专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08975757B2 Lead-free solder connection structure and solder ball 有权
标题翻译：无铅焊料连接结构和焊球
公开(公告)号：US08975757B2
公开(公告)日：2015-03-10
申请号：US12736053
申请日：2009-03-03
申请人： Minoru Ueshima , Masayuki Suzuki , Yoshie Yamanaka , Shunsaku Yoshikawa , Tokuro Yamaki , Tsukasa Ohnishi
发明人： Minoru Ueshima , Masayuki Suzuki , Yoshie Yamanaka , Shunsaku Yoshikawa , Tokuro Yamaki , Tsukasa Ohnishi
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/00 , B23K35/26 , C22C13/00 , H01L23/36 , H01L21/56 , H01L23/31 , H01L23/498
CPC分类号： H01L24/11 , B23K35/262 , B23K35/268 , C22C13/00 , H01L21/563 , H01L23/3114 , H01L23/3128 , H01L23/36 , H01L23/49816 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L2224/0401 , H01L2224/0558 , H01L2224/05644 , H01L2224/11334 , H01L2224/11849 , H01L2224/13111 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/81203 , H01L2224/81211 , H01L2224/81801 , H01L2224/8191 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/16195 , H01L2924/3511 , H01L2924/05432 , H01L2224/13099 , H01L2924/3512 , H01L2924/00
摘要： Solder used for flip chip bonding inside a semiconductor package was a Sn—Pb solder such as a Pb-5Sn composition. Lead-free solders which have been studied are hard and easily form intermetallic compounds with Sn, so they were not suitable for a flip chip connection structure inside a semiconductor package, which requires stress relaxation properties. This problem is eliminated by a flip chip connection structure inside a semiconductor package using a lead-free solder which is characterized by consisting essentially of 0.01-0.5 mass percent of Ni and a remainder of Sn. 0.3-0.9 mass percent of Cu and 0.001-0.01 mass percent of P may be added to this solder composition.
摘要翻译：用于半导体封装内的倒装芯片焊接的焊料是诸如Pb-5Sn组合物的Sn-Pb焊料。已经研究的无铅焊料难以容易地与Sn形成金属间化合物，因此它们不适用于半导体封装内的倒装芯片连接结构，这需要应力松弛性能。该问题通过使用无铅焊料的半导体封装内的倒装芯片连接结构来消除，其特征在于基本上由0.01-0.5质量％的Ni和余量的Sn组成。可以向该焊料组合物中添加0.3〜0.9质量％的Cu和0.001-0.01质量％的P。

2. 发明申请

US20110115084A1 LEAD-FREE SOLDER CONNECTION STRUCTURE AND SOLDER BALL 有权
标题翻译：无铅焊接连接结构和焊球
公开(公告)号：US20110115084A1
公开(公告)日：2011-05-19
申请号：US12736053
申请日：2009-03-03
申请人： Minoru Ueshima , Masayuki Suzuki , Yoshie Yamanaka , Shunsaku Yoshikawa , Tokuro Yamaki , Tsukasa Ohnishi
发明人： Minoru Ueshima , Masayuki Suzuki , Yoshie Yamanaka , Shunsaku Yoshikawa , Tokuro Yamaki , Tsukasa Ohnishi
IPC分类号： H01L23/488 , H01L21/60 , C22C13/00
CPC分类号： H01L24/11 , B23K35/262 , B23K35/268 , C22C13/00 , H01L21/563 , H01L23/3114 , H01L23/3128 , H01L23/36 , H01L23/49816 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L2224/0401 , H01L2224/0558 , H01L2224/05644 , H01L2224/11334 , H01L2224/11849 , H01L2224/13111 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/81203 , H01L2224/81211 , H01L2224/81801 , H01L2224/8191 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/16195 , H01L2924/3511 , H01L2924/05432 , H01L2224/13099 , H01L2924/3512 , H01L2924/00
摘要： Solder used for flip chip bonding inside a semiconductor package was a Sn—Pb solder such as a Pb-5Sn composition. Lead-free solders which have been studied are hard and easily form intermetallic compounds with Sn, so they were not suitable for a flip chip connection structure inside a semiconductor package, which requires stress relaxation properties. This problem is eliminated by a flip chip connection structure inside a semiconductor package using a lead-free solder which is characterized by consisting essentially of 0.01-0.5 mass percent of Ni and a remainder of Sn. 0.3-0.9 mass percent of Cu and 0.001-0.01 mass percent of P may be added to this solder composition.
摘要翻译：用于半导体封装内的倒装芯片焊接的焊料是诸如Pb-5Sn组合物的Sn-Pb焊料。已经研究的无铅焊料难以容易地与Sn形成金属间化合物，因此它们不适用于半导体封装内的倒装芯片连接结构，这需要应力松弛性能。该问题通过使用无铅焊料的半导体封装内的倒装芯片连接结构来消除，其特征在于基本上由0.01-0.5质量％的Ni和余量的Sn组成。可以向该焊料组合物中添加0.3〜0.9质量％的Cu和0.001-0.01质量％的P。

