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1. 发明申请

US20050067739A1 Method of making liquid crystal polymer films 有权
标题翻译：制备液晶聚合物膜的方法
公开(公告)号：US20050067739A1
公开(公告)日：2005-03-31
申请号：US10947160
申请日：2004-09-23
申请人： Minoru Onodera , Tatsuya Sunamoto
发明人： Minoru Onodera , Tatsuya Sunamoto
IPC分类号： B29C71/02 , B29L7/00 , H05K1/00 , H05K3/00
CPC分类号： H05K3/0011 , B29C71/02 , B29K2105/0079 , B29L2007/008 , H05K1/0393 , H05K2201/0141 , H05K2201/068 , H05K2203/0152 , H05K2203/1105
摘要： A method of making a thermotropic liquid crystal polymer film includes continuously heat treating of the thermotropic liquid crystal polymer film 2 while the latter is jointed to a sheet-like support member 4, and subsequently separating the heat-treated thermotropic liquid crystal polymer film 2 from the support member 4. The continuous heat treatment of the thermotropic liquid crystal polymer film 2 then jointed to the support member 4 is carried out for a predetermined heating time within the range of 5 to 60 seconds at a predetermined heating temperature T° C. equal to or higher than the melting point Tm° C. of the thermotropic liquid crystal polymer film less 15° C. (i.e., Tm−15° C.), but lower than the melting point Tm° C. (thus, Tm−15° C.≦T° C.
摘要翻译：制造热致液晶聚合物膜的方法包括将热致液晶聚合物膜2连续热处理，同时将其接合到片状支撑构件4，然后将热处理的热致液晶聚合物膜2从支撑构件4.接着连接到支撑构件4的热致变液晶聚合物膜2的连续热处理在预定的加热温度T℃下在5至60秒的范围内进行预定的加热时间。等于以上的热致液晶聚合物膜的熔点Tm℃为15℃以下（即Tm-15℃），但低于熔点Tm℃（因此，Tm-15 ℃），从而提高热致液晶聚合物膜的热膨胀系数。

2. 发明授权

US07740790B2 Method of making liquid crystal polymer films 有权
标题翻译：制备液晶聚合物膜的方法
公开(公告)号：US07740790B2
公开(公告)日：2010-06-22
申请号：US10947160
申请日：2004-09-23
申请人： Minoru Onodera , Tatsuya Sunamoto
发明人： Minoru Onodera , Tatsuya Sunamoto
IPC分类号： B29C71/02 , B05D3/02
CPC分类号： H05K3/0011 , B29C71/02 , B29K2105/0079 , B29L2007/008 , H05K1/0393 , H05K2201/0141 , H05K2201/068 , H05K2203/0152 , H05K2203/1105
摘要： A method of making a thermotropic liquid crystal polymer film includes continuously heat treating of the thermotropic liquid crystal polymer film 2 while the latter is jointed to a sheet-like support member 4, and subsequently separating the heat-treated thermotropic liquid crystal polymer film 2 from the support member 4. The continuous heat treatment of the thermotropic liquid crystal polymer film 2 then jointed to the support member 4 is carried out for a predetermined heating time within the range of 5 to 60 seconds at a predetermined heating temperature T° C. equal to or higher than the melting point Tm° C. of the thermotropic liquid crystal polymer film less 15° C. (i.e., Tm−15° C.), but lower than the melting point Tm° C. (thus, Tm−15° C.≦T° C.
摘要翻译：制造热致液晶聚合物膜的方法包括将热致液晶聚合物膜2连续热处理，同时将其接合到片状支撑构件4，然后将热处理的热致液晶聚合物膜2从支撑构件4.接着连接到支撑构件4的热致变液晶聚合物膜2的连续热处理在预定的加热温度T℃下在5至60秒的范围内进行预定的加热时间。等于以上的热致液晶聚合物膜的熔点Tm℃为15℃以下（即Tm-15℃），但低于熔点Tm℃（因此，Tm-15 ℃），从而提高热致液晶聚合物膜的热膨胀系数。

