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1. 发明授权

US08591067B2 Light source device 有权
标题翻译：光源装置
公开(公告)号：US08591067B2
公开(公告)日：2013-11-26
申请号：US12944698
申请日：2010-11-11
申请人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai , Po-Cheng Yang
发明人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai , Po-Cheng Yang
IPC分类号： F21V29/00 , B60Q1/06
CPC分类号： F21V29/83 , F21K9/23 , F21V3/00 , F21V29/506 , F21V29/673 , F21W2121/00 , F21Y2115/10
摘要： A light source device having a good heat dissipation capability is disclosed, in which heat generated by a light emitting device is conducted to a base fabricated by a porous material through a heat conducting mask or a heat conducting pipe. Due to a large area contact between the heat conducting mask or the heat conducting pipe and the base, the heat can be evenly conducted to the base, so that the base can absorb the heat and dissipate the heat to external, so as to improve a heat dissipation efficiency. Moreover, in the light source device of the disclosure, heat exchange of the light emitting device can be directly carried on through air convection, so that the heat generated by the light emitting device can be taken away from the light source device through heat exchange of cool air.
摘要翻译：公开了一种具有良好的散热能力的光源装置，其中由发光装置产生的热量通过导热掩模或导热管被传导到由多孔材料制成的基底。由于导热罩或导热管与基座之间的大面积接触，热量可以均匀地传导到基座，使得基座可以吸收热量并将热量散发到外部，从而改善散热效率。此外，在本公开的光源装置中，可以通过空气对流直接进行发光装置的热交换，使得由发光装置产生的热量可以通过热交换器冷空气。

2. 发明申请

US20120032588A1 LIGHT SOURCE DEVICE 有权
标题翻译：光源设备
公开(公告)号：US20120032588A1
公开(公告)日：2012-02-09
申请号：US12944698
申请日：2010-11-11
申请人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai , Po-Cheng Yang
发明人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai , Po-Cheng Yang
IPC分类号： F21V29/00 , F21V23/00
CPC分类号： F21V29/83 , F21K9/23 , F21V3/00 , F21V29/506 , F21V29/673 , F21W2121/00 , F21Y2115/10
摘要： A light source device having a good heat dissipation capability is disclosed, in which heat generated by a light emitting device is conducted to a base fabricated by a porous material through a heat conducting mask or a heat conducting pipe. Due to a large area contact between the heat conducting mask or the heat conducting pipe and the base, the heat can be evenly conducted to the base, so that the base can absorb the heat and dissipate the heat to external, so as to improve a heat dissipation efficiency. Moreover, in the light source device of the disclosure, heat exchange of the light emitting device can be directly carried on through air convection, so that the heat generated by the light emitting device can be taken away from the light source device through heat exchange of cool air.
摘要翻译：公开了一种具有良好的散热能力的光源装置，其中由发光装置产生的热量通过导热掩模或导热管被传导到由多孔材料制成的基底。由于导热罩或导热管与基座之间的大面积接触，热量可以均匀地传导到基座，使得基座可以吸收热量并将热量散发到外部，从而改善散热效率。此外，在本公开的光源装置中，可以通过空气对流直接进行发光装置的热交换，使得由发光装置产生的热量可以通过热交换器冷空气。

3. 发明申请

US20110057225A1 Light Emitting Device 有权
标题翻译：发光装置
公开(公告)号：US20110057225A1
公开(公告)日：2011-03-10
申请号：US12949192
申请日：2010-11-18
申请人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
发明人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , H01L33/483 , H01L33/507 , H01L33/54 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/00014
摘要： A light emitting device includes a leadframe, a light emitting unit, a transparent encapsulant, and a fluorescent colloid layer. The light emitting unit is disposed on the leadframe. The transparent encapsulant covers the light emitting unit, wherein the transparent encapsulant has a concave on which at least one reflective surface is disposed. The fluorescent colloid layer is disposed outside the transparent encapsulant, wherein a chamber is formed between the fluorescent colloid layer and the transparent encapsulant. The light generated by the light emitting unit is reflected by the reflective surface and guided to a side wall of the fluorescent colloid layer.
摘要翻译：发光装置包括引线框，发光单元，透明密封剂和荧光胶体层。发光单元设置在引线框上。所述透明密封剂覆盖所述发光单元，其中所述透明密封剂具有凹部，至少一个反射表面设置在所述凹部上。荧光胶体层设置在透明密封剂的外部，其中在荧光胶体层和透明密封剂之间形成腔室。由发光单元产生的光被反射表面反射并被引导到荧光胶体层的侧壁。