3. 发明授权

US09844837B2 Lead-free solder alloy 有权
公开(公告)号：US09844837B2
公开(公告)日：2017-12-19
申请号：US14006538
申请日：2012-03-23
申请人： Masato Shimamura , Tsukasa Ohnishi , Mitsuhiro Kosai , Kazuyori Takagi , Tomoko Nonaka , Masayuki Suzuki , Toru Hayashida , Seiko Ishibashi , Shunsaku Yoshikawa , Yoshie Yamanaka
发明人： Masato Shimamura , Tsukasa Ohnishi , Mitsuhiro Kosai , Kazuyori Takagi , Tomoko Nonaka , Masayuki Suzuki , Toru Hayashida , Seiko Ishibashi , Shunsaku Yoshikawa , Yoshie Yamanaka
IPC分类号： B23K35/26 , B23K35/02 , B23K35/36 , C22F1/16 , C22C13/00 , C22C13/02
CPC分类号： B23K35/262 , B23K35/0227 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K35/3618 , C22C13/00 , C22C13/02 , C22F1/16 , H01L2924/00013 , H01L2924/014 , Y10T428/12222 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01083 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： By using a solder alloy consisting essentially of 0.2-1.2 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-3.0 mass % of Bi, 0.02-1.0 mass % of Sb, 0.01-2.0 mass % of In, and a remainder of Sn, it is possible to obtain portable devices having excellent resistance to drop impact and excellent heat cycle properties without developing thermal fatigue even when used in a high-temperature environment such as inside a vehicle heated by the sun or in a low-temperature environment such as outdoors in snowy weather.

4. 发明申请

US20140141273A1 Lead-Free Solder Alloy 有权
标题翻译：无铅焊料合金
公开(公告)号：US20140141273A1
公开(公告)日：2014-05-22
申请号：US14006538
申请日：2012-03-23
申请人： Masato Shimamura , Tsukasa Ohnishi , Mitsuhiro Kosai , Kazuyori Takagi , Tomoko Nonaka , Masayuki Suzuki , Toru Hayashida , Seiko Ishibashi , Shunsaku Yoshikawa , Yoshie Yamanaka
发明人： Masato Shimamura , Tsukasa Ohnishi , Mitsuhiro Kosai , Kazuyori Takagi , Tomoko Nonaka , Masayuki Suzuki , Toru Hayashida , Seiko Ishibashi , Shunsaku Yoshikawa , Yoshie Yamanaka
IPC分类号： B23K35/26 , B23K35/02
CPC分类号： B23K35/262 , B23K35/0227 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K35/3618 , C22C13/00 , C22C13/02 , C22F1/16 , H01L2924/00013 , H01L2924/014 , Y10T428/12222 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01083 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： By using a solder alloy consisting essentially of 0.2-1.2 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-3.0 mass % of Bi, 0.02-1.0 mass % of Sb, 0.01-2.0 mass % of In, and a remainder of Sn, it is possible to obtain portable devices having excellent resistance to drop impact and excellent heat cycle properties without developing thermal fatigue even when used in a high-temperature environment such as inside a vehicle heated by the sun or in a low-temperature environment such as outdoors in snowy weather.
摘要翻译：通过使用主要由Ag组成的焊料合金，Cu：0.6〜0.9质量％，Bi：1.2〜3.0质量％，Sb：0.02〜1.0质量％，Sb：0.01〜2.0质量％，和 Sn的余量，可以获得具有优异的耐滴落冲击性和优异的热循环特性的便携式装置，而不会在诸如在太阳加热的车辆内的高温环境或低温下使用时产生热疲劳环境，如在多雪的天气下的户外。

