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1. 发明授权

US08072067B2 Semiconductor structure 有权
标题翻译：半导体结构
公开(公告)号：US08072067B2
公开(公告)日：2011-12-06
申请号：US12436266
申请日：2009-05-06
申请人： Ming-Chung Chian , Tsan-Yao Cheng , Li-Cheng Lin , Hong-Hsiang Tsai
发明人： Ming-Chung Chian , Tsan-Yao Cheng , Li-Cheng Lin , Hong-Hsiang Tsai
IPC分类号： H01L23/48
CPC分类号： H01L23/525 , H01L23/53223 , H01L24/02 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0231 , H01L2224/0239 , H01L2224/024 , H01L2224/0401 , H01L2224/11462 , H01L2224/13024 , H01L2224/13144 , H01L2224/16225 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01044 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01327 , H01L2924/15788 , H01L2924/3651 , H01L2924/01014 , H01L2924/04941 , H01L2924/01022 , H01L2924/00014 , H01L2924/0496 , H01L2924/0498 , H01L2924/0499 , H01L2924/0494 , H01L2924/04953 , H01L2924/00
摘要： A semiconductor structure including a substrate, an insulating layer, a composite pad structure, a passivation layer, and a bump is provided. A circuit structure is disposed on the substrate. The insulating layer covers the substrate and has a first opening exposing the circuit structure. The composite pad structure includes a first conductive layer, a barrier layer, and a second conductive layer which are sequentially disposed. The composite pad structure is disposed on the insulating layer and fills the first opening to electrically connect to the circuit structure. The passivation layer covers the composite pad structure and has a second opening exposing the composite pad structure. The bump fills the second opening and electrically connects to the composite pad structure.
摘要翻译：提供了包括衬底，绝缘层，复合衬垫结构，钝化层和凸块的半导体结构。电路结构设置在基板上。绝缘层覆盖基板并且具有暴露电路结构的第一开口。复合焊盘结构包括依次布置的第一导电层，阻挡层和第二导电层。复合焊盘结构设置在绝缘层上并填充第一开口以电连接到电路结构。钝化层覆盖复合焊盘结构，并具有露出复合焊盘结构的第二开口。凸块填充第二开口并电连接到复合垫结构。

2. 发明申请

US20100283146A1 SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME 有权
标题翻译：半导体结构及其制造方法
公开(公告)号：US20100283146A1
公开(公告)日：2010-11-11
申请号：US12436266
申请日：2009-05-06
申请人： Ming-Chung Chian , Tsan-Yao Cheng , Li-Cheng Lin , Hong-Hsiang Tsai
发明人： Ming-Chung Chian , Tsan-Yao Cheng , Li-Cheng Lin , Hong-Hsiang Tsai
IPC分类号： H01L23/498 , H01L21/768
CPC分类号： H01L23/525 , H01L23/53223 , H01L24/02 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0231 , H01L2224/0239 , H01L2224/024 , H01L2224/0401 , H01L2224/11462 , H01L2224/13024 , H01L2224/13144 , H01L2224/16225 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01044 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01327 , H01L2924/15788 , H01L2924/3651 , H01L2924/01014 , H01L2924/04941 , H01L2924/01022 , H01L2924/00014 , H01L2924/0496 , H01L2924/0498 , H01L2924/0499 , H01L2924/0494 , H01L2924/04953 , H01L2924/00
摘要： A semiconductor structure including a substrate, an insulating layer, a composite pad structure, a passivation layer, and a bump is provided. A circuit structure is disposed on the substrate. The insulating layer covers the substrate and has a first opening exposing the circuit structure. The composite pad structure includes a first conductive layer, a barrier layer, and a second conductive layer which are sequentially disposed. The composite pad structure is disposed on the insulating layer and fills the first opening to electrically connect to the circuit structure. The passivation layer covers the composite pad structure and has a second opening exposing the composite pad structure. The bump fills the second opening and electrically connects to the composite pad structure.
摘要翻译：提供了包括衬底，绝缘层，复合衬垫结构，钝化层和凸块的半导体结构。电路结构设置在基板上。绝缘层覆盖基板并且具有暴露电路结构的第一开口。复合焊盘结构包括依次布置的第一导电层，阻挡层和第二导电层。复合焊盘结构设置在绝缘层上并填充第一开口以电连接到电路结构。钝化层覆盖复合焊盘结构，并具有露出复合焊盘结构的第二开口。凸块填充第二开口并电连接到复合垫结构。