3. 发明授权

US08152950B2 Multi-layer circuit board and method of making the same 有权
标题翻译：多层电路板及其制作方法
公开(公告)号：US08152950B2
公开(公告)日：2012-04-10
申请号：US12342377
申请日：2008-12-23
申请人： Toshinori Tsugaru , Tatsuya Sunamoto , Tadao Yoshikawa
发明人： Toshinori Tsugaru , Tatsuya Sunamoto , Tadao Yoshikawa
IPC分类号： B32B37/04
CPC分类号： H05K3/4655 , H05K3/386 , H05K3/4069 , H05K3/4617 , H05K3/4626 , H05K3/4652 , H05K2201/0129 , H05K2201/0141 , H05K2201/0195 , H05K2201/09881 , H05K2203/1189 , Y10T428/24917
摘要： A method of making a multi-layer circuit board that has a first film and at least two more films, second and third films, each being made of a thermoplastic polymer capable of forming an optically anisotropic melt phase, the first film having a low melting point, the second and third films having respective melting points higher than the melting point of the first film and at least one of the second and the third films having a circuit pattern thereon, and the first to third films are thermo compressed together with the first film interposed between the second and third films. This method entails causing at least one of the circuit patterns on one of the second and third films to contact an opposing surface of the other of the second and third films through the first film during the thermo compression bonding of the first to third films.
摘要翻译：一种制造多层电路板的方法，所述多层电路板具有第一膜和至少两层膜，第二膜和第三膜各自由能够形成光学各向异性熔融相的热塑性聚合物制成，所述第一膜具有低熔点点，第二和第三膜的熔点高于第一膜的熔点，第二和第三膜中的至少一个膜上具有电路图案，第一至第三膜与第一膜的第一和第三膜热压缩介于第二和第三片之间的胶片。该方法需要使第二和第三膜中的一个上的电路图案中的至少一个在第一至第三膜的热压接期间通过第一膜接触第二和第三膜中的另一个的相对表面。

4. 发明申请

US20090107624A1 MULTI-LAYER CIRCUIT BOARD AND METHOD OF MAKING THE SAME 有权
标题翻译：多层电路板及其制造方法
公开(公告)号：US20090107624A1
公开(公告)日：2009-04-30
申请号：US12342377
申请日：2008-12-23
申请人： Toshinori TSUGARU , Tatsuya Sunamoto , Tadao Yoshikawa
发明人： Toshinori TSUGARU , Tatsuya Sunamoto , Tadao Yoshikawa
IPC分类号： B32B37/04
CPC分类号： H05K3/4655 , H05K3/386 , H05K3/4069 , H05K3/4617 , H05K3/4626 , H05K3/4652 , H05K2201/0129 , H05K2201/0141 , H05K2201/0195 , H05K2201/09881 , H05K2203/1189 , Y10T428/24917
摘要： A method of making a multi-layer circuit board that has a first film and at least two more films, second and third films, each being made of a thermoplastic polymer capable of forming an optically anisotropic melt phase, the first film having a low melting point, the second and third films having respective melting points higher than the melting point of the first film and at lest one of the second and the third films having a circuit pattern thereon, and the first to third films are thermo compressed together with the first film interposed between the second and third films. This method entails causing at least one of the circuit patterns on one of the second and third films to contact an opposing surface of the other of the second and third films through the first film during the thermo compression bonding of the first to third films.
摘要翻译：一种制造多层电路板的方法，所述多层电路板具有第一膜和至少两层膜，第二膜和第三膜各自由能够形成光学各向异性熔融相的热塑性聚合物制成，所述第一膜具有低熔点点，第二和第三膜具有高于第一膜的熔点的熔点以及第二膜和第三膜中的至少一个在其上具有电路图案，并且第一至第三膜与第一膜一起被热压介于第二和第三片之间的胶片。该方法需要使第二和第三膜中的一个上的电路图案中的至少一个在第一至第三膜的热压接期间通过第一膜接触第二和第三膜中的另一个的相对表面。

