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1. 发明授权

US07801101B2 Apparatus and method for compensating forward link rain attenuation based on adaptive transmission scheme for interactive satellite transmission system 失效
标题翻译：基于交互式卫星传输系统的自适应传输方案补偿前向链路衰减的装置和方法
公开(公告)号：US07801101B2
公开(公告)日：2010-09-21
申请号：US10892679
申请日：2004-07-15
申请人： Minsu Shin , Joon-Gyu Ryu , Hoon Jeong , Ho-Jin Lee
发明人： Minsu Shin , Joon-Gyu Ryu , Hoon Jeong , Ho-Jin Lee
IPC分类号： H04B7/216
CPC分类号： H04B7/18513 , H04L1/0003 , H04L1/0009 , H04W4/18 , H04W84/06
摘要： Provided are a forward link rain attenuation compensating apparatus using an adaptive transmission scheme in an interactive satellite communication system and a method thereof. The apparatus separates the mobile stations into clear-sky mobile stations and mobile stations in the state of rain attenuation and makes the clear-sky mobile stations receive data having a high data transmission efficiency at a high-speed while making the rain attenuation mobile stations receive the data continuously although the data transmit rate is low by making each of the two kinds of mobile stations receive data frames of a different transmission method, and provides a method therefor. The apparatus includes: a resource manager, a transmitting data format converter, a forward modulator, a backward demodulator, a receiving data format converter.
摘要翻译：提供一种在交互式卫星通信系统中使用自适应传输方案的前向链路雨衰补偿装置及其方法。该装置将移动台分为处于雨衰状态的空中移动台和移动台，使得天空清空的移动台高速接收高数据传输效率的数据，同时使雨衰移移动站接收通过使两种移动站中的每一个接收到不同的传输方式的数据帧，数据传输速率是低的，并且提供了一种方法。该装置包括：资源管理器，发送数据格式转换器，前向调制器，反向解调器，接收数据格式转换器。

2. 发明申请

US20050141472A1 Apparatus and method for compensating forward link rain attenuation based on adaptive transmission scheme for interactive satellite transmission system 失效
标题翻译：基于交互式卫星传输系统的自适应传输方案补偿前向链路衰减的装置和方法
公开(公告)号：US20050141472A1
公开(公告)日：2005-06-30
申请号：US10892679
申请日：2004-07-15
申请人： Minsu Shin , Joon-Gyn Ryu , Hoon Jeong , Ho-Jin Lee
发明人： Minsu Shin , Joon-Gyn Ryu , Hoon Jeong , Ho-Jin Lee
IPC分类号： H04B7/185 , H04L1/00 , H04L12/56 , H04Q7/00
CPC分类号： H04B7/18513 , H04L1/0003 , H04L1/0009 , H04W4/18 , H04W84/06
摘要： Provided are a forward link rain attenuation compensating apparatus using an adaptive transmission scheme in an interactive satellite communication system and a method thereof. The apparatus separates the mobile stations into clear-sky mobile stations and mobile stations in the state of rain attenuation and makes the clear-sky mobile stations receive data having a high data transmission efficiency at a high-speed while making the rain attenuation mobile stations receive the data continuously although the data transmit rate is low by making each of the two kinds of mobile stations receive data frames of a different transmission method, and provides a method therefor. The apparatus includes: a resource manager, a transmitting data format converter, a forward modulator, a backward demodulator, a receiving data format converter.
摘要翻译：提供一种在交互式卫星通信系统中使用自适应传输方案的前向链路雨衰补偿装置及其方法。该装置将移动台分为处于雨衰状态的空中移动台和移动台，使得天空清晰的移动台高速接收高数据传输效率的数据，同时使雨衰移移动站接收通过使两种移动站中的每一个接收到不同传输方式的数据帧，数据传输速率低，并且提供了一种方法。该装置包括：资源管理器，发送数据格式转换器，前向调制器，反向解调器，接收数据格式转换器。