5. 发明授权

US08896119B2 Bonding material for semiconductor devices 有权
标题翻译：半导体器件用接合材料
公开(公告)号：US08896119B2
公开(公告)日：2014-11-25
申请号：US13261584
申请日：2011-08-03
申请人： Yoshitsugu Sakamoto , Hiroyuki Yamada , Yoshie Yamanaka , Tsukasa Ohnishi , Shunsaku Yoshikawa , Kenzo Tadokoro
发明人： Yoshitsugu Sakamoto , Hiroyuki Yamada , Yoshie Yamanaka , Tsukasa Ohnishi , Shunsaku Yoshikawa , Kenzo Tadokoro
IPC分类号： H01L23/48 , H01L23/00 , C22C1/08 , B23K35/02 , B23K35/30 , H01L23/373 , C22C9/02 , C22C13/00 , B23K35/26 , H05K3/34
CPC分类号： B23K35/262 , B22F2998/00 , B23K35/025 , B23K35/302 , B23K2101/40 , C22C1/08 , C22C9/02 , C22C13/00 , H01L23/3735 , H01L24/07 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/04042 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29299 , H01L2224/32014 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2224/83065 , H01L2224/8309 , H01L2224/83444 , H01L2224/83455 , H01L2224/83801 , H01L2224/8384 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01021 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/15747 , H01L2924/203 , H05K3/3463 , H05K2201/0116 , Y10T428/12479 , H01L2924/00014 , C22C1/0483 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2924/0002
摘要： A semiconductor device is provided which has internal bonds which do not melt at the time of mounting on a substrate. A bonding material is used for internal bonding of the semiconductor device. The bonding material is obtained by filling the pores of a porous metal body having a mesh-like structure and covering the surface thereof with Sn or an Sn-based solder alloy.
摘要翻译：提供一种半导体器件，其具有在安装在基板上时不熔化的内部结合。接合材料用于半导体器件的内部接合。通过填充具有网状结构的多孔金属体的孔并用Sn或Sn类焊料合金覆盖其表面而获得接合材料。

6. 发明申请

US20130134591A1 Bonding Material for Semiconductor Devices 有权
标题翻译：半导体器件的接合材料
公开(公告)号：US20130134591A1
公开(公告)日：2013-05-30
申请号：US13261584
申请日：2011-08-03
申请人： Yoshitsugu Sakamoto , Hiroyuki Yamada , Yoshie Yamanaka , Tsukasa Ohnishi , Shunsaku Yoshikawa , Kenzo Tadokoro
发明人： Yoshitsugu Sakamoto , Hiroyuki Yamada , Yoshie Yamanaka , Tsukasa Ohnishi , Shunsaku Yoshikawa , Kenzo Tadokoro
IPC分类号： B23K35/26 , H01L23/00
CPC分类号： B23K35/262 , B22F2998/00 , B23K35/025 , B23K35/302 , B23K2101/40 , C22C1/08 , C22C9/02 , C22C13/00 , H01L23/3735 , H01L24/07 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/04042 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29299 , H01L2224/32014 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2224/83065 , H01L2224/8309 , H01L2224/83444 , H01L2224/83455 , H01L2224/83801 , H01L2224/8384 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01021 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/15747 , H01L2924/203 , H05K3/3463 , H05K2201/0116 , Y10T428/12479 , H01L2924/00014 , C22C1/0483 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2924/0002
摘要： A semiconductor device is provided which has internal bonds which do not melt at the time of mounting on a substrate. A bonding material is used for internal bonding of the semiconductor device. The bonding material is obtained by filling the pores of a porous metal body having a mesh-like structure and covering the surface thereof with Sn or an Sn-based solder alloy.
摘要翻译：提供一种半导体器件，其具有在安装在基板上时不熔化的内部结合。接合材料用于半导体器件的内部接合。通过填充具有网状结构的多孔金属体的孔并用Sn或Sn类焊料合金覆盖其表面而获得接合材料。

