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1. 发明申请

US20070080354A1 Power package and fabrication method thereof 审中-公开
标题翻译：电源封装及其制造方法
公开(公告)号：US20070080354A1
公开(公告)日：2007-04-12
申请号：US11544046
申请日：2006-10-06
申请人： Ming-Yao Lin , Ming-Te Lin , Sheng-Pan Huang , Chia-Chang Kuo , Chiu-Ling Chen
发明人： Ming-Yao Lin , Ming-Te Lin , Sheng-Pan Huang , Chia-Chang Kuo , Chiu-Ling Chen
IPC分类号： H01L33/00
CPC分类号： H01L33/641 , H01L24/97 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48247 , H01L2924/12041 , H01L2224/48091 , H01L2924/00014
摘要： The present invention relates to a combined light emitting diode (LED) package structure and a fabricating method for fabricating the same. The combined LED package structure includes an LED chip, a conductive structure and an encapsulant. The encapsulant encapsulates the LED chip and a portion of the conductive structure. The conductive structure has a thick metal member and a thin metal member. The thick metal member is used for carrying the LED chip, provide heat absorbing and heat dissipating paths to the LED chip, the bottom and a portion of the lateral side thereof are exposed to the outside of the encapsulant to increase heat dissipating area. The thin metal member is electrically connected to the LED chip via at least two conductive leads which are extended to a region outside of the encapsulant to serve as outside electrodes of the LED package structure.
摘要翻译：本发明涉及一种组合发光二极管（LED）封装结构及其制造方法。组合的LED封装结构包括LED芯片，导电结构和密封剂。密封剂封装LED芯片和导电结构的一部分。导电结构具有厚金属构件和薄金属构件。厚金属构件用于承载LED芯片，为LED芯片提供吸热和散热路径，底部和其侧面的一部分暴露于密封剂的外部以增加散热面积。该薄金属构件经由至少两个导电引线电连接到LED芯片，该导电引线延伸到封装体外部的区域，以用作LED封装结构的外部电极。

2. 发明授权

US07589354B2 Light emitting diode package and process of making the same 有权
标题翻译：发光二极管封装和制造过程相同
公开(公告)号：US07589354B2
公开(公告)日：2009-09-15
申请号：US11194630
申请日：2005-08-02
申请人： Ming-Te Lin , Sheng-Pan Huang , Chia-Tai Kuo , Chiu-Ling Chen , Ya-Hui Chiang , Ming-Yao Lin
发明人： Ming-Te Lin , Sheng-Pan Huang , Chia-Tai Kuo , Chiu-Ling Chen , Ya-Hui Chiang , Ming-Yao Lin
IPC分类号： H01L27/15 , H01L29/267 , H01L31/12 , H01L33/00
CPC分类号： H01L33/60 , H01L25/0753 , H01L33/483 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73265 , H01L2924/3025 , H01L2924/00 , H01L2924/00014
摘要： A light emitting diode (LED) package includes at least one LED chip, a carrier, a light reflection element and at least one outside connection electrode. The LED chip is disposed on the carrier and a conductive line or a flip chip method is used to connect the electrodes of the LED chip to the external connection electrodes. A transparent material is used for fixing the light reflection element and carrier, and forming a lens.
摘要翻译：发光二极管（LED）封装包括至少一个LED芯片，载体，光反射元件和至少一个外部连接电极。 LED芯片设置在载体上，并且使用导线或倒装芯片方法将LED芯片的电极连接到外部连接电极。透明材料用于固定光反射元件和载体，并形成透镜。