5. 发明授权

US07160499B2 Method for making inflation films 有权
标题翻译：制作通风薄膜的方法
公开(公告)号：US07160499B2
公开(公告)日：2007-01-09
申请号：US10650847
申请日：2003-08-29
申请人： Takahiro Miyata , Katsunori Hatashi , Tatsuya Sunamoto , Tadao Yoshikawa
发明人： Takahiro Miyata , Katsunori Hatashi , Tatsuya Sunamoto , Tadao Yoshikawa
IPC分类号： B29D22/00
CPC分类号： B29C47/8835 , B29C47/0026 , B29C47/0057 , B29C47/0059 , B29C2035/1666 , B29K2023/06 , B29K2025/00 , B29K2077/00 , B29L2007/008
摘要： An inflation film is formed by extruding a raw resin in a molten state through a circular die to form a tubular film, expanding the tubular film by the pressure of a gaseous medium introduced into an inner space of the tubular film, while the tubular film is being cooled to be solidified by blowing a cooling gas to the outer surface of the tubular film, and drawing the film while being progressively flattened by guide members. During the manufacture, the temperature Tf (° C.) of the solidified tubular film at the time it contacts the guide member for the first time is so adjusted as not to be higher than Tr (5) [° C.]; wherein Tr (5) represents the temperature at which the thermal deformation ratio of the solidified tubular film becomes 5% when it is measured, being loaded with a stress of a value equal to the frictional force received from the guide members under the conditions of manufacture of the film.
摘要翻译：吹塑薄膜是通过圆形模头挤出熔融状态的原料树脂而形成的，以形成管状薄膜，通过引入管状薄膜的内部空间的气态介质的压力使管状薄膜膨胀，同时管状薄膜通过向管状膜的外表面吹入冷却气体而冷却固化，并且在被引导构件逐渐变平的状态下拉伸膜。在制造过程中，凝固的管状膜在首次与导向件接触时的温度Tf（℃）被调节为不高于Tr（5）[℃]。其中Tr（5）表示在测量时凝固的管状膜的热变形率变为5％的温度，在制造条件下加载等于从引导构件接收的摩擦力的值的应力的电影。

6. 发明申请

US20130306358A1 CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME 有权
标题翻译：电路板及其制造方法
公开(公告)号：US20130306358A1
公开(公告)日：2013-11-21
申请号：US13997883
申请日：2011-12-16
申请人： Kazuyuki Ohmori , Tatsuya Sunamoto
发明人： Kazuyuki Ohmori , Tatsuya Sunamoto
IPC分类号： H05K1/03
CPC分类号： H05K1/0245 , B29C37/0075 , B29C43/18 , B29C43/203 , H05K1/0237 , H05K1/0242 , H05K1/0296 , H05K1/0306 , H05K1/09 , H05K3/281 , H05K2201/0129 , H05K2201/0141 , H05K2203/068 , Y10T156/10
摘要： Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.
摘要翻译：提供一种制造电路板的方法，包括制备板结构体（11）并用覆盖膜（14）覆盖在板结构体（11）的最外层上的导体电路元件（13），其中热在将隔离材料（15）插入在覆盖膜（14）和热处理装置之间的同时进行处理。剥离材料（15）是从覆盖膜向加热装置依次形成选自超高分子量聚乙烯膜和聚四氟乙烯膜的低摩擦膜（16）的层叠体，第一铝箔（17），第一高密度聚乙烯膜（18a），第二高密度聚乙烯膜（18b）和第二铝箔（19）。第一高密度聚乙烯膜（18a）和第二高密度聚乙烯膜（18b）被定位成使得各个MD方向彼此垂直。

7. 发明授权

US07465420B2 Film forming method 有权
标题翻译：成膜方法
公开(公告)号：US07465420B2
公开(公告)日：2008-12-16
申请号：US10843308
申请日：2004-05-12
申请人： Tadao Yoshikawa , Tatsuya Sunamoto
发明人： Tadao Yoshikawa , Tatsuya Sunamoto
IPC分类号： B29C55/28
CPC分类号： B29C55/28 , B29C47/0004 , B29C47/0026 , B29C47/0057 , B29C47/0059 , B29C49/0005 , B29C67/24 , B29K2067/00 , B29K2077/10 , B29K2105/0079 , B29K2995/0012 , B29K2995/0044 , B29K2995/0053 , B29K2995/0097
摘要： The method of manufacturing a film of thermotropic liquid crystal polymer includes extruding a thermotropic liquid crystal polymer of a kind in which any one of activation energies Ea1 and Ea2 of a melt viscosity is within the range of 30 to 90 kcal/mol, with the ratio (Ea1/Ea2) of the activation energy Ea1 relative to the activation energy Ea2 being within the range of 1 to 1.7. The activation energies Ea1 and Ea2 are measured by means of a capillary rheometer, including a nozzle of 1 mm in inner diameter and 10 mm in length disposed at an angle of introduction of 90° and a barrel of 9.55 mm in inner diameter, at respective shear rates of 243 seconds−1 and 2432 seconds−1 under a temperature ranging from the temperature [(Tm−10)° C.], which is lower by 10° C. than the melting point [(Tm)° C.] of the thermotropic liquid crystal polymer, to the temperature [(Tm+20)° C.], which is higher by 20° C. than the melting point [(Tm)° C.] of the thermotropic liquid crystal polymer. The thermotropic liquid crystal polymer also has a melt viscosity of not lower than 400 poises measured under predetermined conditions, and is extruded from a die that is heated to a temperature of predetermined range.
摘要翻译：制造热致液晶聚合物膜的方法包括将熔融粘度的活化能Ea1和Ea2中的任一种的热致变液晶聚合物挤出在30〜90kcal / mol的范围内，（Ea1 / Ea2）相对于活化能Ea2在1〜1.7的范围内。活化能Ea1和Ea2通过毛细管流变仪测量，毛细管流变仪包括内径为1mm的内径为10mm的长度，以90°的引入角设置，内径为9.55mm的管，分别为剪切速率为243秒-1和2432秒-1，温度范围为[（Tm-10）℃]，比熔点[（Tm）℃]低10℃。的热致液晶聚合物的温度[...（Tm + 20）℃]，比热致变液晶聚合物的熔点[（Tm）℃]高20℃。该热致液晶聚合物的熔融粘度在预定条件下测得的不低于400泊，并从加热至预定范围温度的模具中挤出。