3. 发明申请

US20100289075A1 SEMICONDUCTOR DEVICE HAVING INTEGRATED MOSFET AND SCHOTTKY DIODE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：具有集成MOSFET和肖特基二极管的半导体器件及其制造方法
公开(公告)号：US20100289075A1
公开(公告)日：2010-11-18
申请号：US12536504
申请日：2009-08-06
申请人： Wei-Chieh Lin , Li-Cheng Lin , Hsin-Yu Hsu , Ho-Tai Chen , Jen-Hao Yeh , Guo-Liang Yang , Chia-Hui Chen , Shih-Chieh Hung
发明人： Wei-Chieh Lin , Li-Cheng Lin , Hsin-Yu Hsu , Ho-Tai Chen , Jen-Hao Yeh , Guo-Liang Yang , Chia-Hui Chen , Shih-Chieh Hung
IPC分类号： H01L27/06 , H01L21/8234 , H01L21/336
CPC分类号： H01L27/0629 , H01L29/8725
摘要： A semiconductor device having integrated MOSFET and Schottky diode includes a substrate having a MOSFET region and a Schottky diode region defined thereon; a plurality of first trenches formed in the MOSFET region; and a plurality of second trenches formed in the Schottky diode region. The first trenches respectively including a first insulating layer formed over the sidewalls and bottom of the first trench and a first conductive layer filling the first trench serve as a trenched gate of the trench MOSFET. The second trenches respectively include a second insulating layer formed over the sidewalls and bottom of the second trench and a second conductive layer filling the second trench. A depth and a width of the second trenches are larger than that of the first trenches; and a thickness of the second insulating layer is larger than that of the first insulating layer.
摘要翻译：具有集成MOSFET和肖特基二极管的半导体器件包括其上限定有MOSFET区和肖特基二极管区的衬底; 形成在所述MOSFET区域中的多个第一沟槽; 以及形成在肖特基二极管区域中的多个第二沟槽。分别包括形成在第一沟槽的侧壁和底部上的第一绝缘层的第一沟槽和填充第一沟槽的第一导电层用作沟槽MOSFET的沟槽栅极。第二沟槽分别包括形成在第二沟槽的侧壁和底部上的第二绝缘层和填充第二沟槽的第二导电层。第二沟槽的深度和宽度大于第一沟槽的深度和宽度; 并且所述第二绝缘层的厚度大于所述第一绝缘层的厚度。

4. 发明申请

US20090175253A1 Frame format for random access response of wireless communication transmission 审中-公开
标题翻译：无线通信传输随机接入响应的帧格式
公开(公告)号：US20090175253A1
公开(公告)日：2009-07-09
申请号：US12318636
申请日：2009-01-05
申请人： Chunli Wu , Li-Cheng Lin , Chung-Shan Wang , Tsung-Liang Lu
发明人： Chunli Wu , Li-Cheng Lin , Chung-Shan Wang , Tsung-Liang Lu
IPC分类号： H04W4/00
CPC分类号： H04W99/00 , H04W74/08
摘要： A frame format for random access response of wireless communication transmission is provided. The frame format comprises a header segment and a variable length data segment. The header segment includes one or more random access response subheader and 0 to N load control subheader. The variable length data segment including one or more random access response data payload corresponding to the one or more random access response subheader. The one or more random access response subheader includes a status indication field to represent a last random access response subheader, a load control subheader, a random access response data payload with a T-CRNTI field, or a random access response data payload without a T-CRNTI field.
摘要翻译：提供了一种用于无线通信传输的随机接入响应的帧格式。帧格式包括标题段和可变长度数据段。标题段包括一个或多个随机接入响应子报头和0到N个负载控制子报头。所述可变长度数据段包括与所述一个或多个随机接入响应子报头相对应的一个或多个随机接入响应数据净荷。一个或多个随机接入响应子报头包括用于表示最后一个随机接入响应子报头的状态指示字段，负载控制子报头，具有T-CRNTI字段的随机接入响应数据有效载荷或者没有T的随机接入响应数据有效载荷 -CRNTI字段。

