专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20130292831A1 Methods and Apparatus for Package on Package Devices 有权
公开(公告)号：US20130292831A1
公开(公告)日：2013-11-07
申请号：US13463667
申请日：2012-05-03
申请人： Ming-Kai Liu , Shih-Wei Liang , Hsien-Wei Chen , Kai-Chiang Wu
发明人： Ming-Kai Liu , Shih-Wei Liang , Hsien-Wei Chen , Kai-Chiang Wu
IPC分类号： H01L23/52 , H01L23/488 , H01L21/50
CPC分类号： H01L24/17 , H01L21/50 , H01L23/488 , H01L23/49816 , H01L23/49827 , H01L23/52 , H01L24/13 , H01L24/15 , H01L24/16 , H01L24/73 , H01L24/81 , H01L25/105 , H01L25/50 , H01L2224/13101 , H01L2224/16225 , H01L2224/16237 , H01L2224/1703 , H01L2224/17519 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81986 , H01L2225/0651 , H01L2225/1023 , H01L2225/1058 , H01L2225/1082 , H01L2924/00011 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/15331 , H01L2924/15787 , H01L2924/181 , H01L2924/18161 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/81805
摘要： Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device is formed by connecting a top package and a bottom package together using a plurality of PoP connectors on the bottom package connected to corresponding connectors of the top package. The PoP device further comprises a plurality of dummy connectors contained in the bottom package and not connected to any corresponding connector in the top package.

2. 发明授权

US08901730B2 Methods and apparatus for package on package devices 有权
标题翻译：封装器件封装的方法和装置
公开(公告)号：US08901730B2
公开(公告)日：2014-12-02
申请号：US13463667
申请日：2012-05-03
申请人： Ming-Kai Liu , Shih-Wei Liang , Hsien-Wei Chen , Kai-Chiang Wu
发明人： Ming-Kai Liu , Shih-Wei Liang , Hsien-Wei Chen , Kai-Chiang Wu
IPC分类号： H01L23/48
CPC分类号： H01L24/17 , H01L21/50 , H01L23/488 , H01L23/49816 , H01L23/49827 , H01L23/52 , H01L24/13 , H01L24/15 , H01L24/16 , H01L24/73 , H01L24/81 , H01L25/105 , H01L25/50 , H01L2224/13101 , H01L2224/16225 , H01L2224/16237 , H01L2224/1703 , H01L2224/17519 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81986 , H01L2225/0651 , H01L2225/1023 , H01L2225/1058 , H01L2225/1082 , H01L2924/00011 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/15331 , H01L2924/15787 , H01L2924/181 , H01L2924/18161 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/81805
摘要： Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device is formed by connecting a top package and a bottom package together using a plurality of PoP connectors on the bottom package connected to corresponding connectors of the top package. The PoP device further comprises a plurality of dummy connectors contained in the bottom package and not connected to any corresponding connector in the top package.
摘要翻译：封装封装（PoP）器件和封装半导体管芯的方法被公开。 PoP设备通过使用顶部封装的相应连接器上的底部封装上的多个PoP连接器连接顶部封装和底部封装而形成。 PoP设备还包括多个虚拟连接器，其包含在底部封装中并且未连接到顶部封装中的任何相应的连接器。