7. 发明授权

US09773721B2 Lead-free solder alloy, connecting member and a method for its manufacture, and electronic part 有权
公开(公告)号：US09773721B2
公开(公告)日：2017-09-26
申请号：US14314043
申请日：2014-06-25
申请人： Shunsaku Yoshikawa , Yoshie Yamanaka , Tsukasa Ohnishi , Seiko Ishibashi , Koji Watanabe , Hiroki Ishikawa , Yutaka Chiba
发明人： Shunsaku Yoshikawa , Yoshie Yamanaka , Tsukasa Ohnishi , Seiko Ishibashi , Koji Watanabe , Hiroki Ishikawa , Yutaka Chiba
IPC分类号： H01L23/495 , B23K35/00 , B23K35/02 , C22C28/00 , H01L23/373 , B23K35/26 , C23C24/10 , H01R43/02
CPC分类号： H01L23/495 , B23K35/007 , B23K35/0238 , B23K35/26 , C22C28/00 , C23C24/103 , H01L23/3736 , H01L2924/0002 , H01R43/0235 , H01L2924/00
摘要： A lead-free solder which can reduce the occurrence of voids and a connecting member which uses the solder and has excellent adhesion, bonding strength, and workability are provided. The lead-free solder alloy contains Sn: 0.1-3% and/or Bi: 0.1-2%, and a remainder of In and unavoidable impurities and has the effect of suppressing the occurrence of voids at the time of soldering. The connecting member is prepared by melting the lead-free solder alloy, immersing a metal substrate in the melt, and applying ultrasonic vibrations to the molten lead-free solder alloy and the metal substrate to form a lead-free solder alloy layer on the surface of the metal substrate. A heat sink and a package are soldered to each other through this connecting member by reflow heating in the presence of flux.

8. 发明申请

US20140326490A1 LEAD-FREE SOLDER ALLOY, CONNECTING MEMBER AND A METHOD FOR ITS MANUFACTURE, AND ELECTRONIC PART 有权
标题翻译：无铅焊接合金，连接件及其制造方法及电子零件
公开(公告)号：US20140326490A1
公开(公告)日：2014-11-06
申请号：US14314043
申请日：2014-06-25
申请人： Shunsaku Yoshikawa , Yoshie Yamanaka , Tsukasa Ohnishi , Seiko Ishibashi , Koji Watanabe , Hiroki Ishikawa , Yutaka Chiba
发明人： Shunsaku Yoshikawa , Yoshie Yamanaka , Tsukasa Ohnishi , Seiko Ishibashi , Koji Watanabe , Hiroki Ishikawa , Yutaka Chiba
IPC分类号： H01L23/495 , H01R43/02
CPC分类号： H01L23/495 , B23K35/007 , B23K35/0238 , B23K35/26 , C22C28/00 , C23C24/103 , H01L23/3736 , H01L2924/0002 , H01R43/0235 , H01L2924/00
摘要： A lead-free solder which can reduce the occurrence of voids and a connecting member which uses the solder and has excellent adhesion, bonding strength, and workability are provided. The lead-free solder alloy has a composition consisting essentially of Sn: 0.1-3% and/or Bi: 0.1-2%, and a remainder of In and unavoidable impurities and has the effect of suppressing the occurrence of voids at the time of soldering. The connecting member is prepared by melting the lead-free solder alloy, immersing a metal substrate in the melt, and applying ultrasonic vibrations to the molten lead-free solder alloy and the metal substrate to form a lead-free solder alloy layer on the surface of the metal substrate. A heat sink and a package are soldered to each other through this connecting member by reflow heating in the presence of flux.
摘要翻译：提供了可以减少空穴发生的无铅焊料和使用焊料的连接构件，并且具有优异的粘合性，粘结强度和可加工性。无铅焊料合金的组成主要由Sn：0.1-3％和/或Bi：0.1〜2％，余量为In和不可避免的杂质，具有抑制空隙发生时的效果焊接。通过熔化无铅焊料合金，将金属基材浸渍在熔体中，并将超声波振动施加到熔融无铅焊料合金和金属基板上以在表面上形成无铅焊料合金层来制备连接部件的金属基板。在存在焊剂的情况下，通过回流加热将散热器和封装件通过该连接构件彼此焊接。