5. 发明授权

US08241978B2 Method of manufacturing semiconductor device having integrated MOSFET and Schottky diode 有权
标题翻译：具有集成MOSFET和肖特基二极管的半导体器件的制造方法
公开(公告)号：US08241978B2
公开(公告)日：2012-08-14
申请号：US12536504
申请日：2009-08-06
申请人： Wei-Chieh Lin , Li-Cheng Lin , Hsin-Yu Hsu , Ho-Tai Chen , Jen-Hao Yeh , Guo-Liang Yang , Chia-Hui Chen , Shih-Chieh Hung
发明人： Wei-Chieh Lin , Li-Cheng Lin , Hsin-Yu Hsu , Ho-Tai Chen , Jen-Hao Yeh , Guo-Liang Yang , Chia-Hui Chen , Shih-Chieh Hung
IPC分类号： H01L27/06 , H01L21/336
CPC分类号： H01L27/0629 , H01L29/8725
摘要： A semiconductor device having integrated MOSFET and Schottky diode includes a substrate having a MOSFET region and a Schottky diode region defined thereon; a plurality of first trenches formed in the MOSFET region; and a plurality of second trenches formed in the Schottky diode region. The first trenches respectively including a first insulating layer formed over the sidewalls and bottom of the first trench and a first conductive layer filling the first trench serve as a trenched gate of the trench MOSFET. The second trenches respectively include a second insulating layer formed over the sidewalls and bottom of the second trench and a second conductive layer filling the second trench. A depth and a width of the second trenches are larger than that of the first trenches; and a thickness of the second insulating layer is larger than that of the first insulating layer.
摘要翻译：具有集成MOSFET和肖特基二极管的半导体器件包括其上限定有MOSFET区和肖特基二极管区的衬底; 形成在所述MOSFET区域中的多个第一沟槽; 以及形成在肖特基二极管区域中的多个第二沟槽。分别包括形成在第一沟槽的侧壁和底部上的第一绝缘层的第一沟槽和填充第一沟槽的第一导电层用作沟槽MOSFET的沟槽栅极。第二沟槽分别包括形成在第二沟槽的侧壁和底部上的第二绝缘层和填充第二沟槽的第二导电层。第二沟槽的深度和宽度大于第一沟槽的深度和宽度; 并且所述第二绝缘层的厚度大于所述第一绝缘层的厚度。

6. 发明授权

US07203783B2 Electrical host system with expandable optical disk recording and playing device 有权
标题翻译：具有可扩展光盘记录和播放设备的电子主机系统
公开(公告)号：US07203783B2
公开(公告)日：2007-04-10
申请号：US10999981
申请日：2004-12-01
申请人： Li-Cheng Lin
发明人： Li-Cheng Lin
IPC分类号： G06F13/00 , G06F3/00
CPC分类号： G06F3/0607 , G06F3/0661 , G06F3/0677
摘要： An electrical host system includes a host and an expandable optical disk recording and playing device. The expandable optical disk recording and playing device includes an expanding interface module, an expanding interface, a storage interface module, an output interface module and a CODEC module. The expanding interface module connects to the expanding interface and the host. The storage interface module connects to a storage device. The CODEC module encodes, decodes or transcodes an audio/video source to generate audio/video data, wherein the audio/video source is inputted from the host through the expanding interface and the expanding interface module. The audio/video data are outputted through the output interface module, or through the storage interface module to the storage device.
摘要翻译：电主机系统包括主机和可扩展光盘记录和播放设备。可扩展光盘记录和播放装置包括扩展接口模块，扩展接口，存储接口模块，输出接口模块和CODEC模块。扩展接口模块连接到扩展接口和主机。存储接口模块连接到存储设备。 CODEC模块对音频/视频源进行编码，解码或转码以产生音频/视频数据，其中通过扩展接口和扩展接口模块从主机输入音频/视频源。音频/视频数据通过输出接口模块或存储接口模块输出到存储设备。