3. 发明申请

US20060145173A1 Light emitting diode package and process of making the same 有权
公开(公告)号：US20060145173A1
公开(公告)日：2006-07-06
申请号：US11194630
申请日：2005-08-02
申请人： Ming-Te Lin , Sheng-Pan Huang , Chia-Tai Kuo , Chiu-Ling Chen , Ya-Hui Chiang , Ming-Yao Lin
发明人： Ming-Te Lin , Sheng-Pan Huang , Chia-Tai Kuo , Chiu-Ling Chen , Ya-Hui Chiang , Ming-Yao Lin
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L25/0753 , H01L33/483 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73265 , H01L2924/3025 , H01L2924/00 , H01L2924/00014
摘要： A light emitting diode (LED) package includes at least one LED chip, a carrier, a light reflection element and at least one outside connection electrode. The LED chip is disposed on the carrier and a conductive line or a flip chip method is used to connect the electrodes of the LED chip to the external connection electrodes. A transparent material is used for fixing the light reflection element and carrier, and forming a lens.

4. 发明申请

US20080149951A1 Light emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：US20080149951A1
公开(公告)日：2008-06-26
申请号：US11643786
申请日：2006-12-22
申请人： Ming-Te Lin , Hsi-Hsuan Yen , Ming-Yao Lin , Wen-Yung Yeh , Chia-Chang Kuo , Sheng-Pan Huang
发明人： Ming-Te Lin , Hsi-Hsuan Yen , Ming-Yao Lin , Wen-Yung Yeh , Chia-Chang Kuo , Sheng-Pan Huang
IPC分类号： H01L33/00 , H01L29/205
CPC分类号： H01L25/167 , H01L25/0753 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/09701 , H01L2924/3011 , H01L2924/00014
摘要： A light emitting device including a carrying element having two electric conductors connectable to a power source, a light emitting element disposed on the carrying element and electrically connected to the two electric conductors, and at least one correction element electrically connected to the light emitting element, wherein the light emitting element is adapted to provide a light source upon connection of the two electric conductors with the power source, and the at least one correction element allows the light emitting element to have functions of temperature compensation, voltage correction, or surge absorption.
摘要翻译：一种发光器件，包括具有可连接到电源的两个电导体的携带元件，设置在所述承载元件上并电连接到所述两个电导体的发光元件以及电连接到所述发光元件的至少一个校正元件，其中所述发光元件适于在所述两个电导体与所述电源连接时提供光源，并且所述至少一个校正元件允许所述发光元件具有温度补偿，电压校正或浪涌吸收的功能。

5. 发明授权

US08017964B2 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US08017964B2
公开(公告)日：2011-09-13
申请号：US12487651
申请日：2009-06-19
申请人： Ming-Te Lin , Ming-Yao Lin , Chia-Chang Kuo , Sheng-Pan Huang , Wen-Yung Yeh
发明人： Ming-Te Lin , Ming-Yao Lin , Chia-Chang Kuo , Sheng-Pan Huang , Wen-Yung Yeh
IPC分类号： H01L29/22 , H01L29/227
CPC分类号： H01L33/62 , H01L33/60 , H01L33/642 , H01L2224/16 , H01L2224/48091 , H01L2924/01068 , H01L2924/01079 , H01L2924/00014
摘要： A light emitting device includes a light emitting element having at least two electrodes disposed at the side of the light output surface thereof; and a base member having a recess and lead portions corresponding to the electrodes, the light emitting element being mounted on the base member and received in the recess, wherein the light output surface faces toward opening of the recess that becomes smaller while approaching the light output surface, and the electrodes are respectively in electrical connection with the lead portions that extend from the connection positions to outer edge of the base member for power connection, and a light reflecting portion is disposed in the recess adjacent to the light output surface such that the light emitted from the light emitting element can be reflected to walls of the recess to form a substantially collimated light beam so as to improve light efficiency.
摘要翻译：发光装置包括：发光元件，其具有设置在其光输出表面侧的至少两个电极; 以及具有凹部的基座部件和与电极对应的引线部，所述发光元件安装在所述基座部件上并被容纳在所述凹部中，其中，所述光输出面朝向所述凹部的开口，所述凹部在接近所述光输出时变小表面，并且电极分别与从基座的连接位置延伸到外边缘的引线部分电连接，用于电力连接，并且光反射部分设置在与光输出表面相邻的凹部中，使得从发光元件发射的光可以被反射到凹部的壁以形成基本上准直的光束，以便提高光效率。