3. 发明申请

US20100158091A1 FREQUENCY ERROR ESTIMATOR AND FREQUENCY ERROR ESTIMATING METHOD THEREOF 审中-公开
标题翻译：频率误差估计器及其频率误差估计方法
公开(公告)号：US20100158091A1
公开(公告)日：2010-06-24
申请号：US12496917
申请日：2009-07-02
申请人： Pan-Soo Kim , Joon-Gyu Ryu , Dae-Ig Chang , Ho-Jin Lee , Myung-Hoon Sunwoo , Jang-Woong Park
发明人： Pan-Soo Kim , Joon-Gyu Ryu , Dae-Ig Chang , Ho-Jin Lee , Myung-Hoon Sunwoo , Jang-Woong Park
IPC分类号： H04B17/00 , H04L27/06
CPC分类号： H04L27/22 , H04L27/0014 , H04L2027/0067
摘要： Provided is a frequency error estimating method of a communication system. The method includes receiving a frame, and calculating a frequency error from a SOF field of the received frame.
摘要翻译：提供了一种通信系统的频率误差估计方法。该方法包括接收帧，并从接收到的帧的SOF字段计算频率误差。

4. 发明申请

US20060114934A1 Network operation method in interactive satellite communications system 审中-公开
标题翻译：互动卫星通信系统中的网络运行方式
公开(公告)号：US20060114934A1
公开(公告)日：2006-06-01
申请号：US11193763
申请日：2005-07-28
申请人： Minsu Shin , Deock-Gil Oh , Ho-Jin Lee
发明人： Minsu Shin , Deock-Gil Oh , Ho-Jin Lee
IPC分类号： H04J3/22 , H04J3/16 , H04Q7/24 , H04B7/185
CPC分类号： H04B7/18584
摘要： A network operation method in an interactive satellite communications system interworking with an external network without modifying a network setting is provided. The network operation method in a base station of the interactive satellite communications system includes the steps of: receiving a data request packet from a user; converting a private internet protocol (IP) address of the user into a public IP address; transmitting the data request packet to an external server; receiving a response packet to the data request packet from the external server and converting the converted public IP address into the private IP address; and transmitting the received response packet to the user by using information on a mapping table.
摘要翻译：提供了在不修改网络设置的情况下与外部网络相互配合的交互式卫星通信系统中的网络操作方法。交互式卫星通信系统的基站中的网络操作方法包括以下步骤：从用户接收数据请求分组; 将用户的私人网际协议（IP）地址转换为公共IP地址; 将数据请求包发送到外部服务器; 从所述外部服务器接收到所述数据请求分组的响应分组，并将所转换的公共IP地址转换成所述专用IP地址; 以及通过使用关于映射表的信息将接收到的响应分组发送给用户。

5. 发明授权

US09941196B2 Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device 有权
公开(公告)号：US09941196B2
公开(公告)日：2018-04-10
申请号：US15130904
申请日：2016-04-15
申请人： Ho-Jin Lee , Tae-Je Cho , Dong-Hyeon Jang , Ho-Geon Song , Se-Young Jeong , Un-Byoung Kang , Min-Seung Yoon
发明人： Ho-Jin Lee , Tae-Je Cho , Dong-Hyeon Jang , Ho-Geon Song , Se-Young Jeong , Un-Byoung Kang , Min-Seung Yoon
IPC分类号： H01L21/768 , H01L23/498 , H01L23/48 , H01L25/065 , H01L23/525
CPC分类号： H01L23/49844 , H01L21/76831 , H01L21/76844 , H01L21/76898 , H01L23/481 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/525 , H01L25/0657 , H01L2224/02372 , H01L2224/05009 , H01L2224/13025 , H01L2224/16 , H01L2224/16145 , H01L2224/16227 , H01L2224/17181 , H01L2225/06513 , H01L2225/06544 , H01L2924/15311
摘要： In one embodiment, a semiconductor device includes a semiconductor substrate having a first surface, and a second surface opposite to the first surface. The second surface defines a redistribution trench. The substrate has a via hole extending therethrough. The semiconductor device also includes a through via disposed in the via hole. The through via may include a via hole insulating layer, a barrier layer, sequentially formed on an inner wall of the via hole. The through via may further include a conductive connector adjacent the barrier layer. The semiconductor device additionally includes an insulation layer pattern formed on the second surface of the substrate. The insulation layer pattern defines an opening that exposes a region of a top surface of the through via. The semiconductor devices includes a redistribution layer disposed in the trench and electrically connected to the through via. The insulation layer pattern overlaps a region of the conductive connector.