4. 发明申请

US20090242919A1 LIGHT EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20090242919A1
公开(公告)日：2009-10-01
申请号：US12408979
申请日：2009-03-23
申请人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
发明人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/483 , H01L33/507 , H01L33/54 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/00014
摘要： A light emitting device includes a leadframe, a light emitting unit, a transparent encapsulant, and a fluorescent colloid layer. The light emitting unit is disposed on the leadframe. The transparent encapsulant covers the light emitting unit, wherein the transparent encapsulant has a concave on which at least one reflective surface is disposed. The fluorescent colloid layer is disposed outside the transparent encapsulant, wherein a chamber is formed between the fluorescent colloid layer and the transparent encapsulant. The light generated by the light emitting unit is reflected by the reflective surface and guided to a side wall of the fluorescent colloid layer.
摘要翻译：发光装置包括引线框，发光单元，透明密封剂和荧光胶体层。发光单元设置在引线框上。所述透明密封剂覆盖所述发光单元，其中所述透明密封剂具有凹部，至少一个反射表面设置在所述凹部上。荧光胶体层设置在透明密封剂的外部，其中在荧光胶体层和透明密封剂之间形成腔室。由发光单元产生的光被反射表面反射并被引导到荧光胶体层的侧壁。

5. 发明授权

US08497560B2 LED package and method of assembling the same 有权
标题翻译： LED封装及其组装方法
公开(公告)号：US08497560B2
公开(公告)日：2013-07-30
申请号：US12714371
申请日：2010-02-26
申请人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
发明人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
IPC分类号： H01L31/0203
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2924/00014
摘要： An LED package is provided. The LED package includes a carrier, an LED chip, a conductive structure, a first encapsulant, a lens and a heat sink. The carrier is cup shaped and comprises a bottom portion and a lateral wall. The LED chip is received in the carrier and disposed on the bottom portion. The conductive structure is electrically connected to the LED chip. The first encapsulant is received in the carrier and fixing the carrier and the conductive structure. The lens is corresponding to the LED chip. The carrier is embedded in the heat sink, and heat generated by the LED chip is transmitted to the heat sink via the bottom portion and the lateral wall of the carrier.
摘要翻译：提供LED封装。 LED封装包括载体，LED芯片，导电结构，第一密封剂，透镜和散热器。托架是杯形的并且包括底部和侧壁。 LED芯片被容纳在载体中并且设置在底部。导电结构电连接到LED芯片。第一密封剂被容纳在载体中并固定载体和导电结构。镜头对应于LED芯片。载体被嵌入散热器中，并且由LED芯片产生的热量经由载体的底部和侧壁传递到散热器。

6. 发明授权

US08125126B2 Multi-facet light emitting lamp 有权
标题翻译：多面发光灯
公开(公告)号：US08125126B2
公开(公告)日：2012-02-28
申请号：US12970961
申请日：2010-12-17
申请人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
发明人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
IPC分类号： H01J1/02
CPC分类号： F21V23/0435 , F21K9/232 , F21V29/83 , F21Y2107/40 , F21Y2115/10
摘要： A multi-facet light emitting lamp including a first light source plate, a second light source plate, and a plurality of airflow channels is provided. The first light source plate has at least one first connecting terminal. The second light source plate has at least one second connecting terminal. The first connecting terminal is connected with the second connecting terminal, and an inner space is formed between the first light source plate and the second light source plate. The inner space and a space outside the multi-facet light emitting lamp are connected by the airflow channels.
摘要翻译：提供了包括第一光源板，第二光源板和多个气流通道的多面发光灯。第一光源板具有至少一个第一连接端子。第二光源板具有至少一个第二连接端子。第一连接端子与第二连接端子连接，并且在第一光源板和第二光源板之间形成内部空间。内部空间和多面发光灯外部的空间通过气流通道连接。

7. 发明申请

US20110284879A1 LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING DIODE MODULE 有权
标题翻译：发光二极管封装和发光二极管模块
公开(公告)号：US20110284879A1
公开(公告)日：2011-11-24
申请号：US12980358
申请日：2010-12-29
申请人： Ming-Te Lin , Ming-Yao Lin , Sheng-Chieh Tai , Chih-Hsuan Liu , Kuang-Yu Tai
发明人： Ming-Te Lin , Ming-Yao Lin , Sheng-Chieh Tai , Chih-Hsuan Liu , Kuang-Yu Tai
IPC分类号： H01L33/08 , H01L33/60
CPC分类号： F21V3/00 , F21K9/232 , F21V29/67 , F21V29/677 , F21V29/70 , F21Y2107/40 , F21Y2115/10 , H01L25/0753 , H01L33/58 , H01L33/60 , H01L2224/48091 , H01L2924/00014
摘要： A light emitting diode (LED) package comprising a carrier, an LED chip, a lens, and a phosphor layer is provided. The LED chip disposed on the carrier. The lens encapsulating the LED chip has a plurality of fins surrounding the LED chip and a conical indentation. The fins extending backward the LED chip radially. Each of the fins has at least one light-emitting surface and at least one reflection surface adjoining the light-emitting surface. A bottom surface of the conical indentation is served as an total reflection surface. The phosphor layer is disposed on the light-emitting surfaces of the lens. An LED package and an LED module are also provided.
摘要翻译：提供了包括载体，LED芯片，透镜和荧光体层的发光二极管（LED）封装。设置在载体上的LED芯片。封装LED芯片的透镜具有围绕LED芯片的多个翅片和圆锥形凹口。翅片径向向后延伸LED芯片。每个翅片具有至少一个发光表面和邻近发光表面的至少一个反射表面。锥形凹陷的底面作为全反射面。荧光体层设置在透镜的发光面上。还提供LED封装和LED模块。