3. 发明申请

US20130292830A1 Interposer Having a Defined Through Via Pattern 有权
标题翻译：具有通过图案定义的插值器
公开(公告)号：US20130292830A1
公开(公告)日：2013-11-07
申请号：US13463474
申请日：2012-05-03
申请人： Shih-Wei Liang , Kai-Chiang Wu , Ming-Kai Liu , Chia-Chun Miao , Chun-Lin Lu
发明人： Shih-Wei Liang , Kai-Chiang Wu , Ming-Kai Liu , Chia-Chun Miao , Chun-Lin Lu
IPC分类号： H01L23/485 , H05K1/11 , G06F17/50
CPC分类号： H01L23/485 , G06F17/5068 , H01L21/76898 , H01L23/147 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L2224/16225 , H01L2924/15311 , H05K1/0271 , H05K1/115 , H05K2201/068 , H05K2201/09781 , H05K2201/10378
摘要： A structure includes a substrate having a plurality of balls, a semiconductor chip, and an interposer electrically connecting the substrate and the semiconductor chip. The interposer includes a first side, a second side opposite the first side, at least one first exclusion zone extending through the interposer above each ball of the plurality of balls, at least one active through via extending from the first side of the interposer to the second side of the interposer, wherein the at least one active through via is formed outside the at least one first exclusion zone and wherein no active through vias are formed within the at least one first exclusion zone, and at least one dummy through via extending from the first side of the interposer to the second side of the interposer, wherein the at least one dummy through via is formed within the at least one first exclusion zone.
摘要翻译：一种结构包括具有多个球的衬底，半导体芯片和电连接衬底和半导体芯片的插入器。所述插入器包括第一侧，与所述第一侧相对的第二侧，至少一个第一排除区域，所述至少一个第一排除区域延伸穿过所述多个球的每个球上方的所述插入器，至少一个主动通孔，其从所述插入件的第一侧延伸到其中所述至少一个活性通孔形成在所述至少一个第一排除区域的外部，并且其中在所述至少一个第一排除区域内没有形成活性通孔，以及至少一个虚拟通孔，所述插入器的第一侧到所述插入件的第二侧，其中所述至少一个虚拟通孔形成在所述至少一个第一排除区域内。

4. 发明授权

US08664768B2 Interposer having a defined through via pattern 有权
标题翻译：内插器具有定义的通孔图案
公开(公告)号：US08664768B2
公开(公告)日：2014-03-04
申请号：US13463474
申请日：2012-05-03
申请人： Shih-Wei Liang , Kai-Chiang Wu , Ming-Kai Liu , Chia-Chun Miao , Chun-Lin Lu
发明人： Shih-Wei Liang , Kai-Chiang Wu , Ming-Kai Liu , Chia-Chun Miao , Chun-Lin Lu
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/053 , H01L23/12
CPC分类号： H01L23/485 , G06F17/5068 , H01L21/76898 , H01L23/147 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L2224/16225 , H01L2924/15311 , H05K1/0271 , H05K1/115 , H05K2201/068 , H05K2201/09781 , H05K2201/10378
摘要： A structure includes a substrate having a plurality of balls, a semiconductor chip, and an interposer electrically connecting the substrate and the semiconductor chip. The interposer includes a first side, a second side opposite the first side, at least one first exclusion zone extending through the interposer above each ball of the plurality of balls, at least one active through via extending from the first side of the interposer to the second side of the interposer, wherein the at least one active through via is formed outside the at least one first exclusion zone and wherein no active through vias are formed within the at least one first exclusion zone, and at least one dummy through via extending from the first side of the interposer to the second side of the interposer, wherein the at least one dummy through via is formed within the at least one first exclusion zone.
摘要翻译：一种结构包括具有多个球的衬底，半导体芯片和电连接衬底和半导体芯片的插入器。所述插入器包括第一侧，与所述第一侧相对的第二侧，至少一个第一排除区域，所述至少一个第一排除区域延伸穿过所述多个球的每个球上方的所述插入器，至少一个主动通孔，其从所述插入件的第一侧延伸到其中所述至少一个活性通孔形成在所述至少一个第一排除区域的外部，并且其中在所述至少一个第一排除区域内没有形成活性通孔，以及至少一个虚拟通孔，所述插入器的第一侧到所述插入件的第二侧，其中所述至少一个虚拟通孔形成在所述至少一个第一排除区域内。