6. 发明申请

US20090250717A1 LIGHT EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20090250717A1
公开(公告)日：2009-10-08
申请号：US12487651
申请日：2009-06-19
申请人： Ming-Te Lin , Ming-Yao Lin , Chia-Chang Kuo , Sheng-Pan Huang , Wen-Yung Yeh
发明人： Ming-Te Lin , Ming-Yao Lin , Chia-Chang Kuo , Sheng-Pan Huang , Wen-Yung Yeh
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/60 , H01L33/642 , H01L2224/16 , H01L2224/48091 , H01L2924/01068 , H01L2924/01079 , H01L2924/00014
摘要： A light emitting device includes a light emitting element having at least two electrodes disposed at the side of the light output surface thereof, and a base member having a recess and lead portions corresponding to the electrodes, the light emitting element being mounted on the base member and received in the recess, wherein the light output surface faces toward opening of the recess that becomes smaller while approaching the light output surface, and the electrodes are respectively in electrical connection with the lead portions that extend from the connection positions to outer edge of the base member for power connection, and a light reflecting portion is disposed in the recess adjacent to the light output surface such that the light emitted from the light emitting element can be reflected to walls of the recess to form a substantially collimated light beam so as to improve light efficiency.
摘要翻译：发光装置包括：发光元件，其具有设置在其光输出表面侧的至少两个电极;以及基座部件，具有凹部和与电极对应的引线部分，发光元件安装在基座部件上并且容纳在凹部中，其中光输出表面面向凹口的开口，其在接近光输出表面时变小，并且电极分别与从连接位置延伸到外部边缘的引线部分电连接用于电源连接的基座构件，并且光反射部分设置在与光输出表面相邻的凹部中，使得从发光元件发射的光可以被反射到凹部的壁以形成基本上准直的光束，从而提高光效。

7. 发明申请

US20070069219A1 Light emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：US20070069219A1
公开(公告)日：2007-03-29
申请号：US11429235
申请日：2006-05-08
申请人： Ming-Te Lin , Ming-Yao Lin , Chia-Chang Kuo , Sheng-Pan Huang , Wen-Yung Yeh
发明人： Ming-Te Lin , Ming-Yao Lin , Chia-Chang Kuo , Sheng-Pan Huang , Wen-Yung Yeh
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/60 , H01L33/642 , H01L2224/16 , H01L2224/48091 , H01L2924/01068 , H01L2924/01079 , H01L2924/00014
摘要： A light emitting device is proposed, which emits light while connected to the power. The light emitting device includes a light emitting element having at least two electrodes disposed at the side of the light output surface thereof; and a base member having a recess and lead portions corresponding to the electrodes, the light emitting element being mounted on the base member and received in the recess, wherein the light output surface faces toward opening of the recess that becomes smaller while approaching the light output surface, and the electrodes are respectively in electrical connection with the lead portions that extend from the connection positions to outer edge of the base member for power connection. The light emitting device of the present invention has advantages of short current path, low series thermal resistance and low cost. In addition, the depth of the recess can further be increased to improve light collecting efficiency.
摘要翻译：提出了一种发光装置，其在连接到电源时发光。发光装置包括发光元件，其具有设置在其光输出表面侧的至少两个电极; 以及具有凹部的基座部件和与电极对应的引线部，所述发光元件安装在所述基座部件上并被容纳在所述凹部中，其中，所述光输出面朝向所述凹部的开口，所述凹部在接近所述光输出时变小表面，并且电极分别与从基座的连接位置延伸到外缘的引线部分电连接以进行电力连接。本发明的发光器件具有电流路短，串联热阻低，成本低的优点。此外，可以进一步增加凹部的深度，以提高聚光效率。