8. 发明申请

US20080063738A1 Light-emitting diode packaging apparatus, mold base and supporting member thereof 有权
标题翻译：发光二极管封装装置，模具基座及其支撑部件
公开(公告)号：US20080063738A1
公开(公告)日：2008-03-13
申请号：US11802883
申请日：2007-05-25
申请人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
发明人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
IPC分类号： B29C41/20
CPC分类号： B29C41/20 , B29L2011/0016
摘要： A light-emitting diode packaging apparatus is disclosed, which is used for a supporting member having a plurality of supporting pieces to be inserted therein for the subsequent molding and packaging operations, including a mold base for a plurality of supporting pieces of a supporting member to be inserted therein, and a controller for inserting into the mold base and positioning the supporting member. This invention features forming a positioning foot at the periphery of at least one electrode pin of each of the supporting pieces, and also forming a corresponding first positioning aperture on the mold cup of the mold base for the positioning of the supporting pieces. The present invention also provides a mold base and supporting pieces for use with the light-emitting diode packaging apparatus.
摘要翻译：公开了一种发光二极管封装装置，其用于具有插入其中的多个支撑件用于随后的模制和包装操作的支撑构件，包括用于支撑构件的多个支撑件的模座插入其中，以及控制器，用于插入到模具基座中并定位支撑构件。本发明的特征在于，在每个支撑件的至少一个电极销的周边处形成定位脚，并且还在模座的模具杯上形成相应的第一定位孔，用于支撑件的定位。本发明还提供了一种用于发光二极管封装装置的模具基座和支撑件。

9. 发明申请

US20070222381A1 LIGHT EMITTING DEVICE AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US20070222381A1
公开(公告)日：2007-09-27
申请号：US11468333
申请日：2006-08-30
申请人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai , Ming-Hung Chen
发明人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai , Ming-Hung Chen
IPC分类号： H01J1/62 , H01J63/04
CPC分类号： H01L33/62 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A light emitting device and the method for producing the same are disclosed. The light emitting device has at least a light emitting unit with a first electrode and a second electrode for generating a light source when powered on, a conductive element electrically coupled to the first electrode of the light emitting unit and a substrate having a carrier portion for carrying the light emitting unit and a heat dissipating portion extending from the carrier portion and electrically coupled to the second electrode of the light emitting unit, in which the conductive element is disposed on a side of a planar face of the heat dissipating portion, thereby allowing large contact area to be established between the heat dissipating portion and a sub-heat-dissipating system or air so as to achieve good heat dissipation.
摘要翻译：公开了一种发光器件及其制造方法。发光器件至少具有发光单元，其具有第一电极和用于在通电时产生光源的第二电极，电耦合到发光单元的第一电极的导电元件和具有用于携带发光单元和从载体部分延伸并电耦合到发光单元的第二电极的散热部分，其中导电元件设置在散热部分的平面的一侧，从而允许在散热部和副散热系统或空气之间建立大的接触面积，以实现良好的散热。

10. 发明授权

US07775784B2 Light-emitting diode packaging apparatus, mold base and supporting member thereof 有权
标题翻译：发光二极管封装装置，模具基座及其支撑部件
公开(公告)号：US07775784B2
公开(公告)日：2010-08-17
申请号：US11802883
申请日：2007-05-25
申请人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
发明人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
IPC分类号： H01L21/56
CPC分类号： B29C41/20 , B29L2011/0016
摘要： A light-emitting diode packaging apparatus is disclosed, which is used for a supporting member having a plurality of supporting pieces to be inserted therein for the subsequent molding and packaging operations, including a mold base for a plurality of supporting pieces of a supporting member to be inserted therein, and a controller for inserting into the mold base and positioning the supporting member. This invention features forming a positioning foot at the periphery of at least one electrode pin of each of the supporting pieces, and also forming a corresponding first positioning aperture on the mold cup of the mold base for the positioning of the supporting pieces. The present invention also provides a mold base and supporting pieces for use with the light-emitting diode packaging apparatus.
摘要翻译：公开了一种发光二极管封装装置，其用于具有插入其中的多个支撑件用于随后的模制和包装操作的支撑构件，包括用于支撑构件的多个支撑件的模座插入其中，以及控制器，用于插入到模具基座中并定位支撑构件。本发明的特征在于，在每个支撑件的至少一个电极销的周边处形成定位脚，并且还在模座的模具杯上形成相应的第一定位孔，用于支撑件的定位。本发明还提供了一种用于发光二极管封装装置的模具基座和支撑件。

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