7. 发明申请

US20050251587A1 Expandable optical disk recording and playing system and main board thereof 审中-公开
标题翻译：可扩展光盘录音和播放系统及其主板
公开(公告)号：US20050251587A1
公开(公告)日：2005-11-10
申请号：US10998611
申请日：2004-11-30
申请人： Li-Cheng Lin , Benjamin Pan
发明人： Li-Cheng Lin , Benjamin Pan
IPC分类号： G06F13/10 , G11B33/00 , H04N5/765 , H04N5/85
CPC分类号： H04N5/765 , H04N5/85
摘要： An expandable optical disk recording and playing system and main board thereof including an input interface module; a PCI expanding interface module, which includes a PCI bus and an expanding component for connecting to a expanding interface, the expanding interface connecting to an expandable external device; a storage interface module, which is used to connect to a storage device; an output interface module; and a CODEC module, which encodes, decodes or transcodes an audio/video source to generate audio/video data, wherein the audio/video source is inputted from the input interface module, the PCI expanding interface module, or the storage interface module, and the audio/video data is outputted through the output interface module, through the PCI expanding interface module to the external device, or through the storage interface module to the storage device.
摘要翻译：一种可扩展光盘记录和播放系统及其主板，包括输入接口模块; PCI扩展接口模块，其包括PCI总线和用于连接到扩展接口的扩展组件，扩展接口连接到可扩展外部设备; 存储接口模块，用于连接到存储设备; 输出接口模块; 以及CODEC模块，其对音频/视频源进行编码，解码或转码以产生音频/视频数据，其中音频/视频源从输入接口模块，PCI扩展接口模块或存储接口模块输入，以及音频/视频数据通过输出接口模块，通过PCI扩展接口模块输出到外部设备，或通过存储接口模块输出到存储设备。

8. 发明授权

US08168480B2 Fabricating method for forming integrated structure of IGBT and diode 有权
标题翻译：形成IGBT和二极管集成结构的制造方法
公开(公告)号：US08168480B2
公开(公告)日：2012-05-01
申请号：US12563172
申请日：2009-09-21
申请人： Wei-Chieh Lin , Ho-Tai Chen , Jen-Hao Yeh , Li-Cheng Lin , Shih-Chieh Hung
发明人： Wei-Chieh Lin , Ho-Tai Chen , Jen-Hao Yeh , Li-Cheng Lin , Shih-Chieh Hung
IPC分类号： H01L21/332
CPC分类号： H01L29/7395 , H01L29/0834 , H01L29/66333
摘要： An integrated structure of an IGBT and a diode includes a plurality of doped cathode regions, and a method of forming the same is provided. The doped cathode regions are stacked in a semiconductor substrate, overlapping and contacting with each other. As compared with other doped cathode regions, the higher a doped cathode region is disposed, the larger implantation area the doped cathode region has. The doped cathode regions and the semiconductor substrate have different conductive types, and are applied as a cathode of the diode and a collector of the IGBT. The stacked doped cathode regions can increase the thinness of the cathode, and prevent the wafer from being overly thinned and broken.
摘要翻译： IGBT和二极管的集成结构包括多个掺杂的阴极区域，并且提供其形成方法。掺杂阴极区域堆叠在半导体衬底中，彼此重叠并接触。与其他掺杂阴极区域相比，掺杂阴极区域越高，掺杂阴极区域的注入面积越大。掺杂阴极区域和半导体衬底具有不同的导电类型，并且被施加作为二极管的阴极和IGBT的集电极。堆叠的掺杂阴极区域可以增加阴极的薄度，并且防止晶片过度变薄和破裂。

