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热词
    • 2. 发明授权
    • Apparatus, method and system for thermal management of an electronic
system having semiconductor devices
    • 具有半导体器件的电子系统的热管理装置,方法和系统
    • US6058012A
    • 2000-05-02
    • US67071
    • 1998-04-27
    • Patrick R. CooperWilliam C. HallowellMark S. TracyCurtis ProglMinh H. Nguyen
    • Patrick R. CooperWilliam C. HallowellMark S. TracyCurtis ProglMinh H. Nguyen
    • G06F1/20H01L23/34H01L23/40H05K7/20
    • G06F1/203G06F1/206H01L23/34H01L23/4006H05K7/20727H01L2023/4043H01L2023/4062H01L2023/4068H01L2023/4087H01L2924/0002
    • A thermal management controller to regulate the operating temperature of high speed, high circuit density semiconductor dice in an electronic product. The thermal management controller monitors the temperature of a heat sink in thermal contact with the high speed, high circuit density semiconductor dice and also monitors the operational status of one or more specified devices which may increase the heat load within the electronic product. As the temperature of the heat sink increases and/or as specified devices increase the heat load in the electronic product, the thermal management controller will start cooling fans and/or increases the speed of the cooling fans to increase heat removal from the electronic product by forced convection. As the temperature of the heat sink decreases and/or as specified devices cease contributing to the heat load in the electronic product, the thermal management controller will decrease the speed of the cooling fans and/or turn off the cooling fans to decrease heat removal from the electronic product. If the temperature of the heat sink rises above a predetermined temperature, the thermal management structure will reduce the clock speed of the semiconductor dice. If the temperature of the heat sink rises above a predetermined maximum temperature, the thermal management structure will turn of the semiconductor dice.
    • 一种用于调节电子产品中高速,高电路密度半导体晶片的工作温度的热管理控制器。 热管理控制器监测与高速,高电路密度半导体管芯热接触的散热器的温度,并且还监视可增加电子产品内的热负荷的一个或多个指定装置的操作状态。 随着散热器的温度升高和/或如指定的装置增加电子产品中的热负荷,热管理控制器将启动冷却风扇和/或增加冷却风扇的速度以增加从电子产品的热量去除 强制对流 随着散热器的温度降低和/或如指定的设备停止对电子产品中的热负荷的贡献,热管理控制器将降低冷却风扇的速度和/或关闭冷却风扇以减少从 电子产品。 如果散热器的温度升高到预定温度以上,则热管理结构将降低半导体晶片的时钟速度。 如果散热器的温度升高到预定的最高温度以上,则热管理结构将转向半导体晶片。
    • 7. 发明授权
    • Drive carrier with pivoting handle
    • 带旋转手柄的传动架
    • US08582287B2
    • 2013-11-12
    • US13320736
    • 2009-06-19
    • Minh H. NguyenKelly K. SmithKapil Rao Ganta Papa Rao BalaAlan B. Doerr
    • Minh H. NguyenKelly K. SmithKapil Rao Ganta Papa Rao BalaAlan B. Doerr
    • H05K7/00H05K5/00
    • G11B33/124G06F1/187
    • A drive carrier comprises a base adapted to receive a drive, two opposing sides extending from the base with each side having first and second stand-off receiving apertures that each receives a stand-off from a surface on which the drive carrier is positioned. The carrier comprises a handle coupled to each side via a hinge. The handle has a stand-off receiving notch associated with each side and each stand-off receiving notch receives one of the stand-offs when the drive carrier is locked in place on the surface. Each notch applies insertion and removal forces against the received stand-off during insertion and removal of the carrier. The hinge defines a plane through the hinges and parallel to the base. The handle pivots downward toward the plane and base to lock the drive carrier to the surface. When the drive carrier is in a locked position, the handle rests above the plane.