8. 发明授权

US07387760B2 Apparatus for and method of making inflation films 有权
标题翻译：吹塑薄膜的设备及方法
公开(公告)号：US07387760B2
公开(公告)日：2008-06-17
申请号：US10650680
申请日：2003-08-29
申请人： Takahiro Miyata , Katsunori Hatashi , Tatsuya Sunamoto , Tadao Yoshikawa
发明人： Takahiro Miyata , Katsunori Hatashi , Tatsuya Sunamoto , Tadao Yoshikawa
IPC分类号： B29D22/00
CPC分类号： B29C47/92 , B29C47/0026 , B29C47/8835 , B29C2947/92152 , B29C2947/92209 , B29C2947/92314 , B29C2947/9238 , B29C2947/92428 , B29C2947/92571 , B29C2947/92704 , B29C2947/92809 , B29C2947/92923
摘要： An apparatus for making an inflation film formed by extruding a raw resin in a molten state through a circular die to form a tubular film, and expanding the tubular film by the pressure of a gaseous medium introduced into an inner space thereof, while the tubular film is being cooled. The apparatus includes a cooling ring, at least one air ring coaxial with the circular die, and an adjusting device for adjusting the temperature of a gaseous medium, blown from the air ring, to a range effective to retain the tubular film, then still in a molten phase, in a condition in which the tubular film is inflated. A method for making an inflation film is also disclosed.
摘要翻译：一种用于制造吹塑薄膜的装置，其通过圆形模头挤出熔融状态的原料树脂而形成，以形成管状薄膜，并且通过引入其内部空间的气态介质的压力使管状薄膜膨胀，同时管状薄膜正在冷却该装置包括一个冷却环，至少一个与圆形管芯同轴的空气环，以及用于调节从空气环吹出的气态介质的温度到有效保持管状膜的范围的调节装置，然后仍然在在管状膜膨胀的状态下的熔融相。还公开了一种制造充气膜的方法。

9. 发明授权

US09363890B2 Circuit board and method of manufacturing same 有权
标题翻译：电路板及其制造方法
公开(公告)号：US09363890B2
公开(公告)日：2016-06-07
申请号：US13997883
申请日：2011-12-16
申请人： Kazuyuki Ohmori , Tatsuya Sunamoto
发明人： Kazuyuki Ohmori , Tatsuya Sunamoto
IPC分类号： H05K3/00 , H05K1/03 , B29C37/00 , B29C43/18 , H05K3/28 , B29C43/20 , H05K1/02
CPC分类号： H05K1/0245 , B29C37/0075 , B29C43/18 , B29C43/203 , H05K1/0237 , H05K1/0242 , H05K1/0296 , H05K1/0306 , H05K1/09 , H05K3/281 , H05K2201/0129 , H05K2201/0141 , H05K2203/068 , Y10T156/10
摘要： Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.
摘要翻译：提供一种制造电路板的方法，包括制备板结构体（11）并用覆盖膜（14）覆盖在板结构体（11）的最外层上的导体电路元件（13），其中热在将隔离材料（15）插入在覆盖膜（14）和热处理装置之间的同时进行处理。剥离材料（15）是从覆盖膜向加热装置依次形成选自超高分子量聚乙烯膜和聚四氟乙烯膜的低摩擦膜（16）的层叠体，第一铝箔（17），第一高密度聚乙烯膜（18a），第二高密度聚乙烯膜（18b）和第二铝箔（19）。第一高密度聚乙烯膜（18a）和第二高密度聚乙烯膜（18b）被定位成使得各个MD方向彼此垂直。

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