9. 发明申请

US20100301386A1 INTEGRATED STRUCTURE OF IGBT AND DIODE AND METHOD OF FORMING THE SAME 有权
标题翻译： IGBT和二极管的集成结构及其形成方法
公开(公告)号：US20100301386A1
公开(公告)日：2010-12-02
申请号：US12563172
申请日：2009-09-21
申请人： Wei-Chieh Lin , Ho-Tai Chen , Jen-Hao Yeh , Li-Cheng Lin , Shih-Chieh Hung
发明人： Wei-Chieh Lin , Ho-Tai Chen , Jen-Hao Yeh , Li-Cheng Lin , Shih-Chieh Hung
IPC分类号： H01L27/06 , H01L21/77
CPC分类号： H01L29/7395 , H01L29/0834 , H01L29/66333
摘要： An integrated structure of an IGBT and a diode includes a plurality of doped cathode regions, and a method of forming the same is provided. The doped cathode regions are stacked in a semiconductor substrate, overlapping and contacting with each other. As compared with other doped cathode regions, the higher a doped cathode region is disposed, the larger implantation area the doped cathode region has. The doped cathode regions and the semiconductor substrate have different conductive types, and are applied as a cathode of the diode and a collector of the IGBT. The stacked doped cathode regions can increase the thinness of the cathode, and prevent the wafer from being overly thinned and broken.
摘要翻译： IGBT和二极管的集成结构包括多个掺杂的阴极区域，并且提供其形成方法。掺杂阴极区域堆叠在半导体衬底中，彼此重叠并接触。与其他掺杂阴极区域相比，掺杂阴极区域越高，掺杂阴极区域的注入面积越大。掺杂阴极区域和半导体衬底具有不同的导电类型，并且被施加作为二极管的阴极和IGBT的集电极。堆叠的掺杂阴极区域可以增加阴极的薄度，并且防止晶片过度变薄和破裂。

10. 发明申请

US20100258853A1 TRENCH SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME 有权
标题翻译： TRENCH SEMICONDUCTOR DEVICE及其制造方法
公开(公告)号：US20100258853A1
公开(公告)日：2010-10-14
申请号：US12477121
申请日：2009-06-02
申请人： Wei-Chieh Lin , Li-Cheng Lin
发明人： Wei-Chieh Lin , Li-Cheng Lin
IPC分类号： H01L29/78 , H01L29/772 , H01L21/336
CPC分类号： H01L29/7813 , H01L27/0255 , H01L29/0692 , H01L29/0696 , H01L29/66734 , H01L29/7808 , H01L29/866
摘要： A trench semiconductor device and a method of making the same are provided. The trench semiconductor device includes a trench MOS device and a trench ESD protection device. The trench ESD protection device is electrically connected between the gate electrode and source electrode of the trench MOS device so as to provide ESD protection. The fabrication of the ESD protection device is integrated into the process of the trench MOS device, and therefore no extra mask is required to define the doped regions of the trench ESD protection device. Consequently, the trench semiconductor device is advantageous for its simplified manufacturing process and low cost.
摘要翻译：提供了沟槽半导体器件及其制造方法。沟槽半导体器件包括沟槽MOS器件和沟槽ESD保护器件。沟槽ESD保护器件电连接在沟槽MOS器件的栅电极和源电极之间，以提供ESD保护。 ESD保护器件的制造集成到沟槽MOS器件的工艺中，因此不需要额外的掩模来限定沟槽ESD保护器件的掺杂区域。因此，沟槽半导体器件有利于其简化的制造工艺和低成本。

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