6. 发明授权

US09852965B2 Semiconductor devices with through electrodes and methods of fabricating the same 有权
公开(公告)号：US09852965B2
公开(公告)日：2017-12-26
申请号：US15204632
申请日：2016-07-07
申请人： Ho-Jin Lee , Byung Lyul Park , Kwangjin Moon , Jisoon Park , Jin Ho An
发明人： Ho-Jin Lee , Byung Lyul Park , Kwangjin Moon , Jisoon Park , Jin Ho An
IPC分类号： H01L23/48 , H01L21/768
CPC分类号： H01L23/481 , H01L21/76898 , H01L2224/11 , H01L2224/16145 , H01L2924/181 , H01L2924/00012
摘要： Provided herein are semiconductor devices with through electrodes and methods of fabricating the same. The methods may include providing a semiconductor substrate having top and bottom surfaces facing each other, forming on the top surface of the semiconductor substrate a main via having a hollow cylindrical structure and a metal line connected to the main via, forming an interlayered insulating layer on the top surface of the semiconductor substrate to cover the main via and the metal line, removing a portion of the semiconductor substrate to form a via hole exposing a portion of a bottom surface of the main via, and forming in the via hole a through electrode that is electrically connected to the main via. The bottom surface of the main via is overlapped by a circumference of the via hole, when viewed in a plan view.

7. 发明授权

US08422600B2 Apparatus and method for estimating phase error based on variable step size 有权
标题翻译：基于可变步长估计相位误差的装置和方法
公开(公告)号：US08422600B2
公开(公告)日：2013-04-16
申请号：US12536856
申请日：2009-08-06
申请人： Pansoo Kim , Dae-Ig Chang , Ho-Jin Lee , Jin-Young Kim , Jae-Sung Park , Young-Sun Lim
发明人： Pansoo Kim , Dae-Ig Chang , Ho-Jin Lee , Jin-Young Kim , Jae-Sung Park , Young-Sun Lim
IPC分类号： H04L27/06 , H03M13/03
CPC分类号： H04L27/22 , H04L1/0047 , H04L1/005 , H04L1/0066 , H04L2027/0067
摘要： Disclosed is a phase error estimating an apparatus and a method which provides improved convergence speed and tracking speed even in mobile channel environment by variably applying the step size for phase error estimation according to channel status. The apparatus for estimating a phase error includes: a posterior probability (APP) average calculating unit for calculating an APP average value from a soft decision result of a currently received symbol; a step size determining unit for determining a step size variably according to channel status; and a phase error estimating unit for estimating a phase error of the currently received symbol from a phase error of a previously received symbol and the APP average value by using the variably determined step size.
摘要翻译：公开了一种相位误差估计装置和方法，即使在移动信道环境中也可以通过根据信道状态可变地应用步长来进行相位误差估计，从而提高收敛速度和跟踪速度。用于估计相位误差的装置包括：后验概率（APP）平均计算单元，用于根据当前接收的符号的软判决结果计算APP平均值; 步长确定单元，用于根据信道状态可变地确定步长; 以及相位误差估计单元，用于通过使用可变确定的步长来估计来自先前接收到的符号的相位误差的当前接收到的符号的相位误差和APP平均值。