5. 发明授权

US08557626B2 Image sensor devices and methods for manufacturing the same 有权
标题翻译：图像传感器装置及其制造方法
公开(公告)号：US08557626B2
公开(公告)日：2013-10-15
申请号：US12794257
申请日：2010-06-04
申请人： Ming-Kai Liu , Tzu-Wei Huang , Jui-Hung Chang , Chia-Hui Huang , Teng-Sheng Chen
发明人： Ming-Kai Liu , Tzu-Wei Huang , Jui-Hung Chang , Chia-Hui Huang , Teng-Sheng Chen
IPC分类号： H01L31/0232 , H01L31/0236
CPC分类号： H01L31/0232 , H01L27/14623 , H01L27/14627 , H01L27/14685 , H01L31/0216 , H01L31/02164 , H01L31/02165
摘要： Disclosed is a method for forming an image sensor device. First, a lens is provided, and a first sacrificial element is then formed on the lens. Subsequently, an electromagnetic interference layer is formed on the lens and the first sacrificial element, and the first sacrificial element and the electromagnetic interference layer thereon are removed to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens. A second sacrificial element is formed in the opening to cover a center region of the selected portion of the lens, while a peripheral region of the selected portion of the lens remains exposed. Next, a light-shielding layer is formed on the electromagnetic interference pattern, the second sacrificial element, and the peripheral region of the selected portion of the lens. Thereafter, the second sacrificial element and the light-shielding pattern thereon are removed to expose the center region of the selected portion of the lens as a light transmitting region.
摘要翻译：公开了一种用于形成图像传感器装置的方法。首先，提供透镜，然后在透镜上形成第一牺牲元件。随后，在透镜和第一牺牲元件上形成电磁干涉层，并且去除其上的第一牺牲元件和电磁干涉层，以形成具有暴露透镜的选定部分的开口的电磁干涉图案。第二牺牲元件形成在开口中以覆盖透镜的所选部分的中心区域，而透镜的选定部分的周边区域保持暴露。接下来，在电磁干涉图案，第二牺牲元件和透镜的选定部分的周边区域上形成遮光层。此后，去除第二牺牲元件和其上的遮光图案以将透镜的选定部分的中心区域作为透光区域。

6. 发明申请

US20110298073A1 IMAGE SENSOR DEVICES AND METHODS FOR MANUFACTURING THE SAME 有权
标题翻译：图像传感器装置及其制造方法
公开(公告)号：US20110298073A1
公开(公告)日：2011-12-08
申请号：US12794257
申请日：2010-06-04
申请人： Ming-Kai Liu , Tzu-Wei Huang , Jui-Hung Chang , Chia-Hui Huang , Teng-Sheng Chen
发明人： Ming-Kai Liu , Tzu-Wei Huang , Jui-Hung Chang , Chia-Hui Huang , Teng-Sheng Chen
IPC分类号： H01L31/0232 , H01L31/18
CPC分类号： H01L31/0232 , H01L27/14623 , H01L27/14627 , H01L27/14685 , H01L31/0216 , H01L31/02164 , H01L31/02165
摘要： Disclosed is a method for forming an image sensor device. First, a lens is provided, and a first sacrificial element is then formed on the lens. Subsequently, an electromagnetic interference layer is formed on the lens and the first sacrificial element, and the first sacrificial element and the electromagnetic interference layer thereon are removed to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens. A second sacrificial element is formed in the opening to cover a center region of the selected portion of the lens, while a peripheral region of the selected portion of the lens remains exposed. Next, a light-shielding layer is formed on the electromagnetic interference pattern, the second sacrificial element, and the peripheral region of the selected portion of the lens. Thereafter, the second sacrificial element and the light-shielding pattern thereon are removed to expose the center region of the selected portion of the lens as a light transmitting region.
摘要翻译：公开了一种用于形成图像传感器装置的方法。首先，提供透镜，然后在透镜上形成第一牺牲元件。随后，在透镜和第一牺牲元件上形成电磁干涉层，并且去除其上的第一牺牲元件和电磁干涉层，以形成具有暴露透镜的选定部分的开口的电磁干涉图案。第二牺牲元件形成在开口中以覆盖透镜的所选部分的中心区域，而透镜的选定部分的周边区域保持暴露。接下来，在电磁干涉图案，第二牺牲元件和透镜的选定部分的周边区域上形成遮光层。此后，去除第二牺牲元件和其上的遮光图案以将透镜的选定部分的中心区域作为透光区域。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式