8. 发明授权

US08279621B2 AC—LED system in single chip with three metal contacts 有权
标题翻译： AC-LED系统采用单芯片三金属触点
公开(公告)号：US08279621B2
公开(公告)日：2012-10-02
申请号：US13083142
申请日：2011-04-08
申请人： Ming-Te Lin , Wen-Yung Yeh , Chia-Chang Kuo , Hsi-Hsuan Yen , Sheng-Pan Huang
发明人： Ming-Te Lin , Wen-Yung Yeh , Chia-Chang Kuo , Hsi-Hsuan Yen , Sheng-Pan Huang
IPC分类号： G11C11/00
CPC分类号： H05B33/0803 , H05B33/0809 , H05B33/0821
摘要： A plurality of AC_LED units are coupled and disposed on a single chip to form an AC_LED system in single chip. Alternatively, an AC LED system in single chip with four metal contacts is also disclosed.
摘要翻译：多个AC_LED单元耦合并设置在单个芯片上以在单芯片中形成AC_LED系统。或者，还公开了具有四个金属触点的单芯片中的AC LED系统。

9. 发明申请

US20070091641A1 Backlight structure 审中-公开
标题翻译：背光结构
公开(公告)号：US20070091641A1
公开(公告)日：2007-04-26
申请号：US11583944
申请日：2006-10-20
申请人： Ming-Te Lin , Sheng-Pan Huang , Shang-Ping Ying , Ya-Hui Chiang , Ming-Yao Lin
发明人： Ming-Te Lin , Sheng-Pan Huang , Shang-Ping Ying , Ya-Hui Chiang , Ming-Yao Lin
IPC分类号： F21V7/04
CPC分类号： G02F1/133605 , G02B6/0031 , G02B6/0046 , G02B6/0078 , G02F1/133603 , G02F1/133609
摘要： A backlight structure is disclosed, which is constituted of a series of backlight devices connecting with one another to form a large-scale backlight area, the backlight device at least being composed of an emitting portion and a light-guiding portion, wherein the emitting portion provides a light source, mixes the light of the light source and provides the mixed light into the light-guiding portion, which then guides the mixed light out. The emitting portion connects with the light-guiding portion to form a fault structure for connecting with another light-guiding portion, thereby forming a large-scale backlight structure by connecting a sequence of the light-guiding portions using the fault structures without size constraints.
摘要翻译：公开了一种背光结构，其由相互连接以形成大规模背光区域的一系列背光装置构成，所述背光装置至少由发光部分和导光部分组成，其中所述发光部分提供光源，混合光源的光，并将混合光提供到导光部分，然后引导混合光。发光部分与导光部分连接以形成用于与另一个导光部分连接的故障结构，从而通过使用故障结构连接一系列导光部分而没有尺寸限制来形成大规模的背光结构。

10. 发明授权

US07948770B2 AC—LED system in single chip with three metal contacts 有权
标题翻译： AC-LED系统采用单芯片三金属触点
公开(公告)号：US07948770B2
公开(公告)日：2011-05-24
申请号：US11608786
申请日：2006-12-08
申请人： Ming-Te Lin , Wen-Yung Yeh , Chia-Chang Kuo , Hsi-Hsuan Yen , Sheng-Pan Huang
发明人： Ming-Te Lin , Wen-Yung Yeh , Chia-Chang Kuo , Hsi-Hsuan Yen , Sheng-Pan Huang
IPC分类号： G11C11/00
CPC分类号： H05B33/0803 , H05B33/0809 , H05B33/0821
摘要： A plurality of AC_LED units are coupled and disposed on a single chip to form an AC_LED system in single chip with three metal contacts to be driven by three-phase voltage sources. Alternatively, an AC_LED system in single chip with four metal contacts is also disclosed to be driven by four-phase voltage sources.
摘要翻译：多个AC_LED单元耦合并设置在单个芯片上以形成具有三个金属触点的单芯片中的AC_LED系统，由三相电压源驱动。或者，也公开了具有四个金属触点的单芯片中的AC_LED系统由四相电压源驱动。

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