8. 发明授权

US08422232B2 System for controlling temperature of antenna module 有权
标题翻译：天线模块温度控制系统
公开(公告)号：US08422232B2
公开(公告)日：2013-04-16
申请号：US13002888
申请日：2009-07-21
申请人： Changsoo Kwak , In-Bok Yom , So-Hyeun Yun , Donghwan Shin , Ho-Jin Lee
发明人： Changsoo Kwak , In-Bok Yom , So-Hyeun Yun , Donghwan Shin , Ho-Jin Lee
IPC分类号： H05K7/20
CPC分类号： H01Q1/02 , H01Q1/42
摘要： A system for controlling temperature of an antenna module including a heat generating module, and a radome and an underbody cover that enclose the heat generating module. The system includes: a heat collecting unit mounted on inner surface of the antenna module; a heat discharging unit mounted on outer surface of the antenna module; and a heat transfer unit for transferring heat from the heat collecting unit to the heat discharging unit.
摘要翻译：一种用于控制包括发热模块的天线模块的温度的系统，以及包围发热模块的天线罩和底盖。该系统包括：安装在天线模块的内表面上的集热单元; 安装在所述天线模块的外表面上的放热单元; 以及用于将热量从集热单元传递到散热单元的传热单元。

9. 发明授权

US08335255B2 Motion estimation method, medium, and system with fast motion estimation 有权
标题翻译：运动估计方法，中等和快速运动估计系统
公开(公告)号：US08335255B2
公开(公告)日：2012-12-18
申请号：US11783599
申请日：2007-04-10
申请人： Ho-Jin Lee , Sang-Jo Lee , Si-hwa Lee , Do-hyung Kim
发明人： Ho-Jin Lee , Sang-Jo Lee , Si-hwa Lee , Do-hyung Kim
IPC分类号： H04N7/12
CPC分类号： H04N19/56 , H04N19/51
摘要： A motion estimation method, medium, and system with fast motion estimation. The motion estimation method includes comparing a cost indicating a difference between a current block of a current image and a block of a reference image specified by a starting point with a predetermined threshold and selectively searching for the best matching block of the current block from the starting point according to the comparison result.
摘要翻译：具有快速运动估计的运动估计方法，介质和系统。运动估计方法包括将当前图像的当前块与由起始点指定的参考图像的块之间的差指定为预定阈值的成本进行比较，并且从开始选择性地搜索当前块的最佳匹配块根据比较结果。

10. 发明申请

US20120091580A1 Semiconductor Devices And Methods Of Fabricating The Same 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20120091580A1
公开(公告)日：2012-04-19
申请号：US13211574
申请日：2011-08-17
申请人： SeYoung Jeong , Hogeon Song , Chungsun Lee , Ho-Jin Lee
发明人： SeYoung Jeong , Hogeon Song , Chungsun Lee , Ho-Jin Lee
IPC分类号： H01L23/48
CPC分类号： H01L23/481 , H01L21/563 , H01L21/76898 , H01L23/3128 , H01L24/04 , H01L24/05 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L2221/68372 , H01L2224/0401 , H01L2224/04042 , H01L2224/0557 , H01L2224/05624 , H01L2224/05647 , H01L2224/13009 , H01L2224/13025 , H01L2224/1403 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/48227 , H01L2224/73257 , H01L2224/97 , H01L2225/0651 , H01L2225/06517 , H01L2225/06544 , H01L2225/06562 , H01L2225/06568 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/1304 , H01L2924/14 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19104 , H01L2924/00 , H01L2224/05552 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided is a semiconductor device. The semiconductor device may include a first semiconductor chip that includes a first through silicon via having a first protrusion height and a second through silicon via having a second protrusion height greater than the first protrusion height which are penetrating at least a portion of the first semiconductor chip, a second semiconductor chip may be electrically connected to the first through silicon via, and a third semiconductor chip may be electrically connected to the second through silicon via.
摘要翻译：提供一种半导体器件。半导体器件可以包括第一半导体芯片，其包括具有第一突起高度的第一至第二硅通孔以及具有大于第一突出高度的第二突出高度的第二穿透硅通孔，该第二突出高度穿过第一半导体芯片的至少一部分，第二半导体芯片可以电连接到第一通孔硅通孔，并且第三半导体芯片可以电连接到第二通孔硅通孔。

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