9. 发明申请

US20120199393A1 LEAD-FREE SOLDER ALLOY, CONNECTING MEMBER AND A METHOD FOR ITS MANUFACTURE, AND ELECTRONIC PART 审中-公开
标题翻译：无铅焊接合金，连接件及其制造方法及电子零件
公开(公告)号：US20120199393A1
公开(公告)日：2012-08-09
申请号：US13261199
申请日：2010-09-02
申请人： Shunsaku Yoshikawa , Yoshie Yamanaka , Tsukasa Ohnishi , Seiko Ishibashi , Koji Watanabe , Hiroki Ishikawa , Yutaka Chiba
发明人： Shunsaku Yoshikawa , Yoshie Yamanaka , Tsukasa Ohnishi , Seiko Ishibashi , Koji Watanabe , Hiroki Ishikawa , Yutaka Chiba
IPC分类号： H01R4/02 , B23K1/20 , C22C28/00
CPC分类号： H01L23/495 , B23K35/007 , B23K35/0238 , B23K35/26 , C22C28/00 , C23C24/103 , H01L23/3736 , H01L2924/0002 , H01R43/0235 , H01L2924/00
摘要： A lead-free solder which can reduce the occurrence of voids and a connecting member which uses the solder and has excellent adhesion, bonding strength, and workability are provided. The lead-free solder alloy has a composition consisting essentially of Sn: 0.1-3% and/or Bi: 0.1-2%, and a remainder of In and unavoidable impurities and has the effect of suppressing the occurrence of voids at the time of soldering. The connecting member is prepared by melting the lead-free solder alloy, immersing a metal substrate in the melt, and applying ultrasonic vibrations to the molten lead-free solder alloy and the metal substrate to form a lead-free solder alloy layer on the surface of the metal substrate.A heat sink and a package are soldered to each other through this connecting member by reflow heating in the presence of flux.
摘要翻译：提供了可以减少空穴发生的无铅焊料和使用焊料的连接构件，并且具有优异的粘合性，粘结强度和可加工性。无铅焊料合金的组成主要由Sn：0.1-3％和/或Bi：0.1〜2％，余量为In和不可避免的杂质，具有抑制空隙发生时的效果焊接。通过熔化无铅焊料合金，将金属基材浸渍在熔体中，并将超声波振动施加到熔融无铅焊料合金和金属基板上以在表面上形成无铅焊料合金层来制备连接部件的金属基板。在存在焊剂的情况下，通过回流加热将散热器和封装件通过该连接构件彼此焊接。

10. 发明申请

US20070243098A1 Lead-Free Solder 审中-公开
标题翻译：无铅焊锡
公开(公告)号：US20070243098A1
公开(公告)日：2007-10-18
申请号：US11578827
申请日：2004-07-29
申请人： Tsukasa Ohnishi , Tokuro Yamaki , Masazumi Amagai , Masako Watanabe
发明人： Tsukasa Ohnishi , Tokuro Yamaki , Masazumi Amagai , Masako Watanabe
IPC分类号： C22C13/00
CPC分类号： B23K35/262 , B23K2101/36 , C22C13/00
摘要： [Problem]Mobile electronic equipment is often dropped during use or transport, and the soldered joints of electronic parts sometimes peel off due to the impact when dropped. In addition, they undergo heat cycles in which internal coils, resistors, and the like generate heat and soldered joints increase in temperature during operation of electronic equipment and cool off during periods of non-use. With a conventional Sn—Ag base lead-free solder, the impact resistance and resistance to heat cycles of minute portions such as solder bumps were not adequate. The present invention provides a lead-free solder alloy, bumps of which have excellent impact resistance and resistance to heat cycles. Means for Solving the Problem The present invention is a lead-free solder alloy comprising 0.1—less than 2.0 mass % of Ag, 0.01-0.1 mass % of Cu, 0.005-0.1 mass % of Zn, and a remainder of Sn, to which Ga, Ge, or P may be added, and to which Ni or Co may be further added.
摘要翻译： [问题]移动电子设备在使用或运输过程中经常掉落，电子部件的焊接接头在掉线时有时会因为冲击而脱落。此外，它们经历热循环，其中内部线圈，电阻器等产生热量和焊接接头在电子设备操作期间温度升高，并在不使用期间冷却。使用常规的Sn-Ag基底无铅焊料，耐冲击性和耐冲击等微小部分的热循环不足。本发明提供一种无铅焊料合金，其具有优异的耐冲击性和耐热循环性。解决问题的手段本发明是一种无铅焊料合金，其包含0.1质量％以下的Ag，0.01质量％以下的Cu，0.01〜0.1质量％的Cu，0.005〜0.1质量％的Zn和余量的Sn，可以添加Ga，Ge或P，并且可以进一步添加Ni或Co。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式