 , H01L23/10 , B81B7/00
CPC分类号： B81B7/0041 , B81B7/02 , B81B2201/0264 , B81B2203/0315 , B81B2203/033 , B81B2207/012 , B81B2207/07 , B81B2207/094 , B81C1/00238 , B81C1/00293 , B81C2201/112 , B81C2203/0172 , B81C2203/0792 , H01L23/10 , H01L2924/1461
摘要： A pressure sensor using the MEMS device comprises an airtight ring surrounding a chamber defined by the first substrate and the second substrate. The airtight ring extends from the upper surface of the second substrate to the surface between the first substrate and the second substrate and further breaks out the surface. The pressure sensor utilizes the airtight ring to retain the airtightness of the chamber. The manufacture method of the pressure sensor is also disclosed.

3. 发明授权

US10538428B2 MEMS device and method for manufacturing the same 有权
公开(公告)号：US10538428B2
公开(公告)日：2020-01-21
申请号：US15981202
申请日：2018-05-16
申请人： MiraMEMS Sensing Technology Co., Ltd
发明人： Yu-Hao Chien , Li-Tien Tseng , Chih-Liang Kuo
IPC分类号： B81B7/02 , B81C1/00
摘要： A method for manufacturing a MEMS device includes disposing at least one bonding portion having a smaller bonding area in a region where an airtight chamber will be formed, and disposing a metal getter on a bonding surface of the bonding portion. According to this structure, when substrates are bonded to define the airtight chamber, the metal getter is squeezed out of the bonding position due to the larger bonding pressure of the bonding portion with a smaller bonding area. Then, the metal getter is activated to absorb the moisture in the airtight chamber. According to the above process, no additional procedure is needed to remove the moisture in the airtight chamber. A MEMS device manufactured by the above manufacturing method is also disclosed.

4. 发明授权

US10486962B2 Force sensor and manufacture method thereof 有权
公开(公告)号：US10486962B2
公开(公告)日：2019-11-26
申请号：US15993058
申请日：2018-05-30
申请人： MiraMEMS Sensing Technology Co., Ltd
发明人： Li-Tien Tseng , Yu-Hao Chien , Chih-Liang Kuo , Yu-Te Yeh
IPC分类号： H01L29/84 , B81B7/00 , B81C1/00 , G01L1/14
CPC分类号： B81B7/0051 , B81C1/0023 , G01L1/148 , B81B2201/0264 , B81B2203/04 , B81B2207/012 , B81C2203/0785
摘要： A force sensor comprises a first substrate, a second substrate, a third substrate, and a package body. The first substrate includes a fixed electrode, at least one first conductive contact, and at least one second conductive contact. The second substrate is disposed on the first substrate and electrically connected to the first conductive contact of the first substrate. The second substrate includes a micro-electro-mechanical system (MEMS) element corresponding to the fixed electrode. The third substrate is disposed on the second substrate and includes a pillar connected to the MEMS element. The package body covers the third substrate. The foregoing force sensor has better reliability.

5. 发明授权

US09809447B2 Pressure sensor 有权
公开(公告)号：US09809447B2
公开(公告)日：2017-11-07
申请号：US15414074
申请日：2017-01-24
申请人： MiraMEMS Sensing Technology Co., Ltd.
发明人： Yu-Hao Chien , Li-Tien Tseng
IPC分类号： B81C1/00 , B81B7/02 , B81B7/00
CPC分类号： B81B7/0041 , B81B7/02 , B81B2201/0264 , B81B2203/0315 , B81B2203/033 , B81B2207/012 , B81B2207/07 , B81B2207/094 , B81C1/00238 , B81C1/00293 , B81C2201/112 , B81C2203/0172 , B81C2203/0792 , H01L23/10 , H01L2924/1461
摘要： A pressure sensor using the MEMS device comprises an airtight ring surrounding a chamber defined by the first substrate and the second substrate. The airtight ring extends from the upper surface of the second substrate to the interface between the first substrate and the second substrate and further breaks out the interface. The pressure sensor utilizes the airtight ring to retain the airtightness of the chamber.

6. 发明授权

US09227832B1 Pressure sensor and manufacture method thereof 有权
标题翻译：压力传感器及其制造方法
公开(公告)号：US09227832B1
公开(公告)日：2016-01-05
申请号：US14596985
申请日：2015-01-14
申请人： MiraMEMS Sensing Technology Co., Ltd.
发明人： Yu-Hao Chien , Li-Tien Tseng
IPC分类号： H01L21/54 , B81B3/00 , B81B7/00 , B81C1/00
CPC分类号： B81B3/0005 , B81B2201/0264
摘要： A pressure sensor using the MEMS element and the manufacture method thereof utilize the semiconductor processes to form the micro channel connecting to the chamber, open the micro channel, coat the anti-sticking layer on the inner surface of the chamber, and then seal the micro channel to keep the chamber airtight. Therefore, the manufacture method may essentially simplify the process to coat the anti-sticking layer on the inner surface of the airtight chamber to prevent the sticking and failing of the movable MEMS element.
摘要翻译：使用MEMS元件的压力传感器及其制造方法利用半导体工艺形成连接到腔室的微通道，打开微通道，涂覆腔室内表面上的防粘层，然后密封微孔通道保持室内气密。因此，制造方法可以基本上简化在气密室的内表面上涂覆防粘层的过程，以防止可移动MEMS元件的粘附和失效。

7. 发明授权

US11312624B2 MEMS device and manufacturing method thereof 有权
公开(公告)号：US11312624B2
公开(公告)日：2022-04-26
申请号：US16714440
申请日：2019-12-13
申请人： MIRAMEMS SENSING TECHNOLOGY CO., LTD
发明人： Li-Tien Tseng , Yu-Hao Chien
IPC分类号： B81C1/00
摘要： A manufacturing method of microelectromechanical system (MEMS) device includes providing a first, a second and a third substrates, wherein the first substrate includes a first and a second circuit, the second substrate includes second and third connection areas, and the third substrate includes first connection areas. Second grooves and a dividing groove are formed on the fourth surface of the third substrate. The second and third substrates are bonded to make the first and the second connection areas correspondingly connect with each other. The second substrate is divided to form electrically isolating first and second movable elements. The first movable element is spatial separated from the third substrate and corresponding to the second groove. The second movable element is connected to the third substrate. The first and the second substrates are bonded to make the fourth and the third connection areas connect correspondingly. The third substrate is thinned, divided into a first and a second cap from the dividing groove, and formed a first groove from the fifth surface. The first cap is corresponding to the first movable element and the first circuit. Air tight space to sense a pressure variation of exterior environment is formed between the first substrate and the second cap. The second movable element is movable with the second cap by the pressure variation of the exterior environment. Accordingly, the pressure sensor and the MEMS structure for sensing other physical quantity can be integrated in the foregoing MEMS device by a single process.

8. 发明授权

US11137296B2 Force sensor with MEMS-based device and force touching member 有权
公开(公告)号：US11137296B2
公开(公告)日：2021-10-05
申请号：US16426463
申请日：2019-05-30
申请人： MIRAMEMS SENSING TECHNOLOGY CO., LTD
发明人： Li-Tien Tseng , Yu-Hao Chien , Chih-Liang Kuo , Yu-Te Yeh
IPC分类号： G01L1/14 , B81B3/00
摘要： A force sensor includes a package substrate, a MEMS-based device, a package body and a force touching member. The MEMS-based device is disposed on the package substrate and electrically connected with the package substrate. The package body encapsulates the MEMS-based device. The force touching member including a rod is disposed on the package body and corresponding to the MEMS-based device. The force sensor allows a greater assembly tolerance.

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