    • 驱动器托架包括适于接纳驱动器的基座,从基部延伸的两个相对侧,每个侧面具有第一和第二间隔接收孔,每个接收孔从驱动载体定位在其上的表面接收。 载体包括通过铰链连接到每一侧的手柄。 手柄具有与每个侧面相关联的间隔接收槽口,并且当驱动承载件锁定在表面上的适当位置时,每个支承接收槽口接收一个支座。 在插入和移除载体时,每个切口对接收到的支架施加插入和移除力。 铰链限定通过铰链并平行于基座的平面。 手柄朝向平面和底座向下转动,以将驱动器托架锁定到表面。 当驱动器托架处于锁定位置时,手柄位于平面上方。
    • 9. 发明申请
    • Tamper-Evident Connector
    • 防篡改连接器
    • US20100081311A1
    • 2010-04-01
    • US12631056
    • 2009-12-04
    • Vincent NguyenChanh V. HuaMinh H. NguyenE.D. Neufeld
    • Vincent NguyenChanh V. HuaMinh H. NguyenE.D. Neufeld
    • H01R13/62
    • H01R13/6397H01R12/52H01R13/6275H01R24/62
    • Embodiments of a tamper-evident connector are disclosed which may optionally be used in a trusted computing environment. In an exemplary embodiment, a tamper-evident connection includes a mate-once engaging assembly for providing with a first component, the mate-once engaging assembly including a foldable portion. The tamper-evident connection also includes a receiving chamber for providing with a second component, the mate-once engaging assembly fitting in the receiving chamber to physically secure the first component to the second component, the foldable portion of the mate-once engaging assembly unfolding during removal of the mate-once engaging assembly from the receiving chamber to provide evidence of tampering when the first component has been removed from the second component. Optionally, the first component is a Trusted Platform Module (TPM) and the second component is a system board.
    • 公开了一种防篡改连接器的实施例,其可以可选地在可信计算环境中使用。 在示例性实施例中,防窃启连接包括用于提供第一部件的配合接合组件,该配合接合组件包括可折叠部分。 显窃启连接还包括用于提供第二部件的接收室,配合接合组件装配在接纳室中,以将第一部件物理地固定到第二部件上,一次接合组件的可折叠部分展开 在从接收室移除配合接合组件时,提供当第一部件已经从第二部件移除时的篡改的证据。 可选地,第一组件是可信平台模块(TPM),第二组件是系统板。
    • 10. 发明申请
    • Tamper-Evident Connector
    • 防篡改连接器
    • US20090029582A1
    • 2009-01-29
    • US11828319
    • 2007-07-25
    • Vincent NguyenChanh V. HuaMinh H. NguyenE.D. Neufeld
    • Vincent NguyenChanh V. HuaMinh H. NguyenE.D. Neufeld
    • H01R13/62
    • H01R13/6397H01R12/52H01R13/6275H01R24/62
    • Embodiments of a tamper-evident connector are disclosed which may optionally be used in a trusted computing environment. In an exemplary embodiment, a tamper-evident connection includes a mate-once engaging assembly for providing with a first component, the mate-once engaging assembly including a foldable portion. The tamper-evident connection also includes a receiving chamber for providing with a second component, the mate-once engaging assembly fitting in the receiving chamber to physically secure the first component to the second component, the foldable portion of the mate-once engaging assembly unfolding during removal of the mate-once engaging assembly from the receiving chamber to provide evidence of tampering when the first component has been removed from the second component. Optionally, the first component is a Trusted Platform Module (TPM) and the second component is a system board.
    • 公开了一种防篡改连接器的实施例,其可以可选地在可信计算环境中使用。 在示例性实施例中,防窃启连接包括用于提供第一部件的配合接合组件,该配合接合组件包括可折叠部分。 显窃启连接还包括用于提供第二部件的接收室,配合接合组件装配在接纳室中,以将第一部件物理地固定到第二部件上,一次接合组件的可折叠部分展开 在从接收室移除配合接合组件时,提供当第一部件已经从第二部件移除时的篡改的证据。 可选地,第一组件是可信平台模块(TPM),第二组件是系统板。